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ICs manufactured in the global semiconductor industry are delicate, and thus vulnerable to contamination causing malfunction. To prevent from such malfunctions, silicon chips or ICs are protected using packaging materials.
According to our (Global Info Research) latest study, the global Die-level Packaging Equipment market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Wafer-levelpackaging anddie-levelpackaging arethemostpredominantpackaging types. Wafer-levelpackaging involvesthepackaging of individualICsthrough thebest-fitpackaging processesconductedinwafer-levelmanufacturing during thesemiconductor productionprocess, whiledie-levelpackaging involvespackaging of each diceandnotthewafer asawhole.
This report is a detailed and comprehensive analysis for global Die-level Packaging Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2023, are provided.
Key Features:
Global Die-level Packaging Equipment market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (USD/Unit), 2018-2029
Global Die-level Packaging Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (USD/Unit), 2018-2029
Global Die-level Packaging Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (USD/Unit), 2018-2029
Global Die-level Packaging Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (USD/Unit), 2018-2023
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Die-level Packaging Equipment
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Die-level Packaging Equipment market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include ASM International, BeSemiconductor Industries, DISCO, Kulicke & Soffa Industries and Advantest, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.
Market Segmentation
Die-level Packaging Equipment market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
- Automatic
- Semi-automatic
Market segment by Application
- Integrated Circuit Fabrication Process
- Semiconductor Industry
- Microelectromechanical Systems (MEMS)
- Other
Major players covered
- ASM International
- BeSemiconductor Industries
- DISCO
- Kulicke & Soffa Industries
- Advantest
- Cohu
- Hitachi High-Technologies
- Shinkawa
- TOWA Corporation
Market segment by region, regional analysis covers
- North America (United States, Canada and Mexico)
- Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
- Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
- South America (Brazil, Argentina, Colombia, and Rest of South America)
- Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Die-level Packaging Equipment product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Die-level Packaging Equipment, with price, sales, revenue and global market share of Die-level Packaging Equipment from 2018 to 2023.
Chapter 3, the Die-level Packaging Equipment competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Die-level Packaging Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2018 to 2029.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2018 to 2029.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2022.and Die-level Packaging Equipment market forecast, by regions, type and application, with sales and revenue, from 2024 to 2029.
Chapter 12, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War.
Chapter 13, the key raw materials and key suppliers, and industry chain of Die-level Packaging Equipment.
Chapter 14 and 15, to describe Die-level Packaging Equipment sales channel, distributors, customers, research findings and conclusion.