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According to our (Global Info Research) latest study, the global Die Bonder Equipment market size was valued at USD 813.8 million in 2023 and is forecast to a readjusted size of USD 960.3 million by 2030 with a CAGR of 2.4% during review period.
Die bonding is the process of attaching a die/chip to a substrate or package. Die bonding is accomplished by using one of the following processes: 1. Eutectic; 2. Solder; 3. Adhesive; 4. Glass or Silver-Glass
Die Bonder Equipment industry is highly concentrated, manufacturers are mostly in the Asia, Europe and US. Among them, Europe output volume accounted for more than 32% of the total output of global Die Bonder Equipment. Besi, ASM Pacific Technology(ASMPT), Kulicke & Soffa, Palomar Technologies, Shinkawa and DIAS Automation are the key manufacturers of Die Bonder Equipment. Besi is the world leading manufacturer in global Die Bonder Equipment market with the market share of 39%, in terms of revenue.
The Global Info Research report includes an overview of the development of the Die Bonder Equipment industry chain, the market status of Integrated Device Manufacturers (IDMs) (Fully Automatic Die Bonder, Semi-Automatic Die Bonder), Outsourced Semiconductor Assembly and Test (OSAT) (Fully Automatic Die Bonder, Semi-Automatic Die Bonder), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Die Bonder Equipment.
Regionally, the report analyzes the Die Bonder Equipment markets in key regions. North America and Europe are experiencing steady growth, driven by government initiatives and increasing consumer awareness. Asia-Pacific, particularly China, leads the global Die Bonder Equipment market, with robust domestic demand, supportive policies, and a strong manufacturing base.
Key Features:
The report presents comprehensive understanding of the Die Bonder Equipment market. It provides a holistic view of the industry, as well as detailed insights into individual components and stakeholders. The report analysis market dynamics, trends, challenges, and opportunities within the Die Bonder Equipment industry.
The report involves analyzing the market at a macro level:
Market Sizing and Segmentation: Report collect data on the overall market size, including the sales quantity (Units), revenue generated, and market share of different by Type (e.g., Fully Automatic Die Bonder, Semi-Automatic Die Bonder).
Industry Analysis: Report analyse the broader industry trends, such as government policies and regulations, technological advancements, consumer preferences, and market dynamics. This analysis helps in understanding the key drivers and challenges influencing the Die Bonder Equipment market.
Regional Analysis: The report involves examining the Die Bonder Equipment market at a regional or national level. Report analyses regional factors such as government incentives, infrastructure development, economic conditions, and consumer behaviour to identify variations and opportunities within different markets.
Market Projections: Report covers the gathered data and analysis to make future projections and forecasts for the Die Bonder Equipment market. This may include estimating market growth rates, predicting market demand, and identifying emerging trends.
The report also involves a more granular approach to Die Bonder Equipment:
Company Analysis: Report covers individual Die Bonder Equipment manufacturers, suppliers, and other relevant industry players. This analysis includes studying their financial performance, market positioning, product portfolios, partnerships, and strategies.
Consumer Analysis: Report covers data on consumer behaviour, preferences, and attitudes towards Die Bonder Equipment This may involve surveys, interviews, and analysis of consumer reviews and feedback from different by Application (Integrated Device Manufacturers (IDMs), Outsourced Semiconductor Assembly and Test (OSAT)).
Technology Analysis: Report covers specific technologies relevant to Die Bonder Equipment. It assesses the current state, advancements, and potential future developments in Die Bonder Equipment areas.
Competitive Landscape: By analyzing individual companies, suppliers, and consumers, the report present insights into the competitive landscape of the Die Bonder Equipment market. This analysis helps understand market share, competitive advantages, and potential areas for differentiation among industry players.
Market Validation: The report involves validating findings and projections through primary research, such as surveys, interviews, and focus groups.
Market Segmentation
Die Bonder Equipment market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value.
Market segment by Type
- Fully Automatic Die Bonder
- Semi-Automatic Die Bonder
- Manual Die Bonder
Market segment by Application
- Integrated Device Manufacturers (IDMs)
- Outsourced Semiconductor Assembly and Test (OSAT)
Major players covered
- Besi
- ASM Pacific Technology(ASMPT)
- Kulicke & Soffa
- Palomar Technologies
- Shinkawa
- DIAS Automation
- Toray Engineering
- Panasonic
- FASFORD TECHNOLOGY
- West-Bond
- Hybond
Market segment by region, regional analysis covers
- North America (United States, Canada and Mexico)
- Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
- Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
- South America (Brazil, Argentina, Colombia, and Rest of South America)
- Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Die Bonder Equipment product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Die Bonder Equipment, with price, sales, revenue and global market share of Die Bonder Equipment from 2019 to 2024.
Chapter 3, the Die Bonder Equipment competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Die Bonder Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2019 to 2030.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2019 to 2030.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2023.and Die Bonder Equipment market forecast, by regions, type and application, with sales and revenue, from 2025 to 2030.
Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Die Bonder Equipment.
Chapter 14 and 15, to describe Die Bonder Equipment sales channel, distributors, customers, research findings and conclusion.