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Description
Polyimide (PI), a polymer of imide monomers, has been in mass production since 1955. Renowned for its exceptional heat resistance, polyimides find diverse applications in industries that demand rugged organic materials capable of withstanding high temperatures. Notably, polyimide film stands out for its unparalleled thermal properties, boasting a lack of melting point and the ability to function across an extensive temperature range from -269°C to 350°C. This remarkable attribute positions polyimide films as the top choice for applications requiring robust thermal performance.
In addition to its exceptional thermal properties, polyimide films exhibit outstanding mechanical, electrical, temperature, and chemical resistance, making them optimal for a wide array of industries, including aerospace, automotive, electrical, and electronic sectors. The aerospace industry, in particular, leverages polyimide films extensively due to their high heat resistance, electrical insulation capabilities, and exceptional strength. These films play a crucial role in wire insulation and are utilized in electric motors operating in harsh temperature environments, where effective heat and electricity management are paramount concerns.
The global polyimide film market is poised for substantial growth, with a projected compound annual growth rate (CAGR) of over 6.6% and an incremental growth of USD 0.7 billion during the forecast period spanning 2023 to 2029. This growth trajectory is attributed to the escalating demand for consumer electronics, including modern computers, LEDs, mobile devices, and other electronic gadgets. The proliferation of these electronics is expected to be a key driver for the polyimide films industry, as these films are integral components in the production of electronic devices, providing essential thermal and electrical insulation.
Market Segmentation
This industry report offers market estimates and forecasts of the global market, followed by a detailed analysis of the product type, application, end user, and region.
Product type: thermoplastic PI, thermoset PI
Application: flexible printed circuit, motor and generator, pressure sensitive tape, specialty fabricated product, wire and cable
End user: aerospace, automotive, electrical and electronics, labelling, others
Region: Asia-Pacific, Europe, North America, Middle East and Africa (MEA), South America
Examining product applications, flexible printed circuits (FPCs) accounted for the largest share of over 46.3% in the polyimide films market in 2022. This segment is poised to grow at the fastest pace over the forecast period as well, fueled by surging electronics and automobile electrification trends that boost FPC uptake.
Polyimide film provides the ideal substrate for manufacturing flexible printed circuit boards and connectors. Its key advantages include heat resistance, chemical stability and mechanical strength to withstand bending. As devices get more compact, flexible circuits enable configuration into tight spaces where rigid boards would prove unviable. FPCs are thus increasingly adopted across smartphones, wearables, medical equipment, automotive dashboards and industrial electronics.
Moreover, continuous technology advances allow fabricating more complex flexible circuits at higher densities to accommodate intricate component layouts. The rising need for miniaturization and reliability in consumer and industrial devices will thereby drive polyimide demand from the thriving flexible circuits industry.
In terms of regional markets, Asia Pacific held the dominant 46.8% industry share in 2022, followed by Europe and North America. Asia Pacific will maintain market leadership over the coming years fueled by high concentration of device manufacturing coupled with a booming automotive sector.
Within Asia Pacific, China and South Korea present major opportunities as manufacturing hubs for electronics and electric vehicles where polyimide films find extensive application. Europe and North America also represent mature markets focused on cutting-edge niche applications in aerospace, healthcare and renewables where performance requirements for polyimide films remain stringent.
Major Companies and Competitive Landscape
The report also provides a detailed analysis of several leading polyimide film market vendors that include Arakawa Chemical Industries, Ltd., Compagnie de Saint-Gobain S.A., DuPont de Nemours, Inc., FLEXcon Company, Inc., Guilin Electrical Equipment Scientific Research Institute Co., Ltd. (GLESI), I.S.T Corporation, Jiangyin Yunda Electronics New Material Co., Ltd., Kaneka Corporation, Liyang Huajing Electronic Material Co., Ltd., PI Advanced Materials Co., Ltd., Shandong Wanda Micro-electronic Material Co., Ltd., Shenzhen Rayitek Hi-tech Film Co., Ltd., Suzhou Kying Industrial Materials Co., Ltd., Taimide Tech. Inc., Toyobo Co., Ltd., UBE Corporation, Wuxi Goto New Material Co., Ltd., among others. In this report, key players and their strategies are thoroughly analyzed to understand the competitive outlook of the market.
Scope of the Report
To analyze and forecast the market size of the global polyimide film market.
To classify and forecast the global polyimide film market based on product type, application, end user, region.
To identify drivers and challenges for the global polyimide film market.
To examine competitive developments such as mergers & acquisitions, agreements, collaborations and partnerships, etc., in the global polyimide film market.
To identify and analyze the profile of leading players operating in the global polyimide film market.
Why Choose This Report
Gain a reliable outlook of the global polyimide film market forecasts from 2023 to 2029 across scenarios.
Identify growth segments for investment.
Stay ahead of competitors through company profiles and market data.
The market estimate for ease of analysis across scenarios in Excel format.
Strategy consulting and research support for three months.
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