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Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them.
Scope of the Report:
The global Wafer Level Packaging Technologies market is valued at xx million USD in 2018 and is expected to reach xx million USD by the end of 2024, growing at a CAGR of xx% between 2019 and 2024.
The Asia-Pacific will occupy for more market share in following years, especially in China, also fast growing India and Southeast Asia regions.
North America, especially The United States, will still play an important role which cannot be ignored. Any changes from United States might affect the development trend of Wafer Level Packaging Technologies.
Europe also play important roles in global market, with market size of xx million USD in 2019 and will be xx million USD in 2024, with a CAGR of xx%.
This report studies the Wafer Level Packaging Technologies market status and outlook of Global and major regions, from angles of players, countries, product types and end industries; this report analyzes the top players in global market, and splits the Wafer Level Packaging Technologies market by product type and applications/end industries.
Market Segment by Companies, this report covers
- Samsung Electro-Mechanics
- TSMC
- Amkor Technology
- Orbotech
- Advanced Semiconductor Engineering
- Deca Technologies
- STATS ChipPAC
- Nepes
Market Segment by Regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
- Fan-In Wafer-Level Packaging
- Fan-Out Wafer-Level Packaging
Market Segment by Applications, can be divided into
- CMOS Image Sensor
- Wireless Connectivity
- Logic and Memory IC
- MEMS and Sensor
- Analog and Mixed IC
- Others