For a long time, the cure for diabetes type 1 and type 2 has relied on agonizing insulin shots for patients or insulin infusion via mechanical pumps. Regarding this, experts have been creating artificial pancreatic beta cells with the he…
ICs manufactured in the global semiconductor industry are delicate, and thus vulnerable to contamination causing malfunction. To prevent from such malfunctions, silicon chips or ICs are protected using packaging materials.
LPI (LP Information)' newest research report, the "Die-level Packaging Equipment Industry Forecast" looks at past sales and reviews total world Die-level Packaging Equipment sales in 2022, providing a comprehensive analysis by region and market sector of projected Die-level Packaging Equipment sales for 2023 through 2029. With Die-level Packaging Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Die-level Packaging Equipment industry.
This Insight Report provides a comprehensive analysis of the global Die-level Packaging Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Die-level Packaging Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Die-level Packaging Equipment market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Die-level Packaging Equipment and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Die-level Packaging Equipment.
The global Die-level Packaging Equipment market size is projected to grow from US$ million in 2022 to US$ million in 2029; it is expected to grow at a CAGR of % from 2023 to 2029.
Wafer-levelpackaging anddie-levelpackaging arethemostpredominantpackaging types. Wafer-levelpackaging involvesthepackaging of individualICsthrough thebest-fitpackaging processesconductedinwafer-levelmanufacturing during thesemiconductor productionprocess, whiledie-levelpackaging involvespackaging of each diceandnotthewafer asawhole.
This report presents a comprehensive overview, market shares, and growth opportunities of Die-level Packaging Equipment market by product type, application, key manufacturers and key regions and countries.
Market Segmentation:
Segmentation by type
- Automatic
- Semi-automatic
Segmentation by application
- Integrated Circuit Fabrication Process
- Semiconductor Industry
- Microelectromechanical Systems (MEMS)
- Other
This report also splits the market by region:
- Americas
- - United States
- - Canada
- - Mexico
- - Brazil
- APAC
- - China
- - Japan
- - Korea
- - Southeast Asia
- - India
- - Australia
- Europe
- - Germany
- - France
- - UK
- - Italy
- - Russia
- Middle East & Africa
- - Egypt
- - South Africa
- - Israel
- - Turkey
- - GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
- ASM International
- BeSemiconductor Industries
- DISCO
- Kulicke & Soffa Industries
- Advantest
- Cohu
- Hitachi High-Technologies
- Shinkawa
- TOWA Corporation
Key Questions Addressed in this Report
What is the 10-year outlook for the global Die-level Packaging Equipment market?
What factors are driving Die-level Packaging Equipment market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Die-level Packaging Equipment market opportunities vary by end market size?
How does Die-level Packaging Equipment break out type, application?
What are the influences of COVID-19 and Russia-Ukraine war?