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Semiconductor inspection equipment refers to the machines and systems used for the inspection of products during the process of semiconductor production to find out defects; the equipment is also used for R&D purposes.
Scope of the Report:
This report focuses on the Semiconductor Inspection Equipment in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
The market of semiconductor inspection equipment is affected by the semiconductor market development situation. Over the past decades, there has been an increasing demand for the application of semiconductor ICs in segments such as consumer electronics, automobiles, and industrial sector that is prompting the vendors to raise its production, which will increase the demand for semiconductor inspection equipment.
The semiconductor inspection equipment market is quite concentrated, with the top three vendors KLA-Tencor, Hitachi High-Technologies and Applied Materials dominate more than 60% of the industry total revenue. But the market competition is also quite fierce, as there are more than ten smaller enterprises competing in the market.
Wafer inspection is the largest application of semiconductor inspection equipment, which holds more than 70% of the industry total value. Package and chip inspection are also important application of semiconductor inspection equipment.
Although sales of semiconductor inspection equipment may bring a lot of opportunities; for the new entrants with only advantage in capital but without sufficient support in technology and downstream channels, the research group did not recommend taking risk to enter this market.
The worldwide market for Semiconductor Inspection Equipment is expected to grow at a CAGR of roughly 7.9% over the next five years, will reach 5300 million US$ in 2023, from 3360 million US$ in 2017, according to a new GIR (Global Info Research) study.
Market Segment by Manufacturers, this report covers
- Hitachi High-Technologies
- Applied Materials
- Rudolph Technologies
- Hermes Microvision
- Ueno Seiki
- SCREEN Semiconductor Solutions
- Nikon Metrology
- Toray Engineering
Market Segment by Regions, regional analysis covers
- North America (United States, Canada and Mexico)
- Europe (Germany, France, UK, Russia and Italy)
- Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
- South America (Brazil, Argentina, Colombia etc.)
- Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
- Optical Inspection Equipment
- E-Beam Inspection Equipment
Market Segment by Applications, can be divided into
- Wafer Inspection
- Package Inspection
- Chip Inspection
There are 15 Chapters to deeply display the global Semiconductor Inspection Equipment market.
Chapter 1, to describe Semiconductor Inspection Equipment Introduction, product scope, market overview, market opportunities, market risk, market driving force;
Chapter 2, to analyze the top manufacturers of Semiconductor Inspection Equipment, with sales, revenue, and price of Semiconductor Inspection Equipment, in 2016 and 2017;
Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2016 and 2017;
Chapter 4, to show the global market by regions, with sales, revenue and market share of Semiconductor Inspection Equipment, for each region, from 2013 to 2018;
Chapter 5, 6, 7, 8 and 9, to analyze the market by countries, by type, by application and by manufacturers, with sales, revenue and market share by key countries in these regions;
Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2013 to 2018;
Chapter 12, Semiconductor Inspection Equipment market forecast, by regions, type and application, with sales and revenue, from 2018 to 2023;
Chapter 13, 14 and 15, to describe Semiconductor Inspection Equipment sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source