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According to our (Global Info Research) latest study, the global Solder Paste market size was valued at USD 1288.1 million in 2023 and is forecast to a readjusted size of USD 1501.2 million by 2030 with a CAGR of 2.2% during review period.
Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Solder paste is a suspension of solder particles in a solder flux, which is widely used in the electronic assembly materials.
Global key players of solder paste include MacDermid Alpha Electronics Solutions, Senju Metal Industry, Harima Chemicals, Heraeus, Tongfang Tech, etc. The top five players hold a share about 46%. China is the largest producer, has a share about 47%, followed by Southeast Asia and North America, with share 13% and 10%, respectively. The largest market is Asia-Pacific, with a share about 90%, followed by North America and Europe, both have a share about 3 percent.
The Global Info Research report includes an overview of the development of the Solder Paste industry chain, the market status of SMT Assembly (Rosin Based Pastes, Water Soluble Pastes), Semiconductor Packaging (Rosin Based Pastes, Water Soluble Pastes), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Solder Paste.
Regionally, the report analyzes the Solder Paste markets in key regions. North America and Europe are experiencing steady growth, driven by government initiatives and increasing consumer awareness. Asia-Pacific, particularly China, leads the global Solder Paste market, with robust domestic demand, supportive policies, and a strong manufacturing base.
Key Features:
The report presents comprehensive understanding of the Solder Paste market. It provides a holistic view of the industry, as well as detailed insights into individual components and stakeholders. The report analysis market dynamics, trends, challenges, and opportunities within the Solder Paste industry.
The report involves analyzing the market at a macro level:
Market Sizing and Segmentation: Report collect data on the overall market size, including the sales quantity (MT), revenue generated, and market share of different by Type (e.g., Rosin Based Pastes, Water Soluble Pastes).
Industry Analysis: Report analyse the broader industry trends, such as government policies and regulations, technological advancements, consumer preferences, and market dynamics. This analysis helps in understanding the key drivers and challenges influencing the Solder Paste market.
Regional Analysis: The report involves examining the Solder Paste market at a regional or national level. Report analyses regional factors such as government incentives, infrastructure development, economic conditions, and consumer behaviour to identify variations and opportunities within different markets.
Market Projections: Report covers the gathered data and analysis to make future projections and forecasts for the Solder Paste market. This may include estimating market growth rates, predicting market demand, and identifying emerging trends.
The report also involves a more granular approach to Solder Paste:
Company Analysis: Report covers individual Solder Paste manufacturers, suppliers, and other relevant industry players. This analysis includes studying their financial performance, market positioning, product portfolios, partnerships, and strategies.
Consumer Analysis: Report covers data on consumer behaviour, preferences, and attitudes towards Solder Paste This may involve surveys, interviews, and analysis of consumer reviews and feedback from different by Application (SMT Assembly, Semiconductor Packaging).
Technology Analysis: Report covers specific technologies relevant to Solder Paste. It assesses the current state, advancements, and potential future developments in Solder Paste areas.
Competitive Landscape: By analyzing individual companies, suppliers, and consumers, the report present insights into the competitive landscape of the Solder Paste market. This analysis helps understand market share, competitive advantages, and potential areas for differentiation among industry players.
Market Validation: The report involves validating findings and projections through primary research, such as surveys, interviews, and focus groups.
Market Segmentation
Solder Paste market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value.
Market segment by Type
- Rosin Based Pastes
- Water Soluble Pastes
- No-clean Pastes
Market segment by Application
- SMT Assembly
- Semiconductor Packaging
Major players covered
- MacDermid Alpha Electronics Solutions
- Senju Metal Industry
- Harima Chemicals
- Heraeus
- Tongfang Tech
- AIM
- Shenzhen Vital New Material
- Indium
- Tamura
- Shengmao
- KOKI
- Inventec Performance Chemicals
- Nihon Superior
- Shenzhen Chenri Technology
- DS HiMetal
- Yashida
- Yong An
Market segment by region, regional analysis covers
- North America (United States, Canada and Mexico)
- Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
- Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
- South America (Brazil, Argentina, Colombia, and Rest of South America)
- Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Solder Paste product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Solder Paste, with price, sales, revenue and global market share of Solder Paste from 2019 to 2024.
Chapter 3, the Solder Paste competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Solder Paste breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2019 to 2030.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2019 to 2030.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2023.and Solder Paste market forecast, by regions, type and application, with sales and revenue, from 2025 to 2030.
Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Solder Paste.
Chapter 14 and 15, to describe Solder Paste sales channel, distributors, customers, research findings and conclusion.