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Glass substrate is a thin glass board on which a thin circuit is deposited with precision. This report will research the application in semiconductor packaging.
Scope of the Report:
The worldwide market for Glass Substrate for Semiconductor Packaging is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx million US$ in 2024, from xx million US$ in 2019, according to a new GIR (Global Info Research) study.
This report focuses on the Glass Substrate for Semiconductor Packaging in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
Market Segment by Manufacturers, this report covers
- Schott AG
- Tecnisco
- Plan Optik AG
- AGC
- Corning
Market Segment by Regions, regional analysis covers
- North America (United States, Canada and Mexico)
- Europe (Germany, France, UK, Russia and Italy)
- Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
- South America (Brazil, Argentina, Colombia etc.)
- Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
- Cover Glass Substrate
- Back-grinding Glass Substrate
- Support Glass Substrate
- Others
Market Segment by Applications, can be divided into
- Wafer Level Packaging
- Panel Level Packaging
- Others
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Glass Substrate for Semiconductor Packaging product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Glass Substrate for Semiconductor Packaging, with price, sales, revenue and global market share of Glass Substrate for Semiconductor Packaging in 2017 and 2018.
Chapter 3, the Glass Substrate for Semiconductor Packaging competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Glass Substrate for Semiconductor Packaging breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2014 to 2019.
Chapter 5, 6, 7, 8 and 9, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2014 to 2019.
Chapter 10 and 11, to segment the sales by type and application, with sales market share and growth rate by type, application, from 2014 to 2019.
Chapter 12, Glass Substrate for Semiconductor Packaging market forecast, by regions, type and application, with sales and revenue, from 2019 to 2024.
Chapter 13, 14 and 15, to describe Glass Substrate for Semiconductor Packaging sales channel, distributors, customers, research findings and conclusion, appendix and data source.