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Electronic Potting and Encapsulation delivers a thicker and more robust solution versus conformal coating to protect electronic assemblies from harsher environments to keep them functioning properly for longer lengths of time, and/or to keep them protected from security threats. Electronic Potting and Encapsulation also create a barrier against moisture, dust, fungus and corrosion. These processes also enhance circuit reliability by eliminating leakage from high voltage circuits.
Scope of the Report:
At present, in the foreign industrial developed countries the Electronic Potting & Encapsulating industry is generally at a more advanced level, the world's large enterprises are mainly concentrated in the Europe and USA. Meanwhile, foreign companies have more mature equipment, strong R & D capability, and the technical level is also in a leading position. But in foreign companies the manufacturing cost is relatively high, compared with in China. So the manufacturing cost in developed countries is a disadvantage. As the production technology of Electronic Potting & Encapsulating manufacturers in China continues to improve, the share of Chinese manufactures will be increasing, and the competitiveness in the international market will also gradually increase.
Currently China has become international Electronic Potting & Encapsulating large consumption country, but the production technology is relatively laggard, the manufacturers can only produce some low-end product, although after 2010 the new production lines is expanding, the technology is still relying on import.
The Electronic Potting & Encapsulating is mainly used in the electronics industry. As the electronics industry develops, there is a growing demand to increase the package performance. Along with this, performance and quality requirements for Electronic Potting & Encapsulatings have become more demanding.
The worldwide market for Electronic Potting & Encapsulating is expected to grow at a CAGR of roughly 11.1% over the next five years, will reach 2200 million US$ in 2024, from 1170 million US$ in 2019, according to a new GIR (Global Info Research) study.
This report focuses on the Electronic Potting & Encapsulating in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
Market Segment by Manufacturers, this report covers
- Henkel
- Dow Corning
- Hitachi Chemical
- LORD Corporation
- Huntsman Corporation
- ITW Engineered Polymers
- 3M
- H.B. Fuller
- John C. Dolph
- Master Bond
- ACC Silicones
- Epic Resins
- Plasma Ruggedized Solutions
Market Segment by Regions, regional analysis covers
- North America (United States, Canada and Mexico)
- Europe (Germany, France, UK, Russia and Italy)
- Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
- South America (Brazil, Argentina, Colombia etc.)
- Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
- Silicones
- Epoxy
- Polyurethane
- Others
Market Segment by Applications, can be divided into
- Consumer Electronics
- Automotive
- Medical
- Telecommunications
- Others
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Electronic Potting & Encapsulating product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Electronic Potting & Encapsulating, with price, sales, revenue and global market share of Electronic Potting & Encapsulating in 2017 and 2018.
Chapter 3, the Electronic Potting & Encapsulating competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Electronic Potting & Encapsulating breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2014 to 2019.
Chapter 5, 6, 7, 8 and 9, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2014 to 2019.
Chapter 10 and 11, to segment the sales by type and application, with sales market share and growth rate by type, application, from 2014 to 2019.
Chapter 12, Electronic Potting & Encapsulating market forecast, by regions, type and application, with sales and revenue, from 2019 to 2024.
Chapter 13, 14 and 15, to describe Electronic Potting & Encapsulating sales channel, distributors, customers, research findings and conclusion, appendix and data source.