Global and China 3D IC and 2.5D IC Market Size, Status and Forecast 2020-2026

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Date: 18-Sep-2020
No. of pages: 90
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Global 3D IC and 2.5D IC Scope and Market Size

3D IC and 2.5D IC market is segmented by Type, and by Application. Players, stakeholders, and other participants in the global 3D IC and 2.5D IC market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by Type and by Application in terms of revenue and forecast for the period 2015-2026.

Market segment by Type, the product can be split into

- 3D wafer-level chip-scale packaging

- 3D TSV

- 2.5D

Market segment by Application, split into

- Consumer electronics

- Telecommunication

- Industry sector

- Automotive

- Military and Aerospace

- Smart technologies

- Medical devices

Based on regional and country-level analysis, the 3D IC and 2.5D IC market has been segmented as follows:

- North America

- - United States

- - Canada

- Europe

- - Germany

- - France

- - U.K.

- - Italy

- - Russia

- - Nordic

- - Rest of Europe

- Asia-Pacific

- - China

- - Japan

- - South Korea

- - Southeast Asia

- - India

- - Australia

- - Rest of Asia-Pacific

- Latin America

- - Mexico

- - Brazil

- Middle East & Africa

- - Turkey

- - Saudi Arabia

- - UAE

- - Rest of Middle East & Africa

In the competitive analysis section of the report, leading as well as prominent players of the global 3D IC and 2.5D IC market are broadly studied on the basis of key factors. The report offers comprehensive analysis and accurate statistics on revenue by the player for the period 2015-2020. It also offers detailed analysis supported by reliable statistics on price and revenue (global level) by player for the period 2015-2020.

The key players covered in this study

- TSMC (Taiwan)

- Samsung (South Korea)

- Toshiba (Japan)

- ASE Group (Taiwan)

- Amkor (U.S.)

- UMC (Taiwan)

- Stmicroelectronics (Switzerland)

- Broadcom (U.S.)

- Intel (U.S.)

- Jiangsu Changjiang Electronics (China)

Global and China 3D IC and 2.5D IC Market Size, Status and Forecast 2020-2026

Table of Contents
1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global 3D IC and 2.5D IC Market Size Growth Rate by Type: 2020 VS 2026
1.2.2 3D wafer-level chip-scale packaging
1.2.3 3D TSV
1.2.4 2.5D
1.3 Market by Application
1.3.1 Global 3D IC and 2.5D IC Market Share by Application: 2020 VS 2026
1.3.2 Consumer electronics
1.3.3 Telecommunication
1.3.4 Industry sector
1.3.5 Automotive
1.3.6 Military and Aerospace
1.3.7 Smart technologies
1.3.8 Medical devices
1.4 Study Objectives
1.5 Years Considered
2 Global Growth Trends
2.1 Global 3D IC and 2.5D IC Market Perspective (2015-2026)
2.2 Global 3D IC and 2.5D IC Growth Trends by Regions
2.2.1 3D IC and 2.5D IC Market Size by Regions: 2015 VS 2020 VS 2026
2.2.2 3D IC and 2.5D IC Historic Market Share by Regions (2015-2020)
2.2.3 3D IC and 2.5D IC Forecasted Market Size by Regions (2021-2026)
2.3 Industry Trends and Growth Strategy
2.3.1 Market Trends
2.3.2 Market Drivers
2.3.3 Market Challenges
2.3.4 Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top 3D IC and 2.5D IC Players by Market Size
3.1.1 Global Top 3D IC and 2.5D IC Players by Revenue (2015-2020)
3.1.2 Global 3D IC and 2.5D IC Revenue Market Share by Players (2015-2020)
3.2 Global 3D IC and 2.5D IC Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
3.3 Players Covered: Ranking by 3D IC and 2.5D IC Revenue
3.4 Global 3D IC and 2.5D IC Market Concentration Ratio
3.4.1 Global 3D IC and 2.5D IC Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by 3D IC and 2.5D IC Revenue in 2019
3.5 Key Players 3D IC and 2.5D IC Area Served
3.6 Key Players 3D IC and 2.5D IC Product Solution and Service
3.7 Date of Enter into 3D IC and 2.5D IC Market
3.8 Mergers & Acquisitions, Expansion Plans
4 3D IC and 2.5D IC Breakdown Data by Type (2015-2026)
4.1 Global 3D IC and 2.5D IC Historic Market Size by Type (2015-2020)
4.2 Global 3D IC and 2.5D IC Forecasted Market Size by Type (2021-2026)
5 3D IC and 2.5D IC Breakdown Data by Application (2015-2026)
5.1 Global 3D IC and 2.5D IC Historic Market Size by Application (2015-2020)
5.2 Global 3D IC and 2.5D IC Forecasted Market Size by Application (2021-2026)
6 North America
6.1 North America 3D IC and 2.5D IC Market Size (2015-2026)
6.2 North America 3D IC and 2.5D IC Market Size by Type (2015-2020)
6.3 North America 3D IC and 2.5D IC Market Size by Application (2015-2020)
6.4 North America 3D IC and 2.5D IC Market Size by Country (2015-2020)
6.4.1 United States
6.4.2 Canada
7 Europe
7.1 Europe 3D IC and 2.5D IC Market Size (2015-2026)
7.2 Europe 3D IC and 2.5D IC Market Size by Type (2015-2020)
7.3 Europe 3D IC and 2.5D IC Market Size by Application (2015-2020)
7.4 Europe 3D IC and 2.5D IC Market Size by Country (2015-2020)
7.4.1 Germany
7.4.2 France
7.4.3 U.K.
7.4.4 Italy
7.4.5 Russia
7.4.6 Nordic
7.4.7 Rest of Europe
8 China
8.1 China 3D IC and 2.5D IC Market Size (2015-2026)
8.2 China 3D IC and 2.5D IC Market Size by Type (2015-2020)
8.3 China 3D IC and 2.5D IC Market Size by Application (2015-2020)
8.4 China 3D IC and 2.5D IC Market Size by Region (2015-2020)
8.4.1 China
8.4.2 Japan
8.4.3 South Korea
8.4.4 Southeast Asia
8.4.5 India
8.4.6 Australia
8.4.7 Rest of Asia-Pacific
9 Japan
9.1 Japan 3D IC and 2.5D IC Market Size (2015-2026)
9.2 Japan 3D IC and 2.5D IC Market Size by Type (2015-2020)
9.3 Japan 3D IC and 2.5D IC Market Size by Application (2015-2020)
9.4 Japan 3D IC and 2.5D IC Market Size by Country (2015-2020)
9.4.1 Mexico
9.4.2 Brazil
10 Southeast Asia
10.1 Southeast Asia 3D IC and 2.5D IC Market Size (2015-2026)
10.2 Southeast Asia 3D IC and 2.5D IC Market Size by Type (2015-2020)
10.3 Southeast Asia 3D IC and 2.5D IC Market Size by Application (2015-2020)
10.4 Southeast Asia 3D IC and 2.5D IC Market Size by Country (2015-2020)
10.4.1 Turkey
10.4.2 Saudi Arabia
10.4.3 UAE
10.4.4 Rest of Middle East & Africa
11 Key Players Profiles
11.1 TSMC (Taiwan)
11.1.1 TSMC (Taiwan) Company Details
11.1.2 TSMC (Taiwan) Business Overview
11.1.3 TSMC (Taiwan) 3D IC and 2.5D IC Introduction
11.1.4 TSMC (Taiwan) Revenue in 3D IC and 2.5D IC Business (2015-2020))
11.1.5 TSMC (Taiwan) Recent Development
11.2 Samsung (South Korea)
11.2.1 Samsung (South Korea) Company Details
11.2.2 Samsung (South Korea) Business Overview
11.2.3 Samsung (South Korea) 3D IC and 2.5D IC Introduction
11.2.4 Samsung (South Korea) Revenue in 3D IC and 2.5D IC Business (2015-2020)
11.2.5 Samsung (South Korea) Recent Development
11.3 Toshiba (Japan)
11.3.1 Toshiba (Japan) Company Details
11.3.2 Toshiba (Japan) Business Overview
11.3.3 Toshiba (Japan) 3D IC and 2.5D IC Introduction
11.3.4 Toshiba (Japan) Revenue in 3D IC and 2.5D IC Business (2015-2020)
11.3.5 Toshiba (Japan) Recent Development
11.4 ASE Group (Taiwan)
11.4.1 ASE Group (Taiwan) Company Details
11.4.2 ASE Group (Taiwan) Business Overview
11.4.3 ASE Group (Taiwan) 3D IC and 2.5D IC Introduction
11.4.4 ASE Group (Taiwan) Revenue in 3D IC and 2.5D IC Business (2015-2020)
11.4.5 ASE Group (Taiwan) Recent Development
11.5 Amkor (U.S.)
11.5.1 Amkor (U.S.) Company Details
11.5.2 Amkor (U.S.) Business Overview
11.5.3 Amkor (U.S.) 3D IC and 2.5D IC Introduction
11.5.4 Amkor (U.S.) Revenue in 3D IC and 2.5D IC Business (2015-2020)
11.5.5 Amkor (U.S.) Recent Development
11.6 UMC (Taiwan)
11.6.1 UMC (Taiwan) Company Details
11.6.2 UMC (Taiwan) Business Overview
11.6.3 UMC (Taiwan) 3D IC and 2.5D IC Introduction
11.6.4 UMC (Taiwan) Revenue in 3D IC and 2.5D IC Business (2015-2020)
11.6.5 UMC (Taiwan) Recent Development
11.7 Stmicroelectronics (Switzerland)
11.7.1 Stmicroelectronics (Switzerland) Company Details
11.7.2 Stmicroelectronics (Switzerland) Business Overview
11.7.3 Stmicroelectronics (Switzerland) 3D IC and 2.5D IC Introduction
11.7.4 Stmicroelectronics (Switzerland) Revenue in 3D IC and 2.5D IC Business (2015-2020)
11.7.5 Stmicroelectronics (Switzerland) Recent Development
11.8 Broadcom (U.S.)
11.8.1 Broadcom (U.S.) Company Details
11.8.2 Broadcom (U.S.) Business Overview
11.8.3 Broadcom (U.S.) 3D IC and 2.5D IC Introduction
11.8.4 Broadcom (U.S.) Revenue in 3D IC and 2.5D IC Business (2015-2020)
11.8.5 Broadcom (U.S.) Recent Development
11.9 Intel (U.S.)
11.9.1 Intel (U.S.) Company Details
11.9.2 Intel (U.S.) Business Overview
11.9.3 Intel (U.S.) 3D IC and 2.5D IC Introduction
11.9.4 Intel (U.S.) Revenue in 3D IC and 2.5D IC Business (2015-2020)
11.9.5 Intel (U.S.) Recent Development
11.10 Jiangsu Changjiang Electronics (China)
11.10.1 Jiangsu Changjiang Electronics (China) Company Details
11.10.2 Jiangsu Changjiang Electronics (China) Business Overview
11.10.3 Jiangsu Changjiang Electronics (China) 3D IC and 2.5D IC Introduction
11.10.4 Jiangsu Changjiang Electronics (China) Revenue in 3D IC and 2.5D IC Business (2015-2020)
11.10.5 Jiangsu Changjiang Electronics (China) Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
List of Tables
Table 1. Global 3D IC and 2.5D IC Market Size Growth Rate by Type (US$ Million): 2020 VS 2026
Table 3. Key Players of 3D wafer-level chip-scale packaging
Table 4. Key Players of 3D TSV
Table 5. Key Players of 2.5D
Table 6. Global 3D IC and 2.5D IC Market Size Growth by Application (US$ Million): 2020 VS 2026
Table 7. Global 3D IC and 2.5D IC Market Size by Regions (US$ Million): 2020 VS 2026
Table 8. Global 3D IC and 2.5D IC Market Size by Regions (2015-2020) (US$ Million)
Table 9. Global 3D IC and 2.5D IC Market Share by Regions (2015-2020)
Table 10. Global 3D IC and 2.5D IC Forecasted Market Size by Regions (2021-2026) (US$ Million)
Table 11. Global 3D IC and 2.5D IC Market Share by Regions (2021-2026)
Table 12. 3D IC and 2.5D IC Market Market Trends
Table 13. 3D IC and 2.5D IC Market Drivers
Table 14. 3D IC and 2.5D IC Market Challenges
Table 15. 3D IC and 2.5D IC Market Restraints
Table 16. Global 3D IC and 2.5D IC Revenue by Players (2015-2020) (US$ Million)
Table 17. Global 3D IC and 2.5D IC Market Share by Players (2015-2020)
Table 18. Global Top 3D IC and 2.5D IC Players by Company Type (Tier 1, Tier 2 and Tier 3) (based on the Revenue in 3D IC and 2.5D IC as of 2019)
Table 19. Global 3D IC and 2.5D IC by Players Market Concentration Ratio (CR5 and HHI)
Table 20. Key Players Headquarters and Area Served
Table 21. Key Players 3D IC and 2.5D IC Product Solution and Service
Table 22. Mergers & Acquisitions, Expansion Plans
Table 23. Global 3D IC and 2.5D IC Market Size by Type (2015-2020) (US$ Million)
Table 24. Global 3D IC and 2.5D IC Market Size Share by Type (2015-2020)
Table 25. Global 3D IC and 2.5D IC Revenue Market Share by Type (2021-2026)
Table 26. Global 3D IC and 2.5D IC Market Size Share by Application (2015-2020)
Table 27. Global 3D IC and 2.5D IC Market Size by Application (2015-2020) (US$ Million)
Table 28. Global 3D IC and 2.5D IC Market Size Share by Application (2021-2026)
Table 29. North America 3D IC and 2.5D IC Market Size by Type (2015-2020) (US$ Million)
Table 30. North America 3D IC and 2.5D IC Market Share by Type (2015-2020)
Table 31. North America 3D IC and 2.5D IC Market Size by Application (2015-2020) (US$ Million)
Table 32. North America 3D IC and 2.5D IC Market Share by Application (2015-2020)
Table 33. North America 3D IC and 2.5D IC Market Size by Country (US$ Million) (2015-2020)
Table 34. North America 3D IC and 2.5D IC Market Share by Country (2015-2020)
Table 35. Europe 3D IC and 2.5D IC Market Size by Type (2015-2020) (US$ Million)
Table 36. Europe 3D IC and 2.5D IC Market Share by Type (2015-2020)
Table 37. Europe 3D IC and 2.5D IC Market Size by Application (2015-2020) (US$ Million)
Table 38. Europe 3D IC and 2.5D IC Market Share by Application (2015-2020)
Table 39. Europe 3D IC and 2.5D IC Market Size by Country (US$ Million) (2015-2020)
Table 40. Europe 3D IC and 2.5D IC Market Share by Country (2015-2020)
Table 41. China 3D IC and 2.5D IC Market Size by Type (2015-2020) (US$ Million)
Table 42. China 3D IC and 2.5D IC Market Share by Type (2015-2020)
Table 43. China 3D IC and 2.5D IC Market Size by Application (2015-2020) (US$ Million)
Table 44. China 3D IC and 2.5D IC Market Share by Application (2015-2020)
Table 45. China 3D IC and 2.5D IC Market Size by Region (US$ Million) (2015-2020)
Table 46. China 3D IC and 2.5D IC Market Share by Region (2015-2020)
Table 47. Japan 3D IC and 2.5D IC Market Size by Type (2015-2020) (US$ Million)
Table 48. Japan 3D IC and 2.5D IC Market Share by Type (2015-2020)
Table 49. Japan 3D IC and 2.5D IC Market Size by Application (2015-2020) (US$ Million)
Table 50. Japan 3D IC and 2.5D IC Market Share by Application (2015-2020)
Table 51. Japan 3D IC and 2.5D IC Market Size by Country (US$ Million) (2015-2020)
Table 52. Japan 3D IC and 2.5D IC Market Share by Country (2015-2020)
Table 53. Southeast Asia 3D IC and 2.5D IC Market Size by Type (2015-2020) (US$ Million)
Table 54. Southeast Asia 3D IC and 2.5D IC Market Share by Type (2015-2020)
Table 55. Southeast Asia 3D IC and 2.5D IC Market Size by Application (2015-2020) (US$ Million)
Table 56. Southeast Asia 3D IC and 2.5D IC Market Share by Application (2015-2020)
Table 57. Southeast Asia 3D IC and 2.5D IC Market Size by Country (US$ Million) (2015-2020)
Table 58. Southeast Asia 3D IC and 2.5D IC Market Share by Country (2015-2020)
Table 59. TSMC (Taiwan) Company Details
Table 60. TSMC (Taiwan) Business Overview
Table 61. TSMC (Taiwan) Product
Table 62. TSMC (Taiwan) Revenue in 3D IC and 2.5D IC Business (2015-2020) (US$ Million)
Table 63. TSMC (Taiwan) Recent Development
Table 64. Samsung (South Korea) Company Details
Table 65. Samsung (South Korea) Business Overview
Table 66. Samsung (South Korea) Product
Table 67. Samsung (South Korea) Revenue in 3D IC and 2.5D IC Business (2015-2020) (US$ Million)
Table 68. Samsung (South Korea) Recent Development
Table 69. Toshiba (Japan) Company Details
Table 70. Toshiba (Japan) Business Overview
Table 71. Toshiba (Japan) Product
Table 72. Toshiba (Japan) Revenue in 3D IC and 2.5D IC Business (2015-2020) (US$ Million)
Table 73. Toshiba (Japan) Recent Development
Table 74. ASE Group (Taiwan) Company Details
Table 75. ASE Group (Taiwan) Business Overview
Table 76. ASE Group (Taiwan) Product
Table 77. ASE Group (Taiwan) Revenue in 3D IC and 2.5D IC Business (2015-2020) (US$ Million)
Table 78. ASE Group (Taiwan) Recent Development
Table 79. Amkor (U.S.) Company Details
Table 80. Amkor (U.S.) Business Overview
Table 81. Amkor (U.S.) Product
Table 82. Amkor (U.S.) Revenue in 3D IC and 2.5D IC Business (2015-2020) (US$ Million)
Table 83. Amkor (U.S.) Recent Development
Table 84. UMC (Taiwan) Company Details
Table 85. UMC (Taiwan) Business Overview
Table 86. UMC (Taiwan) Product
Table 87. UMC (Taiwan) Revenue in 3D IC and 2.5D IC Business (2015-2020) (US$ Million)
Table 88. UMC (Taiwan) Recent Development
Table 89. Stmicroelectronics (Switzerland) Company Details
Table 90. Stmicroelectronics (Switzerland) Business Overview
Table 91. Stmicroelectronics (Switzerland) Product
Table 92. Stmicroelectronics (Switzerland) Revenue in 3D IC and 2.5D IC Business (2015-2020) (US$ Million)
Table 93. Stmicroelectronics (Switzerland) Recent Development
Table 94. Broadcom (U.S.) Business Overview
Table 95. Broadcom (U.S.) Product
Table 96. Broadcom (U.S.) Company Details
Table 97. Broadcom (U.S.) Revenue in 3D IC and 2.5D IC Business (2015-2020) (US$ Million)
Table 98. Broadcom (U.S.) Recent Development
Table 99. Intel (U.S.) Company Details
Table 100. Intel (U.S.) Business Overview
Table 101. Intel (U.S.) Product
Table 102. Intel (U.S.) Revenue in 3D IC and 2.5D IC Business (2015-2020) (US$ Million)
Table 103. Intel (U.S.) Recent Development
Table 104. Jiangsu Changjiang Electronics (China) Company Details
Table 105. Jiangsu Changjiang Electronics (China) Business Overview
Table 106. Jiangsu Changjiang Electronics (China) Product
Table 107. Jiangsu Changjiang Electronics (China) Revenue in 3D IC and 2.5D IC Business (2015-2020) (US$ Million)
Table 108. Jiangsu Changjiang Electronics (China) Recent Development
Table 109. Research Programs/Design for This Report
Table 110. Key Data Information from Secondary Sources
Table 111. Key Data Information from Primary Sources
List of Figures
Figure 1. Global 3D IC and 2.5D IC Market Share by Type: 2020 VS 2026
Figure 2. 3D wafer-level chip-scale packaging Features
Figure 3. 3D TSV Features
Figure 4. 2.5D Features
Figure 5. Global 3D IC and 2.5D IC Market Share by Application: 2020 VS 2026
Figure 6. Consumer electronics Case Studies
Figure 7. Telecommunication Case Studies
Figure 8. Industry sector Case Studies
Figure 9. Automotive Case Studies
Figure 10. Military and Aerospace Case Studies
Figure 11. Smart technologies Case Studies
Figure 12. Medical devices Case Studies
Figure 13. 3D IC and 2.5D IC Report Years Considered
Figure 14. Global 3D IC and 2.5D IC Market Size (US$ Million), YoY Growth 2015-2026
Figure 15. Global 3D IC and 2.5D IC Market Share by Regions: 2020 VS 2026
Figure 16. Global 3D IC and 2.5D IC Market Share by Regions (2021-2026)
Figure 17. Global 3D IC and 2.5D IC Market Share by Players in 2019
Figure 18. Global Top 3D IC and 2.5D IC Players by Company Type (Tier 1, Tier 2 and Tier 3) (based on the Revenue in 3D IC and 2.5D IC as of 2019
Figure 19. The Top 10 and 5 Players Market Share by 3D IC and 2.5D IC Revenue in 2019
Figure 20. North America 3D IC and 2.5D IC Market Size YoY Growth (2015-2026) & (US$ Million)
Figure 21. United States 3D IC and 2.5D IC Market Size YoY Growth (2015-2026) & (US$ Million)
Figure 22. Canada 3D IC and 2.5D IC Market Size YoY Growth (2015-2026) & (US$ Million)
Figure 23. Europe 3D IC and 2.5D IC Market Size YoY Growth (2015-2026) & (US$ Million)
Figure 24. Germany 3D IC and 2.5D IC Market Size YoY Growth (2015-2026) & (US$ Million)
Figure 25. France 3D IC and 2.5D IC Market Size YoY Growth (2015-2026) & (US$ Million)
Figure 26. U.K. 3D IC and 2.5D IC Market Size YoY Growth (2015-2026) & (US$ Million)
Figure 27. Italy 3D IC and 2.5D IC Market Size YoY Growth (2015-2026) & (US$ Million)
Figure 28. Russia 3D IC and 2.5D IC Market Size YoY Growth (2015-2026) & (US$ Million)
Figure 29. Nordic 3D IC and 2.5D IC Market Size YoY Growth (2015-2026) & (US$ Million)
Figure 30. Rest of Europe 3D IC and 2.5D IC Market Size YoY Growth (2015-2026) & (US$ Million)
Figure 31. Asia-Pacific 3D IC and 2.5D IC Market Size YoY Growth (2015-2026) & (US$ Million)
Figure 32. China 3D IC and 2.5D IC Market Size YoY Growth (2015-2026) & (US$ Million)
Figure 33. Japan 3D IC and 2.5D IC Market Size YoY Growth (2015-2026) & (US$ Million)
Figure 34. South Korea 3D IC and 2.5D IC Market Size YoY Growth (2015-2026) & (US$ Million)
Figure 35. Southeast Asia 3D IC and 2.5D IC Market Size YoY Growth (2015-2026) & (US$ Million)
Figure 36. India 3D IC and 2.5D IC Market Size YoY Growth (2015-2026) & (US$ Million)
Figure 37. Australia 3D IC and 2.5D IC Market Size YoY Growth (2015-2026) & (US$ Million)
Figure 38. Rest of Asia-Pacific 3D IC and 2.5D IC Market Size YoY Growth (2015-2026) & (US$ Million)
Figure 39. Latin America 3D IC and 2.5D IC Market Size YoY Growth (2015-2026) & (US$ Million)
Figure 40. Mexico 3D IC and 2.5D IC Market Size YoY Growth (2015-2026) & (US$ Million)
Figure 41. Brazil 3D IC and 2.5D IC Market Size YoY Growth (2015-2026) & (US$ Million)
Figure 42. Middle East & Africa 3D IC and 2.5D IC Market Size YoY Growth (2015-2026) & (US$ Million)
Figure 43. Turkey 3D IC and 2.5D IC Market Size YoY Growth (2015-2026) & (US$ Million)
Figure 44. Saudi Arabia 3D IC and 2.5D IC Market Size YoY Growth (2015-2026) & (US$ Million)
Figure 45. UAE 3D IC and 2.5D IC Market Size YoY Growth (2015-2026) & (US$ Million)
Figure 46. Rest of Middle East & Africa 3D IC and 2.5D IC Market Size YoY Growth (2015-2026) & (US$ Million)
Figure 47. TSMC (Taiwan) Revenue Growth Rate in 3D IC and 2.5D IC Business (2015-2020)
Figure 48. Samsung (South Korea) Revenue Growth Rate in 3D IC and 2.5D IC Business (2015-2020)
Figure 49. Toshiba (Japan) Revenue Growth Rate in 3D IC and 2.5D IC Business (2015-2020)
Figure 50. ASE Group (Taiwan) Revenue Growth Rate in 3D IC and 2.5D IC Business (2015-2020)
Figure 51. Amkor (U.S.) Revenue Growth Rate in 3D IC and 2.5D IC Business (2015-2020)
Figure 52. UMC (Taiwan) Revenue Growth Rate in 3D IC and 2.5D IC Business (2015-2020)
Figure 53. Stmicroelectronics (Switzerland) Revenue Growth Rate in 3D IC and 2.5D IC Business (2015-2020)
Figure 54. Broadcom (U.S.) Revenue Growth Rate in 3D IC and 2.5D IC Business (2015-2020)
Figure 55. Intel (U.S.) Revenue Growth Rate in 3D IC and 2.5D IC Business (2015-2020)
Figure 56. Jiangsu Changjiang Electronics (China) Revenue Growth Rate in 3D IC and 2.5D IC Business (2015-2020)
Figure 57. Bottom-up and Top-down Approaches for This Report
Figure 58. Data Triangulation
Figure 59. Key Executives Interviewed
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    The global Brushless AC Motor market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during The forecast period 2024-2030. North American market for Brushless AC Motor is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during The forecast period of 2024 through 2030. Asia-Pacific market for Brushless AC Motor is estimated to increase from $ million in 2023 to reach $ million by 2......
  • Global High Intensity Discharge (HID) Lamps Market Research Report 2024
    Published: 10-Jan-2024        Price: US 2900 Onwards        Pages: 116
    The global High Intensity Discharge (HID) Lamps market was valued at US$ 6405.5 million in 2023 and is anticipated to reach US$ 7607.6 million by 2030, witnessing a CAGR of 2.5% during The forecast period 2024-2030. North American market for High Intensity Discharge (HID) Lamps is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during The forecast period of 2024 through 2030. Asia-Pacific market for High Intensity Discharge (HID) Lamps ......
  • Global Indoor Plant Lighting Market Research Report 2024
    Published: 10-Jan-2024        Price: US 2900 Onwards        Pages: 114
    The global Indoor Plant Lighting market was valued at US$ 806 million in 2023 and is anticipated to reach US$ 1137.9 million by 2030, witnessing a CAGR of 4.9% during The forecast period 2024-2030. Indoor plant lighting refers to The use of artificial light sources to provide The necessary light spectrum for The growth of plants indoors, especially in environments where natural sunlight is limited. This is commonly used for growing plants like houseplants, herbs, and even some veget......
  • Global Aquarium Lights Market Research Report 2024
    Published: 10-Jan-2024        Price: US 2900 Onwards        Pages: 131
    The global Aquarium Lights market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during The forecast period 2024-2030. North American market for Aquarium Lights is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during The forecast period of 2024 through 2030. Asia-Pacific market for Aquarium Lights is estimated to increase from $ million in 2023 to reach $ million by 2030, at a......
  • Global LED Aquarium Lighting Market Research Report 2024
    Published: 10-Jan-2024        Price: US 2900 Onwards        Pages: 128
    Aquarium light is also called water plants grow light, which is a new emerging light tool instead of sunshine in The last 5 years. According to The law of water plant growth, aquarium light can meet The light needs of many water plants. What's more, this lighting tool can provide The best lighting solution for aquarium, fish view. The global LED Aquarium Lighting market was valued at US$ 200 million in 2023 and is anticipated to reach US$ 283.4 million by 2030, witnessing a CAGR of ......
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