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Global Through-Silicon Vias (TSVs) Market Size, Manufacturers, Supply Chain, Sales Channel and Clients, 2022-2028

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Date: 10-Oct-2022
No. of pages: 103
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Silicon through-hole Technology (TSV) is a kind of circuit interconnection technology. It realizes interconnection between chips by making vertical conduction between chips and between wafers and between wafers. Different from the previous IC packaging bonding and dot coating stacking technology, TSV can maximize the chip stacking density in three-dimensional direction, reduce the chip size, increase the transistor density of the chip, improve the electrical interconnection performance between layers, improve the chip operation speed, and reduce the power consumption, design difficulty and cost of the chip.

Highlights

Considering the economic change due to COVID-19 and Russia-Ukraine War Influence, the global Through-Silicon Vias (TSVs) market is projected to reach US$ 7682.8 million by 2028 from an estimated US$ 2240.4 million in 2022, at a CAGR of 22.8% during 2023 and 2028.

At the regional level, Through-Silicon Vias (TSVs) products are mainly sold in North America, Europe and China, among which China accounts for about 24% of the global market in 2019.

Currently, major global suppliers include ASE Technology Holding, Amkor Technology, Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, GLOBALFOUNDRIES, JCET Group, Samsung, Tianshui Huatian Technology, etc. In 2019, These major enterprises account for more than 80% of the total share.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Through-Silicon Vias (TSVs), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyse their position in the current marketplace, and make informed business decisions regarding Through-Silicon Vias (TSVs).

The Through-Silicon Vias (TSVs) market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2021 as the base year, with history and forecast data for the period from 2017 to 2028. This report segments the global Through-Silicon Vias (TSVs) market comprehensively. Regional market sizes, concerning products by type, by application, and by players, are also provided. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Through-Silicon Vias (TSVs) companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, product type, application, and regions.

Key Companies & Market Share Insights

In this section, the readers will gain an understanding of the key players competing. This report has studied the key growth strategies, such as innovative trends and developments, intensification of product portfolio, mergers and acquisitions, collaborations, new product innovation, and geographical expansion, undertaken by these participants to maintain their presence. Apart from business strategies, the study includes current developments and key financials. The readers will also get access to the data related to global revenue by companies for the period 2017-2022. This all-inclusive report will certainly serve the clients to stay updated and make effective decisions in their businesses. Some of the prominent players reviewed in the research report include:

- ASE Technology Holding

- Amkor Technology

- Taiwan Semiconductor Manufacturing Company Limited

- Intel Corporation

- GLOBALFOUNDRIES

- JCET Group

- Samsung

- Tianshui Huatian Technology

Product Type Insights

Global markets are presented by Through-Silicon Vias (TSVs) type, along with growth forecasts through 2028. Estimates on revenue are based on the price in the supply chain at which the Through-Silicon Vias (TSVs) are procured by the companies.

This report has studied every segment and provided the market size using historical data. They have also talked about the growth opportunities that the segment may pose in the future. This study bestows revenue data by type, and during the historical period (2017-2022) and forecast period (2023-2028).

Through-Silicon Vias (TSVs) Segment by Type

- 2.5D Through-Silicon Vias

- 3D Through-Silicon Vias

Application Insights

This report has provided the market size (revenue data) by application, during the historical period (2017-2022) and forecast period (2023-2028).

This report also outlines the market trends of each segment and consumer behaviors impacting the Through-Silicon Vias (TSVs) market and what implications these may have on the industry's future. This report can help to understand the relevant market and consumer trends that are driving the Through-Silicon Vias (TSVs) market.

Through-Silicon Vias (TSVs) Segment by Application

- Mobile And Consumer Electronics

- Communication Equipment

- Automotive And Transportation Electronics

Regional Outlook

This section of the report provides key insights regarding various regions and the key players operating in each region. Economic, social, environmental, technological, and political factors have been taken into consideration while assessing the growth of the particular region/country. The readers will also get their hands on the revenue of each region and country for the period 2017-2028.

The market has been segmented into various major geographies, including North America, Europe, Asia-Pacific, South America, Middle East & Africa. Detailed analysis of major countries such as the USA, Germany, the U.K., Italy, France, China, Japan, South Korea, Southeast Asia, and India will be covered within the regional segment. For market estimates, data are going to be provided for 2021 because of the base year, with estimates for 2022 and forecast revenue for 2028.

- North America

- - United States

- - Canada

- Europe

- - Germany

- - France

- - U.K.

- - Italy

- - Russia

- - Nordic Countries

- - Benelux

- - Rest of Europe

- Asia-Pacific

- - China

- - Japan

- - South Korea

- - India

- - Southeast Asia

- - Australia

- - Rest of Asia-Pacific

- Latin America

- - Mexico

- - Brazil

- - Argentina

- - Rest of Latin America

- Middle East & Africa

- - Turkey

- - Saudi Arabia

- - UAE

- - Rest of Middle East & Africa

Key Drivers & Barriers

High-impact rendering factors and drivers have been studied in this report to aid the readers to understand the general development. Moreover, the report includes restraints and challenges that may act as stumbling blocks on the way of the players. This will assist the users to be attentive and make informed decisions related to business. Specialists have also laid their focus on the upcoming business prospects.

COVID-19 and Russia-Ukraine War Influence Analysis

The readers in the section will understand how the Through-Silicon Vias (TSVs) market scenario changed across the globe during the pandemic, post-pandemic and Russia-Ukraine War. The study is done keeping in view the changes in aspects such as demand, consumption, transportation, consumer behavior, supply chain management. The industry experts have also highlighted the key factors that will help create opportunities for players and stabilize the overall industry in the years to come.

Reasons to Buy This Report

This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Through-Silicon Vias (TSVs) market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.

This report will help stakeholders to understand the global industry status and trends of Through-Silicon Vias (TSVs) and provides them with information on key market drivers, restraints, challenges, and opportunities.

This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in value), competitor ecosystem, new product development, expansion, and acquisition.

This report stays updated with novel technology integration, features, and the latest developments in the market

This report helps stakeholders to understand the COVID-19 and Russia-Ukraine War Influence on the Through-Silicon Vias (TSVs) industry.

This report helps stakeholders to gain insights into which regions to target globally.

This report helps stakeholders to gain insights into the end-user perception concerning the adoption of Through-Silicon Vias (TSVs).

This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.

Global Through-Silicon Vias (TSVs) Market Size, Manufacturers, Supply Chain, Sales Channel and Clients, 2022-2028

Table of Contents
1 Study Coverage
1.1 Through-Silicon Vias (TSVs) Product Introduction
1.2 Market by Type
1.2.1 Global Through-Silicon Vias (TSVs) Market Size Growth Rate by Type (2017 VS 2021 VS 2028)
1.2.2 2.5D Through-Silicon Vias
1.2.3 3D Through-Silicon Vias
1.3 Market by Application
1.3.1 Global Through-Silicon Vias (TSVs) Market Size Growth Rate by Application (2017 VS 2021 VS 2028)
1.3.2 Mobile And Consumer Electronics
1.3.3 Communication Equipment
1.3.4 Automotive And Transportation Electronics
1.4 Study Objectives
1.5 Years Considered
2 Executive Summary
2.1 Global Through-Silicon Vias (TSVs) Market Size Estimates and Forecasts
2.2 Through-Silicon Vias (TSVs) Market Size by Region: 2022 Versus 2028
2.2.1 Global Through-Silicon Vias (TSVs) Revenue by Region: 2017-2022
2.2.2 Global Through-Silicon Vias (TSVs) Revenue Forecast by Region (2023-2028)
2.2.3 Global Through-Silicon Vias (TSVs) Revenue Market Share by Region (2017-2028)
3 Global Through-Silicon Vias (TSVs) by Company
3.1 Global Through-Silicon Vias (TSVs) Revenue by Company (2017-2022)
3.2 Global Through-Silicon Vias (TSVs) Revenue Share by Company (2017-2022)
3.3 Competitive Landscape
3.3.1 Key Through-Silicon Vias (TSVs) Companies around the World: Ranking by Revenue
3.3.2 Global Through-Silicon Vias (TSVs) Market Concentration Ratio (CR5 and HHI) & (2017-2022)
3.3.3 Global Through-Silicon Vias (TSVs) Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
3.4 Global Through-Silicon Vias (TSVs) Companies Headquarters & Product Type
3.4.1 Through-Silicon Vias (TSVs) Companies Headquarters
3.4.2 Global Through-Silicon Vias (TSVs) Companies Product & Service
3.4.3 Date of International Companies Enter into Through-Silicon Vias (TSVs) Market
3.5 Global Through-Silicon Vias (TSVs) Mergers & Acquisitions, Expansion Plans
4 Company Profiles
4.1 ASE Technology Holding
4.1.1 ASE Technology Holding Corporation Information
4.1.2 ASE Technology Holding Description, Business Overview
4.1.3 ASE Technology Holding Through-Silicon Vias (TSVs) Products Offered
4.1.4 ASE Technology Holding Through-Silicon Vias (TSVs) Revenue and Gross Margin (2017-2022)
4.1.5 ASE Technology Holding Through-Silicon Vias (TSVs) Revenue by Product in 2021
4.1.6 ASE Technology Holding Through-Silicon Vias (TSVs) Revenue by Application in 2021
4.1.7 ASE Technology Holding Through-Silicon Vias (TSVs) Revenue by Geographic Area in 2021
4.1.8 ASE Technology Holding Recent Developments
4.2 Amkor Technology
4.2.1 Amkor Technology Corporation Information
4.2.2 Amkor Technology Description, Business Overview
4.2.3 Amkor Technology Through-Silicon Vias (TSVs) Products Offered
4.2.4 Amkor Technology Through-Silicon Vias (TSVs) Revenue and Gross Margin (2017-2022)
4.2.5 Amkor Technology Through-Silicon Vias (TSVs) Revenue by Product in 2021
4.2.6 Amkor Technology Through-Silicon Vias (TSVs) Revenue by Application in 2021
4.2.7 Amkor Technology Through-Silicon Vias (TSVs) Revenue by Geographic Area in 2021
4.2.8 Amkor Technology Recent Developments
4.3 Taiwan Semiconductor Manufacturing Company Limited
4.3.1 Taiwan Semiconductor Manufacturing Company Limited Corporation Information
4.3.2 Taiwan Semiconductor Manufacturing Company Limited Description, Business Overview
4.3.3 Taiwan Semiconductor Manufacturing Company Limited Through-Silicon Vias (TSVs) Products Offered
4.3.4 Taiwan Semiconductor Manufacturing Company Limited Through-Silicon Vias (TSVs) Revenue and Gross Margin (2017-2022)
4.3.5 Taiwan Semiconductor Manufacturing Company Limited Through-Silicon Vias (TSVs) Revenue by Product in 2021
4.3.6 Taiwan Semiconductor Manufacturing Company Limited Through-Silicon Vias (TSVs) Revenue by Application in 2021
4.3.7 Taiwan Semiconductor Manufacturing Company Limited Through-Silicon Vias (TSVs) Revenue by Geographic Area in 2021
4.3.8 Taiwan Semiconductor Manufacturing Company Limited Recent Developments
4.4 Intel Corporation
4.4.1 Intel Corporation Corporation Information
4.4.2 Intel Corporation Description, Business Overview
4.4.3 Intel Corporation Through-Silicon Vias (TSVs) Products Offered
4.4.4 Intel Corporation Through-Silicon Vias (TSVs) Revenue and Gross Margin (2017-2022)
4.4.5 Intel Corporation Through-Silicon Vias (TSVs) Revenue by Product in 2021
4.4.6 Intel Corporation Through-Silicon Vias (TSVs) Revenue by Application in 2021
4.4.7 Intel Corporation Through-Silicon Vias (TSVs) Revenue by Geographic Area in 2021
4.4.8 Intel Corporation Recent Developments
4.5 GLOBALFOUNDRIES
4.5.1 GLOBALFOUNDRIES Corporation Information
4.5.2 GLOBALFOUNDRIES Description, Business Overview
4.5.3 GLOBALFOUNDRIES Through-Silicon Vias (TSVs) Products Offered
4.5.4 GLOBALFOUNDRIES Through-Silicon Vias (TSVs) Revenue and Gross Margin (2017-2022)
4.5.5 GLOBALFOUNDRIES Through-Silicon Vias (TSVs) Revenue by Product in 2021
4.5.6 GLOBALFOUNDRIES Through-Silicon Vias (TSVs) Revenue by Application in 2021
4.5.7 GLOBALFOUNDRIES Through-Silicon Vias (TSVs) Revenue by Geographic Area in 2021
4.5.8 GLOBALFOUNDRIES Recent Developments
4.6 JCET Group
4.6.1 JCET Group Corporation Information
4.6.2 JCET Group Description, Business Overview
4.6.3 JCET Group Through-Silicon Vias (TSVs) Products Offered
4.6.4 JCET Group Through-Silicon Vias (TSVs) Revenue and Gross Margin (2017-2022)
4.6.5 JCET Group Through-Silicon Vias (TSVs) Revenue by Product in 2021
4.6.6 JCET Group Through-Silicon Vias (TSVs) Revenue by Application in 2021
4.6.7 JCET Group Through-Silicon Vias (TSVs) Revenue by Geographic Area in 2021
4.6.8 JCET Group Recent Development
4.7 Samsung
4.7.1 Samsung Corporation Information
4.7.2 Samsung Description, Business Overview
4.7.3 Samsung Through-Silicon Vias (TSVs) Products Offered
4.7.4 Samsung Through-Silicon Vias (TSVs) Revenue and Gross Margin (2017-2022)
4.7.5 Samsung Through-Silicon Vias (TSVs) Revenue by Product in 2021
4.7.6 Samsung Through-Silicon Vias (TSVs) Revenue by Application in 2021
4.7.7 Samsung Through-Silicon Vias (TSVs) Revenue by Geographic Area in 2021
4.7.8 Samsung Recent Development
4.8 Tianshui Huatian Technology
4.8.1 Tianshui Huatian Technology Corporation Information
4.8.2 Tianshui Huatian Technology Description, Business Overview
4.8.3 Tianshui Huatian Technology Through-Silicon Vias (TSVs) Products Offered
4.8.4 Tianshui Huatian Technology Through-Silicon Vias (TSVs) Revenue and Gross Margin (2017-2022)
4.8.5 Tianshui Huatian Technology Through-Silicon Vias (TSVs) Revenue by Product in 2021
4.8.6 Tianshui Huatian Technology Through-Silicon Vias (TSVs) Revenue by Application in 2021
4.8.7 Tianshui Huatian Technology Through-Silicon Vias (TSVs) Revenue by Geographic Area in 2021
4.8.8 Tianshui Huatian Technology Recent Development
5 Breakdown Data by Type
5.1 Global Through-Silicon Vias (TSVs) Revenue by Type (2017-2022)
5.2 Global Through-Silicon Vias (TSVs) Revenue Forecast by Type (2023-2028)
5.3 Through-Silicon Vias (TSVs) Revenue Marke Share by Type (2017-2028)
6 Breakdown Data by Application
6.1 Global Through-Silicon Vias (TSVs) Revenue by Application (2017-2022)
6.2 Global Through-Silicon Vias (TSVs) Revenue Forecast by Application (2023-2028)
6.3 Through-Silicon Vias (TSVs) Revenue Market Share by Application (2017-2028)
7 North America
7.1 North America Through-Silicon Vias (TSVs) Market Size YoY Growth 2017-2028
7.2 North America Through-Silicon Vias (TSVs) Market Facts & Figures by Country (2017-2028)
7.3 North America Through-Silicon Vias (TSVs) Revenue by Type (2017-2022)
7.4 North America Through-Silicon Vias (TSVs) Revenue by Application (2017-2022)
8 Asia-Pacific
8.1 Asia-Pacific Through-Silicon Vias (TSVs) Market Size YoY Growth 2017-2028
8.2 Asia-Pacific Through-Silicon Vias (TSVs) Market Facts & Figures by Region (2017-2028)
8.3 Asia-Pacific Through-Silicon Vias (TSVs) Revenue by Type (2017-2022)
8.4 Asia-Pacific Through-Silicon Vias (TSVs) Revenue by Application (2017-2022)
9 Europe
9.1 Europe Through-Silicon Vias (TSVs) Market Size YoY Growth 2017-2028
9.2 Europe Through-Silicon Vias (TSVs) Market Facts & Figures by Country (2017-2028)
9.3 Europe Through-Silicon Vias (TSVs) Revenue by Type (2017-2022)
9.4 Europe Through-Silicon Vias (TSVs) Revenue by Application (2017-2022)
10 Latin America
10.1 Latin America Through-Silicon Vias (TSVs) Market Size YoY Growth 2017-2028
10.2 Latin America Through-Silicon Vias (TSVs) Market Facts & Figures by Country (2017-2028)
10.3 Latin America Through-Silicon Vias (TSVs) Revenue by Type (2017-2022)
10.4 Latin America Through-Silicon Vias (TSVs) Revenue by Application (2017-2022)
11 Middle East and Africa
11.1 Middle East and Africa Through-Silicon Vias (TSVs) Market Size YoY Growth 2017-2028
11.2 Middle East and Africa Through-Silicon Vias (TSVs) Market Facts & Figures by Country (2017-2028)
11.3 Middle East and Africa Through-Silicon Vias (TSVs) Revenue by Type (2017-2022)
11.4 Middle East and Africa Through-Silicon Vias (TSVs) Revenue by Application (2017-2022)
12 Supply Chain and Sales Channel Analysis
12.1 Through-Silicon Vias (TSVs) Supply Chain Analysis
12.2 Through-Silicon Vias (TSVs) Key Raw Materials and Upstream Suppliers
12.3 Through-Silicon Vias (TSVs) Clients Analysis
12.4 Through-Silicon Vias (TSVs) Sales Channel and Sales Model Analysis
12.4.1 Through-Silicon Vias (TSVs) Distribution Channel Analysis: Indirect Sales VS Direct Sales
12.4.2 Through-Silicon Vias (TSVs) Distribution Channel Analysis: Online Sales VS Offline Sales
12.4.3 Through-Silicon Vias (TSVs) Distributors
13 Market Dynamics
13.1 Through-Silicon Vias (TSVs) Industry Trends
13.2 Through-Silicon Vias (TSVs) Market Drivers
13.3 Through-Silicon Vias (TSVs) Market Challenges
13.4 Through-Silicon Vias (TSVs) Market Restraints
14 Research Findings and Conclusion
15 Appendix
15.1 Research Methodology
15.1.1 Methodology/Research Approach
15.1.2 Data Source
15.2 Author Details
15.3 Disclaimer
List of Tables
Table 1. Global Through-Silicon Vias (TSVs) Market Size Growth Rate by Type (US$ Million): 2017 VS 2021 VS 2028
Table 2. Major Companies of 2.5D Through-Silicon Vias
Table 3. Major Companies of 3D Through-Silicon Vias
Table 4. Global Through-Silicon Vias (TSVs) Market Size Growth by Application (US$ Million): 2017 VS 2021 VS 2028
Table 5. Global Through-Silicon Vias (TSVs) Market Size by Region (US$ Million): 2022 VS 2028
Table 6. Global Through-Silicon Vias (TSVs) Revenue by Region (2017-2022) & (US$ Million)
Table 7. Global Through-Silicon Vias (TSVs) Revenue Forecast by Region (2023-2028) & (US$ Million)
Table 8. Through-Silicon Vias (TSVs) Revenue by Company (2017-2022) & (US$ Million)
Table 9. Through-Silicon Vias (TSVs) Revenue Share by Company (2017-2022)
Table 10. Ranking of Global Top Through-Silicon Vias (TSVs) Players by Revenue (US$ Million) in 2021
Table 11. Global Through-Silicon Vias (TSVs) Companies Market Concentration Ratio (CR5 and HHI) & (2017-2022)
Table 12. Global Through-Silicon Vias (TSVs) by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Through-Silicon Vias (TSVs) as of 2021)
Table 13. Global Through-Silicon Vias (TSVs) Companies Headquarters
Table 14. Global Through-Silicon Vias (TSVs) Companies Product & Service
Table 15. Date of International Companies Enter into Through-Silicon Vias (TSVs) Market
Table 16. Global Through-Silicon Vias (TSVs) Mergers & Acquisitions, Expansion Plans
Table 17. ASE Technology Holding Corporation Information
Table 18. ASE Technology Holding Description and Business Overview
Table 19. ASE Technology Holding Through-Silicon Vias (TSVs) Revenue (US$ Million) and Gross Margin (2017-2022)
Table 20. ASE Technology Holding Through-Silicon Vias (TSVs) Product
Table 21. ASE Technology Holding Through-Silicon Vias (TSVs) Revenue Proportion of Through-Silicon Vias (TSVs) by Product in 2021
Table 22. ASE Technology Holding Through-Silicon Vias (TSVs) Revenue Proportion of Through-Silicon Vias (TSVs) by Application in 2021
Table 23. ASE Technology Holding Through-Silicon Vias (TSVs) Revenue Proportion of Through-Silicon Vias (TSVs) by Geographic Area in 2021
Table 24. ASE Technology Holding Recent Development
Table 25. Amkor Technology Corporation Information
Table 26. Amkor Technology Description and Business Overview
Table 27. Amkor Technology Through-Silicon Vias (TSVs) Revenue (US$ Million) and Gross Margin (2017-2022)
Table 28. Amkor Technology Through-Silicon Vias (TSVs) Product
Table 29. Amkor Technology Through-Silicon Vias (TSVs) Revenue Proportion of Through-Silicon Vias (TSVs) by Product in 2021
Table 30. Amkor Technology Through-Silicon Vias (TSVs) Revenue Proportion of Through-Silicon Vias (TSVs) by Application in 2021
Table 31. Amkor Technology Through-Silicon Vias (TSVs) Revenue Proportion of Through-Silicon Vias (TSVs) by Geographic Area in 2021
Table 32. Amkor Technology Recent Development
Table 33. Taiwan Semiconductor Manufacturing Company Limited Corporation Information
Table 34. Taiwan Semiconductor Manufacturing Company Limited Description and Business Overview
Table 35. Taiwan Semiconductor Manufacturing Company Limited Through-Silicon Vias (TSVs) Revenue (US$ Million) and Gross Margin (2017-2022)
Table 36. Taiwan Semiconductor Manufacturing Company Limited Through-Silicon Vias (TSVs) Product
Table 37. Taiwan Semiconductor Manufacturing Company Limited Through-Silicon Vias (TSVs) Revenue Proportion of Through-Silicon Vias (TSVs) by Product in 2021
Table 38. Taiwan Semiconductor Manufacturing Company Limited Through-Silicon Vias (TSVs) Revenue Proportion of Through-Silicon Vias (TSVs) by Application in 2021
Table 39. Taiwan Semiconductor Manufacturing Company Limited Through-Silicon Vias (TSVs) Revenue Proportion of Through-Silicon Vias (TSVs) by Geographic Area in 2021
Table 40. Taiwan Semiconductor Manufacturing Company Limited Recent Development
Table 41. Intel Corporation Corporation Information
Table 42. Intel Corporation Description and Business Overview
Table 43. Intel Corporation Through-Silicon Vias (TSVs) Revenue (US$ Million) and Gross Margin (2017-2022)
Table 44. Intel Corporation Through-Silicon Vias (TSVs) Product
Table 45. Intel Corporation Through-Silicon Vias (TSVs) Revenue Proportion of Through-Silicon Vias (TSVs) by Product in 2021
Table 46. Intel Corporation Through-Silicon Vias (TSVs) Revenue Proportion of Through-Silicon Vias (TSVs) by Application in 2021
Table 47. Intel Corporation Through-Silicon Vias (TSVs) Revenue Proportion of Through-Silicon Vias (TSVs) by Geographic Area in 2021
Table 48. Intel Corporation Recent Development
Table 49. GLOBALFOUNDRIES Corporation Information
Table 50. GLOBALFOUNDRIES Description and Business Overview
Table 51. GLOBALFOUNDRIES Through-Silicon Vias (TSVs) Revenue (US$ Million) and Gross Margin (2017-2022)
Table 52. GLOBALFOUNDRIES Through-Silicon Vias (TSVs) Product
Table 53. GLOBALFOUNDRIES Through-Silicon Vias (TSVs) Revenue Proportion of Through-Silicon Vias (TSVs) by Product in 2021
Table 54. GLOBALFOUNDRIES Through-Silicon Vias (TSVs) Revenue Proportion of Through-Silicon Vias (TSVs) by Application in 2021
Table 55. GLOBALFOUNDRIES Through-Silicon Vias (TSVs) Revenue Proportion of Through-Silicon Vias (TSVs) by Geographic Area in 2021
Table 56. GLOBALFOUNDRIES Recent Development
Table 57. JCET Group Corporation Information
Table 58. JCET Group Description and Business Overview
Table 59. JCET Group Through-Silicon Vias (TSVs) Revenue (US$ Million) and Gross Margin (2017-2022)
Table 60. JCET Group Through-Silicon Vias (TSVs) Product
Table 61. JCET Group Through-Silicon Vias (TSVs) Revenue Proportion of Through-Silicon Vias (TSVs) by Product in 2021
Table 62. JCET Group Through-Silicon Vias (TSVs) Revenue Proportion of Through-Silicon Vias (TSVs) by Application in 2021
Table 63. JCET Group Through-Silicon Vias (TSVs) Revenue Proportion of Through-Silicon Vias (TSVs) by Geographic Area in 2021
Table 64. Samsung Corporation Information
Table 65. Samsung Description and Business Overview
Table 66. Samsung Through-Silicon Vias (TSVs) Revenue (US$ Million) and Gross Margin (2017-2022)
Table 67. Samsung Through-Silicon Vias (TSVs) Product
Table 68. Samsung Through-Silicon Vias (TSVs) Revenue Proportion of Through-Silicon Vias (TSVs) by Product in 2021
Table 69. Samsung Through-Silicon Vias (TSVs) Revenue Proportion of Through-Silicon Vias (TSVs) by Application in 2021
Table 70. Samsung Through-Silicon Vias (TSVs) Revenue Proportion of Through-Silicon Vias (TSVs) by Geographic Area in 2021
Table 71. Tianshui Huatian Technology Corporation Information
Table 72. Tianshui Huatian Technology Description and Business Overview
Table 73. Tianshui Huatian Technology Through-Silicon Vias (TSVs) Revenue (US$ Million) and Gross Margin (2017-2022)
Table 74. Tianshui Huatian Technology Through-Silicon Vias (TSVs) Product
Table 75. Tianshui Huatian Technology Through-Silicon Vias (TSVs) Revenue Proportion of Through-Silicon Vias (TSVs) by Product in 2021
Table 76. Tianshui Huatian Technology Through-Silicon Vias (TSVs) Revenue Proportion of Through-Silicon Vias (TSVs) by Application in 2021
Table 77. Tianshui Huatian Technology Through-Silicon Vias (TSVs) Revenue Proportion of Through-Silicon Vias (TSVs) by Geographic Area in 2021
Table 78. Global Through-Silicon Vias (TSVs) Revenue by Type (2017-2022) & (US$ Million)
Table 79. Global Through-Silicon Vias (TSVs) Revenue by Application (2017-2022) & (US$ Million)
Table 80. Global Through-Silicon Vias (TSVs) Revenue Forecast by Application (2023-2028) & (US$ Million)
Table 81. North America Through-Silicon Vias (TSVs) Revenue by Country (2017-2022) & (US$ Million)
Table 82. North America Through-Silicon Vias (TSVs) Revenue by Country (2023-2028) & (US$ Million)
Table 83. North America Through-Silicon Vias (TSVs) Revenue by Type (2017-2022) & (US$ Million)
Table 84. North America Through-Silicon Vias (TSVs) Revenue by Application (2017-2022) & (US$ Million)
Table 85. Asia-Pacific Through-Silicon Vias (TSVs) Revenue by Region (2017-2028) & (US$ Million)
Table 86. Asia-Pacific Through-Silicon Vias (TSVs) Revenue by Region (2023-2028) & (US$ Million)
Table 87. Asia-Pacific Through-Silicon Vias (TSVs) Revenue by Type (2017-2022) & (US$ Million)
Table 88. Asia-Pacific Through-Silicon Vias (TSVs) Revenue by Application (2017-2022) & (US$ Million)
Table 89. Europe Through-Silicon Vias (TSVs) Revenue by Country (2017-2022) & (US$ Million)
Table 90. Europe Through-Silicon Vias (TSVs) Revenue by Country (2023-2028) & (US$ Million)
Table 91. Europe Through-Silicon Vias (TSVs) Revenue by Type (2017-2022) & (US$ Million)
Table 92. Europe Through-Silicon Vias (TSVs) Revenue by Application (2017-2022) & (US$ Million)
Table 93. Latin America Through-Silicon Vias (TSVs) Revenue by Country (2017-2022) & (US$ Million)
Table 94. Latin America Through-Silicon Vias (TSVs) Revenue by Country (2023-2028) & (US$ Million)
Table 95. Latin America Through-Silicon Vias (TSVs) Revenue by Type (2017-2022) & (US$ Million)
Table 96. Latin America Through-Silicon Vias (TSVs) Revenue by Application (2017-2022) & (US$ Million)
Table 97. Middle East and Africa Through-Silicon Vias (TSVs) Revenue by Country (2017-2022) & (US$ Million)
Table 98. Middle East and Africa Through-Silicon Vias (TSVs) Revenue by Country (2023-2028) & (US$ Million)
Table 99. Middle East and Africa Through-Silicon Vias (TSVs) Revenue by Type (2017-2022) & (US$ Million)
Table 100. Middle East and Africa Through-Silicon Vias (TSVs) Revenue by Application (2017-2022) & (US$ Million)
Table 101. Through-Silicon Vias (TSVs) Key Raw Materials, Industry Status and Trend
Table 102. Through-Silicon Vias (TSVs) Key Raw Materials and Upstream Suppliers
Table 103. Through-Silicon Vias (TSVs) Clients Status and Trend
Table 104. Through-Silicon Vias (TSVs) Typical Clients
Table 105. Through-Silicon Vias (TSVs) Distributors
Table 106. Through-Silicon Vias (TSVs) Market Trends
Table 107. Through-Silicon Vias (TSVs) Market Drivers
Table 108. Through-Silicon Vias (TSVs) Market Challenges
Table 109. Through-Silicon Vias (TSVs) Market Restraints
Table 110. Research Programs/Design for This Report
Table 111. Key Data Information from Secondary Sources
Table 112. Key Data Information from Primary Sources
List of Figures
Figure 1. Through-Silicon Vias (TSVs) Product Picture
Figure 2. Global Through-Silicon Vias (TSVs) Revenue Market Share by Type in 2021 & 2028
Figure 3. 2.5D Through-Silicon Vias Product Picture
Figure 4. 3D Through-Silicon Vias Product Picture
Figure 5. Global Through-Silicon Vias (TSVs) Revenue Market Share by Application in 2021 & 2028
Figure 6. Mobile And Consumer Electronics
Figure 7. Communication Equipment
Figure 8. Automotive And Transportation Electronics
Figure 9. Through-Silicon Vias (TSVs) Report Years Considered
Figure 10. Global Through-Silicon Vias (TSVs) Revenue, (US$ Million), 2017 VS 2021 VS 2028
Figure 11. Global Through-Silicon Vias (TSVs) Market Size 2017-2028 (US$ Million)
Figure 12. Global Through-Silicon Vias (TSVs) Market Size Market Share by Region: 2022 Versus 2028
Figure 13. Global Through-Silicon Vias (TSVs) Revenue Market Share by Region (2017-2028)
Figure 14. Through-Silicon Vias (TSVs) Market Share by Company Type (Tier 1, Tier 2 and Tier 3): 2017 VS 2021
Figure 15. Global Through-Silicon Vias (TSVs) Revenue Market Share Forecast by Type (2017-2028)
Figure 16. Global Through-Silicon Vias (TSVs) Revenue Market Share Forecast by Application (2017-2028)
Figure 17. North America Through-Silicon Vias (TSVs) Revenue 2017-2028 (US$ Million)
Figure 18. North America Through-Silicon Vias (TSVs) Revenue Market Share by Type (2017-2022)
Figure 19. North America Through-Silicon Vias (TSVs) Revenue Market Share by Application (2017-2022)
Figure 20. Asia-Pacific Through-Silicon Vias (TSVs) Revenue 2017-2028 (US$ Million)
Figure 21. Asia-Pacific Through-Silicon Vias (TSVs) Revenue Market Share by Region (2017-2028)
Figure 22. Asia-Pacific Through-Silicon Vias (TSVs) Revenue Market Share by Type (2017-2022)
Figure 23. Asia-Pacific Through-Silicon Vias (TSVs) Revenue Market Share by Application (2017-2022)
Figure 24. Europe Through-Silicon Vias (TSVs) Revenue Growth Rate 2017-2028 (US$ Million)
Figure 25. Europe Through-Silicon Vias (TSVs) Revenue Market Share by Country (2017-2028)
Figure 26. Europe Through-Silicon Vias (TSVs) Revenue Market Share by Type (2017-2022)
Figure 27. Europe Through-Silicon Vias (TSVs) Revenue Market Share by Application (2017-2022)
Figure 28. Latin America Through-Silicon Vias (TSVs) Revenue Growth Rate 2017-2028 (US$ Million)
Figure 29. Latin America Through-Silicon Vias (TSVs) Revenue Market Share by Country (2017-2022)
Figure 30. Latin America Through-Silicon Vias (TSVs) Revenue Market Share by Type (2017-2022)
Figure 31. Latin America Through-Silicon Vias (TSVs) Revenue Market Share by Application (2017-2022)
Figure 32. Middle East and Africa Through-Silicon Vias (TSVs) Revenue Growth Rate 2017-2028 (US$ Million)
Figure 33. Middle East and Africa Through-Silicon Vias (TSVs) Revenue Market Share by Country (2017-2028)
Figure 34. Middle East and Africa Through-Silicon Vias (TSVs) Revenue Market Share by Type (2017-2022)
Figure 35. Middle East and Africa Through-Silicon Vias (TSVs) Revenue Market Share by Application (2017-2022)
Figure 36. Through-Silicon Vias (TSVs) Supply Chain (Upstream and Downstream Market)
Figure 37. Global Production Market Share of Through-Silicon Vias (TSVs) Raw Materials by Region in 2021
Figure 38. Through-Silicon Vias (TSVs) Distribution Channels
Figure 39. Global Through-Silicon Vias (TSVs) Percentage 2017-2028: Indirect Sales VS Direct Sales
Figure 40. Global Through-Silicon Vias (TSVs) Percentage 2017-2028: Online Sales VS Offline Sales
Figure 41. Bottom-up and Top-down Approaches for This Report
Figure 42. Data Triangulation
Figure 43. Key Executives Interviewed
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