Fan-Out Wafer Level Packaging Market in US - Industry Outlook and Forecast 2020-2026

Publisher Name :
Date: 28-May-2020
No. of pages: 92

The Fan-Out WLP technique involves cutting and separating the chip and then embedding the chip inside the panel. The procedure is to attach the chip face down to the Carrier, and the chip spacing should conform to the Pitch specification of the circuit design, while the receiver performs Molding to form a Panel. Follow-up will be separation, sealant panel and a vehicle for sealant panel Wafer shape, also called reconstruct Wafer (Reconstituted Wafer), can be widely used standard Wafer process, need is formed on the sealant panel circuit design. Since the area of the sealing panel is larger than that of the chip, not only can I/O contacts be made into the wafer area by Fan-In method; It can also be Fanned Out on a plastic mold to accommodate more I/O contacts.

This report contains market size and forecasts of Fan-Out Wafer Level Packaging in US, including the following market information:

US Fan-Out Wafer Level Packaging Market Revenue, 2015-2020, 2021-2026, ($ millions)

Top Five Competitors in US Fan-Out Wafer Level Packaging Market 2019 (%)

The global Fan-Out Wafer Level Packaging market was valued at 978 million in 2019 and is projected to reach US$ 1978.1 million by 2026, at a CAGR of 19.3% during the forecast period. While the Fan-Out Wafer Level Packaging market size in US was US$ XX million in 2019, and it is expected to reach US$ XX million by the end of 2026, with a CAGR of XX% during 2020-2026.

COVID-19 pandemic has big impact on Fan-Out Wafer Level Packaging businesses, with lots of challenges and uncertainty faced by many players of Fan-Out Wafer Level Packaging in US. This report also analyses and evaluates the COVID-19 impact on Fan-Out Wafer Level Packaging market size in 2020 and the next few years in US

Total Market by Segment:

US Fan-Out Wafer Level Packaging Market, By Type, 2015-2020, 2021-2026 ($ millions)

US Fan-Out Wafer Level Packaging Market Segment Percentages, By Type, 2019 (%)

- High Density Fan-Out Package

- Core Fan-Out Package

US Fan-Out Wafer Level Packaging Market, By Application, 2015-2020, 2021-2026 ($ millions)

US Fan-Out Wafer Level Packaging Market Segment Percentages, By Application, 2019 (%)

- CMOS Image Sensor

- A Wireless Connection

- Logic and Memory Integrated Circuits

- Mems and Sensors

- Analog and Hybrid Integrated Circuits

- Others

Competitor Analysis

The report also provides analysis of leading market participants including:

Total Fan-Out Wafer Level Packaging Market Competitors Revenues in US, by Players 2015-2020 (Estimated), ($ millions)

Total Fan-Out Wafer Level Packaging Market Competitors Revenues Share in US, by Players 2019 (%)

Further, the report presents profiles of competitors in the market, including the following:

- TSMC

- ASE Technology Holding Co.

- JCET Group

- Amkor Technology

- Siliconware Technology (SuZhou) Co.

Fan-Out Wafer Level Packaging Market in US - Industry Outlook and Forecast 2020-2026

Table of Contents

1 Introduction to Research & Analysis Reports
1.1 Fan-Out Wafer Level Packaging Market Definition
1.2 Market Segments
1.2.1 Segment by Type
1.2.2 Segment by Application
1.3 COVID-19 Impact: US Fan-Out Wafer Level Packaging Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats

2 US Fan-Out Wafer Level Packaging Overall Market Size
2.1 US Fan-Out Wafer Level Packaging Market Size: 2020 VS 2026
2.2 US Fan-Out Wafer Level Packaging Revenue, Prospects & Forecasts: 2015-2026

3 Company Landscape
3.1 Top Fan-Out Wafer Level Packaging Players in US (including Foreign and Local Companies)
3.2 Top US Fan-Out Wafer Level Packaging Companies Ranked by Revenue
3.3 US Fan-Out Wafer Level Packaging Revenue by Companies (including Foreign and Local Companies)
3.4 Top 3 and Top 5 Fan-Out Wafer Level Packaging Companies in US, by Revenue in 2019
3.5 US Manufacturers Fan-Out Wafer Level Packaging Product Type
3.6 Tier 1, Tier 2 and Tier 3 Fan-Out Wafer Level Packaging Players in US
3.6.1 List of US Tier 1 Fan-Out Wafer Level Packaging Companies
3.6.2 List of US Tier 2 and Tier 3 Fan-Out Wafer Level Packaging Companies

4 Sights by Product
4.1 Overview
4.1.1 By Type - US Fan-Out Wafer Level Packaging Market Size Markets, 2020 & 2026
4.1.2 High Density Fan-Out Package
4.1.3 Core Fan-Out Package
4.2 By Type - US Fan-Out Wafer Level Packaging Revenue & Forecasts
4.2.1 By Type - US Fan-Out Wafer Level Packaging Revenue, 2015-2020
4.2.2 By Type - US Fan-Out Wafer Level Packaging Revenue, 2021-2026
4.2.3 By Type - US Fan-Out Wafer Level Packaging Revenue Market Share, 2015-2026
5 Sights by Application
5.1 Overview
5.1.1 By Application - US Fan-Out Wafer Level Packaging Market Size, 2020 & 2026
5.1.2 CMOS Image Sensor
5.1.3 A Wireless Connection
5.1.4 Logic and Memory Integrated Circuits
5.1.5 Mems and Sensors
5.1.6 Analog and Hybrid Integrated Circuits
5.1.7 Others
5.2 By Application - US Fan-Out Wafer Level Packaging Revenue & Forecasts
5.2.1 By Application - US Fan-Out Wafer Level Packaging Revenue, 2015-2020
5.2.2 By Application - US Fan-Out Wafer Level Packaging Revenue, 2021-2026
5.2.3 By Application - US Fan-Out Wafer Level Packaging Revenue Market Share, 2015-2026
6 Players Profiles
6.1 TSMC
6.1.1 TSMC Corporate Summary
6.1.2 TSMC Business Overview
6.1.3 TSMC Fan-Out Wafer Level Packaging Major Product Offerings
6.1.4 TSMC Revenue in US (2015-2020)
6.1.5 TSMC Key News
6.2 ASE Technology Holding Co.
6.2.1 ASE Technology Holding Co. Corporate Summary
6.2.2 ASE Technology Holding Co. Business Overview
6.2.3 ASE Technology Holding Co. Fan-Out Wafer Level Packaging Major Product Offerings
6.2.4 ASE Technology Holding Co. Revenue in US (2015-2020)
6.2.5 ASE Technology Holding Co. Key News
6.3 JCET Group
6.3.1 JCET Group Corporate Summary
6.3.2 JCET Group Business Overview
6.3.3 JCET Group Fan-Out Wafer Level Packaging Major Product Offerings
6.3.4 JCET Group Revenue in US (2015-2020)
6.3.5 JCET Group Key News
6.4 Amkor Technology
6.4.1 Amkor Technology Corporate Summary
6.4.2 Amkor Technology Business Overview
6.4.3 Amkor Technology Fan-Out Wafer Level Packaging Major Product Offerings
6.4.4 Amkor Technology Revenue in US (2015-2020)
6.4.5 Amkor Technology Key News
6.5 Siliconware Technology (SuZhou) Co.
6.5.1 Siliconware Technology (SuZhou) Co. Corporate Summary
6.5.2 Siliconware Technology (SuZhou) Co. Business Overview
6.5.3 Siliconware Technology (SuZhou) Co. Fan-Out Wafer Level Packaging Major Product Offerings
6.5.4 Siliconware Technology (SuZhou) Co. Revenue in US (2015-2020)
6.5.5 Siliconware Technology (SuZhou) Co. Key News
6.6 Nepes
6.6.1 Nepes Corporate Summary
6.6.2 Nepes Business Overview
6.6.3 Nepes Fan-Out Wafer Level Packaging Major Product Offerings
6.6.4 Nepes Revenue in US (2015-2020)
6.6.5 Nepes Key News

7 Key Market Trends & Influences 2021-2026
7.1 PESTLE Analysis for US Fan-Out Wafer Level Packaging Market
7.2 Market Opportunities & Trends
7.3 Market Drivers
7.4 Market Restraints

8 Conclusion

9 Appendix
9.1 Note
9.2 Examples of Clients
9.3 Disclaimer

List of Tables
Table 1. Key Players of Fan-Out Wafer Level Packaging in US
Table 2. Top Players in US, Ranking by Revenue (2019)
Table 3. US Fan-Out Wafer Level Packaging Revenue by Companies, (US$, Mn), 2015-2020
Table 4. US Fan-Out Wafer Level Packaging Revenue Share by Companies, 2015-2020
Table 5. US Fan-Out Wafer Level Packaging Sales by Companies, (K Units), 2015-2020
Table 6. US Fan-Out Wafer Level Packaging Sales Share by Companies, 2015-2020
Table 7. Key Manufacturers Fan-Out Wafer Level Packaging Price (2015-2020) (US$/Unit)
Table 8. US Manufacturers Fan-Out Wafer Level Packaging Product Type
Table 9. List of US Tier 1 Fan-Out Wafer Level Packaging Companies, Revenue (US$, Mn) in 2019 and Market Share
Table 10. List of US Tier 2 and Tier 3 Fan-Out Wafer Level Packaging Companies, Revenue (US$, Mn) in 2019 and Market Share
Table 11. By Type - Fan-Out Wafer Level Packaging Revenue in US (US$, Mn), 2015-2020
Table 12. By Type - Fan-Out Wafer Level Packaging Revenue in US (US$, Mn), 2021-2026
Table 13. By Type - Fan-Out Wafer Level Packaging Sales in US (K Units), 2015-2020
Table 14. By Type - Fan-Out Wafer Level Packaging Sales in US (K Units), 2021-2026
Table 15. By Application - Fan-Out Wafer Level Packaging Revenue in US, (US$, Mn), 2015-2020
Table 16. By Application - Fan-Out Wafer Level Packaging Revenue in US, (US$, Mn), 2021-2026
Table 17. By Application - Fan-Out Wafer Level Packaging Sales in US, (K Units), 2015-2020
Table 18. By Application - Fan-Out Wafer Level Packaging Sales in US, (K Units), 2021-2026
Table 19. TSMC Corporate Summary
Table 20. TSMC Fan-Out Wafer Level Packaging Product Offerings
Table 21. TSMC Fan-Out Wafer Level Packaging Revenue (US$, Mn), (2015-2020)
Table 22. ASE Technology Holding Co. Corporate Summary
Table 23. ASE Technology Holding Co. Fan-Out Wafer Level Packaging Product Offerings
Table 24. ASE Technology Holding Co. Fan-Out Wafer Level Packaging Revenue (US$, Mn), (2015-2020)
Table 25. JCET Group Corporate Summary
Table 26. JCET Group Fan-Out Wafer Level Packaging Product Offerings
Table 27. JCET Group Fan-Out Wafer Level Packaging Revenue (US$, Mn), (2015-2020)
Table 28. Amkor Technology Corporate Summary
Table 29. Amkor Technology Fan-Out Wafer Level Packaging Product Offerings
Table 30. Amkor Technology Fan-Out Wafer Level Packaging Revenue (US$, Mn), (2015-2020)
Table 31. Siliconware Technology (SuZhou) Co. Corporate Summary
Table 32. Siliconware Technology (SuZhou) Co. Fan-Out Wafer Level Packaging Product Offerings
Table 33. Siliconware Technology (SuZhou) Co. Fan-Out Wafer Level Packaging Revenue (US$, Mn), (2015-2020)
Table 34. Nepes Corporate Summary
Table 35. Nepes Fan-Out Wafer Level Packaging Product Offerings
Table 36. Nepes Fan-Out Wafer Level Packaging Revenue (US$, Mn), (2015-2020)
List of Figures
Figure 1. Fan-Out Wafer Level Packaging Segment by Type
Figure 2. Fan-Out Wafer Level Packaging Segment by Application
Figure 3. US Fan-Out Wafer Level Packaging Market Overview: 2020
Figure 4. Key Caveats
Figure 5. Fan-Out Wafer Level Packaging Market Size in US, (US$, Mn): 2020 VS 2026
Figure 6. US Fan-Out Wafer Level Packaging Revenue, 2015-2026 (US$, Mn)
Figure 7. The Top 3 and 5 Players Market Share by Fan-Out Wafer Level Packaging Revenue in 2019
Figure 8. By Type - US Fan-Out Wafer Level Packaging Incremental Growth, (US$, Mn), 2015-2026
Figure 9. By Type - US Fan-Out Wafer Level Packaging Market Share, 2015-2026
Figure 10. By Application - Fan-Out Wafer Level Packaging Revenue in US (US$, Mn), 2020 & 2026
Figure 11. By Application - US Fan-Out Wafer Level Packaging Market Share, 2015-2026
Figure 12. PEST Analysis for US Fan-Out Wafer Level Packaging Market in 2020
Figure 13. Fan-Out Wafer Level Packaging Market Opportunities & Trends in US
Figure 14. Fan-Out Wafer Level Packaging Market Drivers in US
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