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Market Overview of Global Electronic Printed Circuit Board (PCB) market:
According to our latest research, the global Electronic Printed Circuit Board (PCB) market looks promising in the next 5 years. As of 2022, the global Electronic Printed Circuit Board (PCB) market was estimated at USD 71009.0 million, and it's anticipated to reach USD 85630.0 million in 2028, with a CAGR of 3.17% during the forecast years.
A printed circuit board (PCB) mechanically supports and electrically connects electronic components or electrical components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.
Development of smartphones and automotive electronics industry
With the development of smart phones and the automotive electronics industry, global PCB production has grown steadily: the global PCB industry has entered a period of steady growth, and the search for new growth points is the industry's development trend. In the downstream applications of PCBs, smartphones and cars will be the main drivers of growth in the industry.
Complex production process
The PCB industry has many types of products, many kinds of raw materials, long production processes, and many processes. Enterprises must have strong management capabilities to ensure their own normal operations. At the same time, although various PCB products have some common basic processes, it is more important to determine the difference according to the thickness and material of the substrate, the accuracy of the line width and line spacing, the design structure and production scale, and other special requirements specified by the customer. The production process and equipment are highly customized. Due to the precision of the downstream electronic products and the characteristics of the production mode, the PCB quality is unstable or the delivery is not timely, which will affect the customer's confidence in the product to a large extent.
Upgrade of communication technology
5G is the focus of the future development of the mobile communications industry, and communication equipment manufacturers and telecom operators have begun to lay out next-generation communication technologies without exception. 5G communication will have faster speed than 4G, and upgrade the communication speed and capacity. The technology is mainly embodied in millimeter wave, small base station, Massive MIMO technology and so on. Due to the application of the above technologies, the communication equipment of the 5G era has higher requirements for communication materials, and the demand is also larger, which brings broad prospects for the future development of high-frequency PCB/CCL.
Region Overview:
Geographically, China held the largest market share - 52.97% in 2022.
Company Overview:
Zhen Ding Technology Holding Limited (ZDT) is one of the major players operating in the Electronic Printed Circuit Board (PCB) market, holding a share of 6.52% in 2021.
Zhen Ding Technology Holding Limited (ZDT)
Zhen Ding Technology Holding Limited manufactures printed circuit boards. The Company produces and sells high density interconnection, flexible printed circuit, rigid printed circuit board, and other products. Zhen Ding Technology Holding markets its products throughout China.
NOK Corporation
NOK is Japan's longest established oil seal manufacturer. Our functional parts such as oil seals and mechanical seals, created through advanced seal technology, are not only employed in the automotive industry but are also used in a wide range of other industries. They have developed into the leading company in the field in terms of reliability by leveraging the technology and know-how we have accumulated since the start of operations.
Segmentation Overview:
By type, Standard multilayer segment accounted for the largest share of market in 2022.
Rigid 1-2 sided
Rigid 1-2 faces are divided into single panels, double panels. The most basic printed circuit board of a single panel, with one part on one side and the other side on the other side. The double panel is a printed circuit board that prints conductive patterns on both sides of a double-sided copper clad plate.
Standard multilayer
The multi-layer board refers to a printed circuit board having four or more layers of conductive patterns. The inner layer is formed by laminating a conductive pattern and an insulating slab, and the outer layer is a copper foil, which is pressed into a whole.
High-Density Interconnect (HDI)
High-density interconnectors (HDI, high-density interconnected circuit boards) are boards with relatively high line-distribution density using micro-bump buried via technology.
Flexible circuits
Flexible Printed Circuit (FPC) is the only solution to meet the miniaturization and movement requirements of electronic products. It can be bent, wound and folded freely.
Package Substrate
The packaging substrate can be directly used to carry the chip.
Application Overview:
By application, the Communications segment occupied the biggest share from 2018 to 2022.
This report covers a research time span from 2018 to 2028, and presents a deep and comprehensive analysis of the global Electronic Printed Circuit Board (PCB) market, with a systematical description of the status quo and trends of the whole market, a close look into the competitive landscape of the major players, and a detailed elaboration on segment markets by type, by application and by region.
Key Takeaways from the Global Electronic Printed Circuit Board (PCB) Market Report:
Market Size Estimates: Electronic Printed Circuit Board (PCB) market size estimation in terms of value and sales volume from 2018-2028
Market Trends and Dynamics: Electronic Printed Circuit Board (PCB) market drivers, opportunities, challenges, and risks
Macro-economy and Regional Conflict: Influence of global inflation and Russia & Ukraine War on the Electronic Printed Circuit Board (PCB) market
Segment Market Analysis: Electronic Printed Circuit Board (PCB) market value and sales volume by type and by application from 2018-2028
Regional Market Analysis: Electronic Printed Circuit Board (PCB) market situations and prospects in North America, Asia Pacific, Europe, Latin America, Middle East, Africa
Country-level Studies on the Electronic Printed Circuit Board (PCB) Market: Revenue and sales volume of major countries in each region
Electronic Printed Circuit Board (PCB) Market Competitive Landscape and Major Players: Analysis of 10-15 leading market players, sales, price, revenue, gross, gross margin, product profile and application, etc.
Trade Flow: Import and export volume of the Electronic Printed Circuit Board (PCB) market in major regions.
Electronic Printed Circuit Board (PCB) Industry Value Chain: Electronic Printed Circuit Board (PCB) market raw materials & suppliers, manufacturing process, distributors, downstream customers
Electronic Printed Circuit Board (PCB) Industry News, Policies & Regulations
Key players in the global Electronic Printed Circuit Board (PCB) market are covered in Chapter 12:
Samsung Electro-Mechanics (SEMCO)
AT&S
NOK Corporation
HannStar Board Corporation
Shennan Circuits Company Limited
Zhen Ding Technology Holding Limited (ZDT)
Shenzhen Kinwong Electronic Co., Ltd.
Tripod Technology Corporation
Compeq Manufacturing Co., Ltd
TTM Technologies, Inc.
Fujikura
Unimicron Technology Corp.
In Chapter 2 and Chapter 15.1, based on types, the Electronic Printed Circuit Board (PCB) market from 2018 to 2028 is primarily split into:
Rigid 1-2 sided
Standard multilayer
High-Density Interconnect (HDI)
Flexible circuits
Package Substrate
In Chapter 3 and Chapter 15.2, based on applications, the Electronic Printed Circuit Board (PCB) market from 2018 to 2028 covers:
Computer/Peripherals
Communications
Consumer Electronics
Industrial Electronics
Automotive
Military/Aerospace
Others
Geographically, the detailed analysis of consumption, revenue, market share and growth rate of the following regions are covered in Chapter 7, 8, 9, 10, 11, 15.3, 15.4:
North America (Covered in Chapter 7)
United States
Canada
Asia-Pacific (Covered in Chapter 8)
China
Japan
India
South Korea
Southeast Asia
Australia
Others
Europe (Covered in Chapter 9)
Germany
France
UK
Italy
Spain
Russia
Poland
Others
Latin America (Covered in Chapter 10)
Mexico
Brazil
Argentina
Others
Middle East and Africa (Covered in Chapter 11)
GCC Countries
Africa
Others
The data of this research report is mainly obtained from industry associations, magazines, press releases, national customs, annual reports of enterprises, expert interviews, paid databases and other channels with authority. It also provides scientific forecasts of the industry's core development indicators through professional analysis and forecasting models.
In short, whatever role you take in this industry value chain, this report will help you or your company to acquire a systematic and in-depth understanding of the industry.
Chapter Outline
This report consists of 16 chapters. Below is a brief guideline to help you quickly grasp the main contents of each chapter:
Chapter 1 starts the report with an overview of the Electronic Printed Circuit Board (PCB) market, as well as the definitions of the target market and the subdivisions. Through the presented global market size, regional market sizes, and segment market shares, you will be able to draw an overall and comprehensive picture of the market situation. Meanwhile, the research method and data source will be shared in this chapter.
Chapter 2 and Chapter 3 breaks down the market by different types and applications, with historic data presented in metrics of sales volume, revenue, market share and growth rate.
Chapter 4 elaborates on market dynamics and future trends in the industry, which contains an in-depth analysis of market drivers, opportunities, challenges, and risks. Other essential factors that will have a major impact on the market, i.e., industry news and policies in recent years, global inflation, and regional conflict, are also taken into consideration.
Chapter 5 compares the sales volume and revenue of the major regions across the globe, which enables the readers to understand the regional competitive pattern.
Chapter 6 is the analysis of the trade flow. Import volume and export volume are revealed on a regional level.
Chapters 7-11 focus on country-level studies. Data from the major countries in each region are provided, showing the current development of the industry in different countries. Besides, you will also find qualitative trends analysis under global inflation under each of the 6 regions.
Chapter 12 first up presents the competitive landscape by displaying and comparing the revenues, sales volumes, and market shares of the top players in the market, followed by a company-by-company analysis of all the major market participants with introductions of their products, product applications, company profiles, and business overview. In addition, their competitiveness is manifested through numbers of sales volume, revenue, price, gross and gross margin.
Chapter 13 looks into the whole market industrial chain, ranging from the upstream key raw materials and their suppliers to midstream distributors and downstream customers, with influences of global inflation taken into consideration.
Chapter 14 is perfect for those who wish to develop new projects in the industry. This chapter sheds a light on industry entry barriers and gives suggestions on new project investments.
Chapter 15 forecasts the future trend of the market from the perspective of different types, applications, and major regions.
Chapter 16 is the conclusion of the report which helps the readers sum up the main findings and insights.
Years considered for this report:
Historical Years: 2018-2022
Base Year: 2022
Estimated Year: 2023
Forecast Period: 2023-2028