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A thermoelectric (TE) module, also called a thermoelectric cooler or Peltier cooler, is a semiconductor-based electronic component that functions as a small heat pump. By applying a low voltage DC power source to a TEM, heat will be moved through the module from one side to the other. One module face, therefore, will be cooled while the opposite face simultaneously is heated. It is important to note that this phenomenon is fully reversible whereby a change in the polarity of the applied DC voltage will cause heat to be moved in the opposite direction. Consequently, a TEM may be used for both cooling and heating in a given application.
Scope of the Report:
The global average price of Thermoelectric Modules is in the decreasing trend, from 22.4 USD/Unit in 2012 to 21.06 USD/Unit in 2016. With the situation of global economy, prices will be in decreasing trend in the following five years.
The classification of Thermoelectric Modules includes Single Stage module and Multistage module. Single Stage module still occupied about 85% market share as its low price. The growth rate of multistage module is faster as it can supply high heat difference.
China region is the largest supplier of Thermoelectric Modules, with a production market share nearly 38.55% in 2016. Rest of Asia is the second largest supplier of Thermoelectric Modules, enjoying production market share nearly 25.33% in 2016.
North America is the largest consumption place, nose ahead China, with a consumption market share nearly 25.28% in 2016. While all the major regions like North America and APAC will also enjoy a fastest speed in next several years.
The worldwide market for Thermoelectric Modules is expected to grow at a CAGR of roughly 8.2% over the next five years, will reach 730 million US$ in 2024, from 460 million US$ in 2019, according to a new GIR (Global Info Research) study.
This report focuses on the Thermoelectric Modules in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
Market Segment by Manufacturers, this report covers
- Ferrotec
- Laird
- KELK
- Marlow
- RMT
- CUI
- Hi-Z
- Tellurex
- Crystal
- P&N Tech
- Thermonamic Electronics
- Kryo Therm
- Wellen Tech
- AMS Technologies
Market Segment by Regions, regional analysis covers
- North America (United States, Canada and Mexico)
- Europe (Germany, France, UK, Russia and Italy)
- Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
- South America (Brazil, Argentina, Colombia etc.)
- Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
- Single Stage Module
- Multistage Module
Market Segment by Applications, can be divided into
- Automotive
- Electronics
- Biomedical
- Others
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Thermoelectric Modules product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Thermoelectric Modules, with price, sales, revenue and global market share of Thermoelectric Modules in 2017 and 2018.
Chapter 3, the Thermoelectric Modules competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Thermoelectric Modules breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2014 to 2019.
Chapter 5, 6, 7, 8 and 9, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2014 to 2019.
Chapter 10 and 11, to segment the sales by type and application, with sales market share and growth rate by type, application, from 2014 to 2019.
Chapter 12, Thermoelectric Modules market forecast, by regions, type and application, with sales and revenue, from 2019 to 2024.
Chapter 13, 14 and 15, to describe Thermoelectric Modules sales channel, distributors, customers, research findings and conclusion, appendix and data source.