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The front-end-of-line (FEOL) is the first portion of IC fabrication where the individual devices (transistors, capacitors, resistors, etc.) are patterned in the semiconductor. FEOL generally covers everything up to (but not including) the deposition of metal interconnect layers.
Scope of the Report:
This report focuses on the Front End of the Line Semiconductor Equipment in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
The stepper segment dominated the market. The emergence of new packaging methods such as flip chip and 3D packaging will be one of the key market drivers for this segment. Additionally, the miniaturization of electronic devices like smartphones and tablets will increase the demand for ICs (integrated circuits), which, in turn, will lead to the strong growth of the stepper product segment.
The worldwide market for Front End of the Line Semiconductor Equipment is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx million US$ in 2023, from xx million US$ in 2017, according to a new GIR (Global Info Research) study.
Market Segment by Manufacturers, this report covers
- Applied Materials
- ASML
- KLA-Tencor
- Lam Research
- Tokyo Electron
- Dainippon Screen Manufacturing
- Hitachi High-Technologies
- Nikon
- Hitachi Kokusai Electric
Market Segment by Regions, regional analysis covers
- North America (United States, Canada and Mexico)
- Europe (Germany, France, UK, Russia and Italy)
- Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
- South America (Brazil, Argentina, Colombia etc.)
- Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
- RTP (Real-time Transport Protocol) Equipment
- Ion Implant Equipment
- CMP Equipment
- Coater Developer
- Wet Station
- Silicon Etching equipment
- CVD (Chemical Vapor Deposition) Equipment
- Stepper
- Other
Market Segment by Applications, can be divided into
- Electronics
- Medical Devices
- Automotive
- Other
There are 15 Chapters to deeply display the global Front End of the Line Semiconductor Equipment market.
Chapter 1, to describe Front End of the Line Semiconductor Equipment Introduction, product scope, market overview, market opportunities, market risk, market driving force;
Chapter 2, to analyze the top manufacturers of Front End of the Line Semiconductor Equipment, with sales, revenue, and price of Front End of the Line Semiconductor Equipment, in 2016 and 2017;
Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2016 and 2017;
Chapter 4, to show the global market by regions, with sales, revenue and market share of Front End of the Line Semiconductor Equipment, for each region, from 2013 to 2018;
Chapter 5, 6, 7, 8 and 9, to analyze the market by countries, by type, by application and by manufacturers, with sales, revenue and market share by key countries in these regions;
Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2013 to 2018;
Chapter 12, Front End of the Line Semiconductor Equipment market forecast, by regions, type and application, with sales and revenue, from 2018 to 2023;
Chapter 13, 14 and 15, to describe Front End of the Line Semiconductor Equipment sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source