Summary
World trade was already slowing in 2019 before COVID 19 outbreak, weighed down by trade tensions and slowing economic growth, such as uncertainty generated from Brexit, the U.S.-China trade war, the Japan-South Korea trade war.
Trade is expected to fall by between 13% and 32% in 2020 as the COVID 19 pandemic disrupts normal economic activity and life around the world, according to the study of WTO.The decline in exports has been mainly due to the ongoing global slowdown, which got aggravated due to the current Covid-19 crisis. The latter resulted in large scale disruptions in supply chains and demand resulting in cancellation of orders.
XYZResearch's analysis shows that as China started reopening its economy, world exports initially recovered across the board. But estimates of the expected recovery in 2021 are uncertain, with outcomes depending largely on the duration of the outbreak and the effectiveness of the policy responses.
This research report indicated that the global Thin Wafer Processing and Dicing Equipments market was valued at USD XXX million in 2019, and it is expected to reach a value of USD XXX million by 2026, at a CAGR of XX % over the forecast period 2021-2026. In terms of the export, China occupied more than XX % export market share in 2019, India occupied XX %. XXX is the second largest region around the world, it occupied about XX % export market share in 2019. In terms of the Local Capacity, XXX is the largest region around the world, it occupied about XX % export market share in 2019.
Regional Segmentation (Value; Revenue, USD Million, 2015 - 2026) of Thin Wafer Processing and Dicing Equipments Market by XYZResearch Include
- China
- EU
- North America
- Japan
- India
- Southeast Asia
- South America
- Middle East and Africa
Competitive Analysis; Who are the Major Players in Thin Wafer Processing and Dicing Equipments Market?
- EV Group
- Lam Research Corporation
- DISCO Corporation
- Plasma-Therm
- Tokyo Electron Ltd
- Advanced Dicing Technologies
- SPTS Technologies
- Suzhou Delphi Laser
- Panasonic
- Tokyo Seimitsu
Major Type of Thin Wafer Processing and Dicing Equipments Covered in XYZResearch report:
- Blade Dicing Equipments
- Laser Dicing Equipments
- Plasma Dicing Equipments
Application Segments Covered in XYZResearch Market
- MEMS
- RFID
- CMOS Image Sensor
- Others
For any other requirements, please feel free to contact us and we will provide you customized report.
(Post-pandemic Era) - Global Thin Wafer Processing and Dicing Equipments Market 2015-2026, With Breakdown Data of Capacity, Sales, Production, Export, Import, Revenue, Price, Cost and Gross Margin
Table of Contents
Global Thin Wafer Processing and Dicing Equipments Market 2015-2026, With Breakdown Data of Capacity, Sales, Production, Export, Import, Revenue, Price, Cost and Gross Margin
1 Market Scope
1.1 Product Details and Introduction
1.1.1 Blade Dicing Equipments -Product Introduction and Major Manufacturers
1.1.2 Laser Dicing Equipments -Product Introduction and Major Manufacturers
1.1.3 Plasma Dicing Equipments -Product Introduction and Major Manufacturers
1.2 Market Snapshot
1.2.1 Major Companies Overview
1.2.2 Market Concentration
1.2.3 Six-Year Compound Annual Growth Rate (CAGR)
2 Regional Market Analysis
2.1 China Thin Wafer Processing and Dicing Equipments Status and Prospect (2015-2026)
2.1.1 China Thin Wafer Processing and Dicing Equipments Market Size and Growth Rate (2015-2026)
2.1.2 China Thin Wafer Processing and Dicing Equipments Local Capacity, Import, Export, Local Consumption Analysis (2015-2020)
2.2 EU Thin Wafer Processing and Dicing Equipments Status and Prospect (2015-2026)
2.2.1 EU Thin Wafer Processing and Dicing Equipments Market Size and Growth Rate (2015-2026)
2.2.2 EU Thin Wafer Processing and Dicing Equipments Local Capacity, Import, Export, Local Consumption Analysis (2015-2020)
2.3 USA Thin Wafer Processing and Dicing Equipments Status and Prospect (2015-2026)
2.3.1 USA Thin Wafer Processing and Dicing Equipments Market Size and Growth Rate (2015-2026)
2.3.2 USA Thin Wafer Processing and Dicing Equipments Local Capacity, Import, Export, Local Consumption Analysis (2015-2020)
2.4 Japan Thin Wafer Processing and Dicing Equipments Status and Prospect (2015-2026)
2.4.1 Japan Thin Wafer Processing and Dicing Equipments Market Size and Growth Rate (2015-2026)
2.4.2 Japan Thin Wafer Processing and Dicing Equipments Local Capacity, Import, Export, Local Consumption Analysis (2015-2020)
2.5 India Thin Wafer Processing and Dicing Equipments Status and Prospect (2015-2026)
2.5.1 India Thin Wafer Processing and Dicing Equipments Market Size and Growth Rate (2015-2026)
2.5.2 India Thin Wafer Processing and Dicing Equipments Local Capacity, Import, Export, Local Consumption Analysis (2015-2020)
2.6 Southeast Asia Thin Wafer Processing and Dicing Equipments Status and Prospect (2015-2026)
2.6.1 Southeast Asia Thin Wafer Processing and Dicing Equipments Market Size and Growth Rate (2015-2026)
2.6.2 Southeast Asia Thin Wafer Processing and Dicing Equipments Local Capacity, Import, Export, Local Consumption Analysis (2015-2020)
2.7 South America Thin Wafer Processing and Dicing Equipments Status and Prospect (2015-2026)
2.7.1 South America Thin Wafer Processing and Dicing Equipments Market Size and Growth Rate (2015-2026)
2.7.2 South America Thin Wafer Processing and Dicing Equipments Local Capacity, Import, Export, Local Consumption Analysis (2015-2020)
2.8 Thin Wafer Processing and Dicing Equipments Status and Prospect (2015-2026)
2.8.1 Thin Wafer Processing and Dicing Equipments Market Size and Growth Rate (2015-2026)
2.8.2 Thin Wafer Processing and Dicing Equipments Local Capacity, Import, Export, Local Consumption Analysis (2015-2020)
3 Global Thin Wafer Processing and Dicing Equipments Market Assessment by Segment
3.1 Global Thin Wafer Processing and Dicing Equipments Capacity and Growth Rate
3.2 Global Thin Wafer Processing and Dicing Equipments Sales by Type
3.3 Global Thin Wafer Processing and Dicing Equipments Sales Revenue by Type
3.4 Global Thin Wafer Processing and Dicing Equipments Consumption by Application
4 Global Thin Wafer Processing and Dicing Equipments Market Assessment by Regions
4.1 Global Thin Wafer Processing and Dicing Equipments Production Analysis and Forecast by Regions (2015-2026)
4.2 Global Thin Wafer Processing and Dicing Equipments Sales Analysis and Forecast by Regions (2015-2026)
4.3 Global Thin Wafer Processing and Dicing Equipments Sales Revenue Analysis and Forecast by Regions (2015-2026)
5 Value Chain (Impact of COVID-19)
5.1 Thin Wafer Processing and Dicing Equipments Value Chain Analysis
5.1.1 Upstream
5.1.2 Downstream
5.2 COVID-19 Impact on Thin Wafer Processing and Dicing Equipments Industry
5.2.1 Industrial Policy Issued Under the Epidemic Situation
5.3 Cost-Under the Epidemic Situation
5.3.1 Cost of Raw Material
5.4 Channel Analysis
5.4.1 Distribution Channel-Under the Epidemic Situation
5.4.2 Distributors
6 Competitive Landscape
6.1 Global Thin Wafer Processing and Dicing Equipments Capacity Market Share of Manufacturers (2019-2020)
6.2 Global Thin Wafer Processing and Dicing Equipments Sales Market Share of Manufacturers (2019-2020)
6.3 Global Thin Wafer Processing and Dicing Equipments Sales Revenue Market Share of Manufacturers (2019-2020)
7 Thin Wafer Processing and Dicing Equipments Competitive Analysis
7.1 EV Group
7.1.1 EV Group Company Profiles
7.1.2 EV Group Product Introduction
7.1.3 EV Group Thin Wafer Processing and Dicing Equipments Production, Revenue (2015-2020)
7.1.4 SWOT Analysis
7.2 Lam Research Corporation
7.2.1 Lam Research Corporation Company Profiles
7.2.2 Lam Research Corporation Product Introduction
7.2.3 Lam Research Corporation Thin Wafer Processing and Dicing Equipments Production, Revenue (2015-2020)
7.2.4 SWOT Analysis
7.3 DISCO Corporation
7.3.1 DISCO Corporation Company Profiles
7.3.2 DISCO Corporation Product Introduction
7.3.3 DISCO Corporation Thin Wafer Processing and Dicing Equipments Production, Revenue (2015-2020)
7.3.4 SWOT Analysis
7.4 Plasma-Therm
7.4.1 Plasma-Therm Company Profiles
7.4.2 Plasma-Therm Product Introduction
7.4.3 Plasma-Therm Thin Wafer Processing and Dicing Equipments Production, Revenue (2015-2020)
7.4.4 SWOT Analysis
7.5 Tokyo Electron Ltd
7.5.1 Tokyo Electron Ltd Company Profiles
7.5.2 Tokyo Electron Ltd Product Introduction
7.5.3 Tokyo Electron Ltd Thin Wafer Processing and Dicing Equipments Production, Revenue (2015-2020)
7.5.4 SWOT Analysis
7.6 Advanced Dicing Technologies
7.6.1 Advanced Dicing Technologies Company Profiles
7.6.2 Advanced Dicing Technologies Product Introduction
7.6.3 Advanced Dicing Technologies Thin Wafer Processing and Dicing Equipments Production, Revenue (2015-2020)
7.6.4 SWOT Analysis
7.7 SPTS Technologies
7.7.1 SPTS Technologies Company Profiles
7.7.2 SPTS Technologies Product Introduction
7.7.3 SPTS Technologies Thin Wafer Processing and Dicing Equipments Production, Revenue (2015-2020)
7.7.4 SWOT Analysis
7.8 Suzhou Delphi Laser
7.8.1 Suzhou Delphi Laser Company Profiles
7.8.2 Suzhou Delphi Laser Product Introduction
7.8.3 Suzhou Delphi Laser Thin Wafer Processing and Dicing Equipments Production, Revenue (2015-2020)
7.8.4 SWOT Analysis
7.9 Panasonic
7.9.1 Panasonic Company Profiles
7.9.2 Panasonic Product Introduction
7.9.3 Panasonic Thin Wafer Processing and Dicing Equipments Production, Revenue (2015-2020)
7.9.4 SWOT Analysis
7.10 Tokyo Seimitsu
7.10.1 Tokyo Seimitsu Company Profiles
7.10.2 Tokyo Seimitsu Product Introduction
7.10.3 Tokyo Seimitsu Thin Wafer Processing and Dicing Equipments Production, Revenue (2015-2020)
7.10.4 SWOT Analysis
8 Conclusion
List of Tables and Figures
Figure Product Introduction
Table Production (K Units) and Revenue (Million USD) of Major Players (2015-2020)
Figure Global Thin Wafer Processing and Dicing Equipments Production Market Share of Top 5 Players
Table CAGR of Major Market (2021-2026)
Table CAGR in Terms of Production of Each Type (2015-2026)
Table CAGR in Terms of Production of Each Application (2015-2026)
Table Global Thin Wafer Processing and Dicing Equipments Sales (K Unit) by Type (2015-2026)
Figure Global Thin Wafer Processing and Dicing Equipments Sales (K Unit) and Growth Rate (2015-2026)
Figure Global Thin Wafer Processing and Dicing Equipments Sales Market Share (%) by Type (2019 -2020)
Table Global Thin Wafer Processing and Dicing Equipments Sales Value (Million USD) by Type (2015-2026)
Figure Global Thin Wafer Processing and Dicing Equipments Sales Value (Million USD) and Growth Rate (2015-2026)
Figure Global Thin Wafer Processing and Dicing Equipments Sales Value Market Share (%) by Type (2019-2020)
Table Global Thin Wafer Processing and Dicing Equipments Sales (K Unit) by Application (2015-2026)
Figure China Thin Wafer Processing and Dicing Equipments Production Value (Million USD) and Growth Rate (2015-2026)
Table China Thin Wafer Processing and Dicing Equipments Local Capacity, Import, Export and Local Consumption (2015-2020)
Figure EU Thin Wafer Processing and Dicing Equipments Production Value (Million USD) and Growth Rate (2015-2026)
Table EU Thin Wafer Processing and Dicing Equipments Local Capacity, Import, Export and Local Consumption (2015-2020)
Figure North America Thin Wafer Processing and Dicing Equipments Production Value (Million USD) and Growth Rate (2015-2026)
Table North America Thin Wafer Processing and Dicing Equipments Local Capacity, Import, Export and Local Consumption (2015-2020)
Figure Japan Thin Wafer Processing and Dicing Equipments Production Value (Million USD) and Growth Rate (2015-2026)
Table Japan Thin Wafer Processing and Dicing Equipments Local Capacity, Import, Export and Local Consumption (2015-2020)
Figure India Thin Wafer Processing and Dicing Equipments Production Value (Million USD) and Growth Rate (2015-2026)
Table India Thin Wafer Processing and Dicing Equipments Local Capacity, Import, Export and Local Consumption (2015-2020)
Figure Southeast Asia Thin Wafer Processing and Dicing Equipments Production Value (Million USD) and Growth Rate (2015-2026)
Table Southeast Asia Thin Wafer Processing and Dicing Equipments Local Capacity, Import, Export and Local Consumption (2015-2020)
Figure South America Thin Wafer Processing and Dicing Equipments Production Value (Million USD) and Growth Rate (2015-2026)
Table South America Thin Wafer Processing and Dicing Equipments Local Capacity, Import, Export and Local Consumption (2015-2020)
Figure Middle East and Africa Thin Wafer Processing and Dicing Equipments Production Value (Million USD) and Growth Rate (2015-2026)
Table Middle East and Africa Thin Wafer Processing and Dicing Equipments Local Capacity, Import, Export and Local Consumption (2015-2020)
Table Global Thin Wafer Processing and Dicing Equipments Capacity (K Units) and Growth Rate (2015-2026)
Figure Global Thin Wafer Processing and Dicing Equipments Capacity (K Units) and Growth Rate (2015-2026)
Table Global Thin Wafer Processing and Dicing Equipments Sales (Unit) by Type (2015-2026)
Figure Global Thin Wafer Processing and Dicing Equipments Sales(Unit) and Growth Rate (2015-2026)
Table Sales Market Share (%) by Type (2019-2026)
Table Global Thin Wafer Processing and Dicing Equipments Sales Revenue (Million USD) by Type (2015-2026)
Figure Global Thin Wafer Processing and Dicing Equipments Sales Revenue (Million USD) and Growth Rate (2015-2026)
Table Sales Revenue Market Share (%) by Type (2019-2026)
Table Global Thin Wafer Processing and Dicing Equipments Consumption (Unit) by Application (2015-2026)
Figure Global Thin Wafer Processing and Dicing Equipments Consumption (Unit) and Growth Rate (2015-2026)
Table Consumption Market Share (%) by Application (2019-2026)
Table Global Thin Wafer Processing and Dicing Equipments Production (K Unite) by Regions (2015-2020)
Table Global Thin Wafer Processing and Dicing Equipments CAGR (%) in term of Production and Market Share by Regions (2015-2026)
Figure Global Thin Wafer Processing and Dicing Equipments Production Share by Regions (2019-2020)
Table Global Thin Wafer Processing and Dicing Equipments Sales (K Unite) by Regions (2015-2020)
Table Global Thin Wafer Processing and Dicing Equipments CAGR (%) in term of Sales and Market Share by Regions (2015-2026)
Figure Global Thin Wafer Processing and Dicing Equipments Sales Share by Regions (2019-2020)
Table Global Thin Wafer Processing and Dicing Equipments Sales Revenue (Million USD) by Regions (2015-2020)
Table Global Thin Wafer Processing and Dicing Equipments CAGR (%) in term of Sales Revenue and Market Share by Regions (2015-2026)
Figure Global Thin Wafer Processing and Dicing Equipments Sales Revenue Share by Regions (2019-2020)
Figure Value Chain Structure of Thin Wafer Processing and Dicing Equipments
Table Value Chain
Table Key Suppliers of Raw Material/Components
Table Key Downstream Customer in Each Application Field
Table Industry News List of Thin Wafer Processing and Dicing Equipments
Figure Cost Structure of Thin Wafer Processing and Dicing Equipments in 2020
Table Global Thin Wafer Processing and Dicing Equipments Capacity Share of Manufacturers (2019-2020)
Figure Global Thin Wafer Processing and Dicing Equipments Capacity Share of Manufacturers (2019-2020)
Table Global Thin Wafer Processing and Dicing Equipments Sales Market Share of Manufacturers (2019-2020)
Figure Global Thin Wafer Processing and Dicing Equipments Sales Market Share of Manufacturers (2019-2020)
Table Global Thin Wafer Processing and Dicing Equipments Sales Revenue Market Share of Manufacturers (2019-2020)
Figure Global Thin Wafer Processing and Dicing Equipments Sales Revenue Market Share of Manufacturers (2019-2020)
Figure Global Thin Wafer Processing and Dicing Equipments Sales Value (Million USD), Growth Rate & Market Share (2021-2026)
Table EV Group Profiles
Table EV Group Thin Wafer Processing and Dicing Equipments Product Introduction
Table EV Group Thin Wafer Processing and Dicing Equipments Capacity (K Unit), Sales (K Unit), Revenue (Million USD), Price (USD/Unit) and Gross Margin (2015-2020)
Figure EV Group SWOT Analysis
Table Lam Research Corporation Profiles
Table Lam Research Corporation Thin Wafer Processing and Dicing Equipments Product Introduction
Table Lam Research Corporation Thin Wafer Processing and Dicing Equipments Capacity (K Unit), Sales (K Unit), Revenue (Million USD), Price (USD/Unit) and Gross Margin (2015-2020)
Figure Lam Research Corporation SWOT Analysis
Table DISCO Corporation Profiles
Table DISCO Corporation Thin Wafer Processing and Dicing Equipments Product Introduction
Table DISCO Corporation Thin Wafer Processing and Dicing Equipments Capacity (K Unit), Sales (K Unit), Revenue (Million USD), Price (USD/Unit) and Gross Margin (2015-2020)
Figure DISCO Corporation SWOT Analysis
Table Plasma-Therm Profiles
Table Plasma-Therm Thin Wafer Processing and Dicing Equipments Product Introduction
Table Plasma-Therm Thin Wafer Processing and Dicing Equipments Capacity (K Unit), Sales (K Unit), Revenue (Million USD), Price (USD/Unit) and Gross Margin (2015-2020)
Figure Plasma-Therm SWOT Analysis
Table Tokyo Electron Ltd Profiles
Table Tokyo Electron Ltd Thin Wafer Processing and Dicing Equipments Product Introduction
Table Tokyo Electron Ltd Thin Wafer Processing and Dicing Equipments Capacity (K Unit), Sales (K Unit), Revenue (Million USD), Price (USD/Unit) and Gross Margin (2015-2020)
Figure Tokyo Electron Ltd SWOT Analysis
Table Advanced Dicing Technologies Profiles
Table Advanced Dicing Technologies Thin Wafer Processing and Dicing Equipments Product Introduction
Table Advanced Dicing Technologies Thin Wafer Processing and Dicing Equipments Capacity (K Unit), Sales (K Unit), Revenue (Million USD), Price (USD/Unit) and Gross Margin (2015-2020)
Figure Advanced Dicing Technologies SWOT Analysis
Table SPTS Technologies Profiles
Table SPTS Technologies Thin Wafer Processing and Dicing Equipments Product Introduction
Table SPTS Technologies Thin Wafer Processing and Dicing Equipments Capacity (K Unit), Sales (K Unit), Revenue (Million USD), Price (USD/Unit) and Gross Margin (2015-2020)
Figure SPTS Technologies SWOT Analysis
Table Suzhou Delphi Laser Profiles
Table Suzhou Delphi Laser Thin Wafer Processing and Dicing Equipments Product Introduction
Table Suzhou Delphi Laser Thin Wafer Processing and Dicing Equipments Capacity (K Unit), Sales (K Unit), Revenue (Million USD), Price (USD/Unit) and Gross Margin (2015-2020)
Figure Suzhou Delphi Laser SWOT Analysis
Table Panasonic Profiles
Table Panasonic Thin Wafer Processing and Dicing Equipments Product Introduction
Table Panasonic Thin Wafer Processing and Dicing Equipments Capacity (K Unit), Sales (K Unit), Revenue (Million USD), Price (USD/Unit) and Gross Margin (2015-2020)
Figure Panasonic SWOT Analysis
Table Tokyo Seimitsu Profiles
Table Tokyo Seimitsu Thin Wafer Processing and Dicing Equipments Product Introduction
Table Tokyo Seimitsu Thin Wafer Processing and Dicing Equipments Capacity (K Unit), Sales (K Unit), Revenue (Million USD), Price (USD/Unit) and Gross Margin (2015-2020)
Figure Tokyo Seimitsu SWOT Analysis
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