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Electronic Potting and Encapsulation delivers a thicker and more robust solution versus conformal coating to protect electronic assemblies from harsher environments to keep them functioning properly for longer lengths of time, and/or to keep them protected from security threats. Electronic Potting and Encapsulation also create a barrier against moisture, dust, fungus and corrosion. These processes also enhance circuit reliability by eliminating leakage from high voltage circuits.
According to our (Global Info Research) latest study, the global Electronic Potting and Encapsulating market size was valued at USD 1855.8 million in 2022 and is forecast to a readjusted size of USD 3370.8 million by 2029 with a CAGR of 8.9% during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Henkel, Dow Corning and Hitachi Chemical are the top 3 players of Electronic Potting & Encapsulating, with about 50% market shares.
This report is a detailed and comprehensive analysis for global Electronic Potting and Encapsulating market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2023, are provided.
Key Features:
Global Electronic Potting and Encapsulating market size and forecasts, in consumption value ($ Million), 2018-2029
Global Electronic Potting and Encapsulating market size and forecasts by region and country, in consumption value ($ Million), 2018-2029
Global Electronic Potting and Encapsulating market size and forecasts, by Type and by Application, in consumption value ($ Million), 2018-2029
Global Electronic Potting and Encapsulating market shares of main players, in revenue ($ Million), 2018-2023
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Electronic Potting and Encapsulating
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Electronic Potting and Encapsulating market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Henkel, Dow Corning, Hitachi Chemical, LORD Corporation and Huntsman Corporation, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.
Market segmentation
Electronic Potting and Encapsulating market is split by Type and by Application. For the period 2018-2029, the growth among segments provide accurate calculations and forecasts for consumption value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
- Epoxy
- Silicones
- Polyurethane
- Ohers
Market segment by Application
- Consumer Electronics
- Automotive
- Medical
- Telecommunications
- Others
Market segment by players, this report covers
- Henkel
- Dow Corning
- Hitachi Chemical
- LORD Corporation
- Huntsman Corporation
- ITW Engineered Polymers
- 3M
- H.B. Fuller
- John C. Dolph
- Master Bond
- ACC Silicones
- Epic Resins
- Plasma Ruggedized Solutions
Market segment by regions, regional analysis covers
- North America (United States, Canada, and Mexico)
- Europe (Germany, France, UK, Russia, Italy, and Rest of Europe)
- Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Australia and Rest of Asia-Pacific)
- South America (Brazil, Argentina and Rest of South America)
- Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)
The content of the study subjects, includes a total of 13 chapters:
Chapter 1, to describe Electronic Potting and Encapsulating product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top players of Electronic Potting and Encapsulating, with revenue, gross margin and global market share of Electronic Potting and Encapsulating from 2018 to 2023.
Chapter 3, the Electronic Potting and Encapsulating competitive situation, revenue and global market share of top players are analyzed emphatically by landscape contrast.
Chapter 4 and 5, to segment the market size by Type and application, with consumption value and growth rate by Type, application, from 2018 to 2029.
Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2018 to 2023.and Electronic Potting and Encapsulating market forecast, by regions, type and application, with consumption value, from 2024 to 2029.
Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War
Chapter 12, the key raw materials and key suppliers, and industry chain of Electronic Potting and Encapsulating.
Chapter 13, to describe Electronic Potting and Encapsulating research findings and conclusion.