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Chip-on-Flex, or COF, refers to the semiconductor assembly technology wherein the microchip or die is directly mounted on and electrically connected to a flexible circuit (a circuit built on a flexible substrate instead of the usual printed circuit board). Thus, in a COF assembly, the microchip doesn't have to go through all the traditional assembly steps required for individual IC packaging. This simplifies the over-all process of designing and manufacturing the final product while improving its performance as a result of the shorter interconnection paths.
Scope of the Report:
COF is the role of product through the flexible substrate and connected to on-chip liquid crystal panel, the liquid crystal panel and the control chip driver current, voltage, thus changing the state of the liquid crystal display different screens. Currently, COF products are widely used in LCD TVs, smart 3G phones and laptop computers and other products with LCD display driver.
Driven by a growing range of applications in the automotive, industrial, military, aerospace, computer, telecommunication, consumer electronics, and medical electronics industries, miniaturization and the use of flex circuits continue to be of prime interest to electronics manufacturers.
In China, COF manufactures mainly include Danbond Technology, AKM Industrial, Compass Technology Company and others. China is the world's third producer of COF and the world's biggest consumption market.
The worldwide market for Chip On Flex (COF) is expected to grow at a CAGR of roughly 4.4% over the next five years, will reach 1850 million US$ in 2024, from 1490 million US$ in 2019, according to a new GIR (Global Info Research) study.
This report focuses on the Chip On Flex (COF) in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
Market Segment by Manufacturers, this report covers
- Chipbond Technology
- Danbond Technology
- AKM Industrial
- Compass Technology Company
- STARS Microelectronics
Market Segment by Regions, regional analysis covers
- North America (United States, Canada and Mexico)
- Europe (Germany, France, UK, Russia and Italy)
- Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
- South America (Brazil, Argentina, Colombia etc.)
- Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
- Single sided COF
Market Segment by Applications, can be divided into
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Chip On Flex (COF) product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Chip On Flex (COF), with price, sales, revenue and global market share of Chip On Flex (COF) in 2017 and 2018.
Chapter 3, the Chip On Flex (COF) competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Chip On Flex (COF) breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2014 to 2019.
Chapter 5, 6, 7, 8 and 9, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2014 to 2019.
Chapter 10 and 11, to segment the sales by type and application, with sales market share and growth rate by type, application, from 2014 to 2019.
Chapter 12, Chip On Flex (COF) market forecast, by regions, type and application, with sales and revenue, from 2019 to 2024.
Chapter 13, 14 and 15, to describe Chip On Flex (COF) sales channel, distributors, customers, research findings and conclusion, appendix and data source.