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This report studies the Underfill market, Underfill is used to fill space beneath a die and adhere to its carrier. They add structural strength, increase impact resistance, bolster thermal cycling resistance and improve overall reliability. Underfill can be found in a wide variety of applications including mobile phone, game console, computor, tablet PC and digital camera.
Scope of the Report:
The competition in the underfill industry is intense. There are thousands of manufacturers in this industry. Major manufacturers include Henkel, WON CHEMICAL, Namics, SUNSTAR, Hitachi Chemical, Fuji, Shin-Etsu Chemical, Bondline, AIM Solder, Zymet, Panacol-Elosol, Master Bond etc. The competition status wouldn't change in the short term. The growth of underfill industry depends on the growth of household appliances, computers and consumer electronics.
In China, the high-end underfill products mainly rely on import from foreign developed countries, like US, Germany, Japan. To meet the large demand for the high-end products, Chinese manufacturers will invest much more on the R&D, which will certainly weaken the dependence of imports.
The worldwide market for Underfill is expected to grow at a CAGR of roughly 3.4% over the next five years, will reach 470 million US$ in 2024, from 380 million US$ in 2019, according to a new GIR (Global Info Research) study.
This report focuses on the Underfill in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
Market Segment by Manufacturers, this report covers
- Henkel
- WON CHEMICAL
- NAMICS
- SUNSTAR
- Hitachi Chemical
- Fuji
- Shin-Etsu Chemical
- Bondline
- AIM Solder
- Zymet
- Panacol-Elosol
- Master Bond
- DOVER
- Darbond
- HIGHTITE
- U-bond
Market Segment by Regions, regional analysis covers
- North America (United States, Canada and Mexico)
- Europe (Germany, France, UK, Russia and Italy)
- Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
- South America (Brazil, Argentina, Colombia etc.)
- Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
- Semiconductor Underfills
- Board Level Underfills
Market Segment by Applications, can be divided into
- Industrial Electronics
- Defense & Aerospace Electronics
- Consumer Electronics
- Automotive Electronics
- Medical Electronics
- Others
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Underfill product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Underfill, with price, sales, revenue and global market share of Underfill in 2017 and 2018.
Chapter 3, the Underfill competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Underfill breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2014 to 2019.
Chapter 5, 6, 7, 8 and 9, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2014 to 2019.
Chapter 10 and 11, to segment the sales by type and application, with sales market share and growth rate by type, application, from 2014 to 2019.
Chapter 12, Underfill market forecast, by regions, type and application, with sales and revenue, from 2019 to 2024.
Chapter 13, 14 and 15, to describe Underfill sales channel, distributors, customers, research findings and conclusion, appendix and data source.