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Summary
Low pressure molding with polyamides is a process typically used to encapsulate and environmentally protect electronic components (such as circuit boards). The purpose is to protect electronics against moisture, dust dirt and vibration. It is also used for sealing connectors and molding grommets and strain reliefs.
This report includes market status and forecast of global and major regions, with introduction of vendors, regions, product types and end industries; and this report counts product types and end industries in global and major regions.
The report includes as follows:
The report provides current data, historical overview and future forecast.
The report includes an in-depth analysis of the Global market for Low Pressure Molding with Polyamides , covering Global total and major region markets.
The data of 2017-2025 are included. All-inclusive market are given through data on sales, consumption, and prices (Global total and
By major regions).
The report provides introduction of leading Global manufacturers.
Low Pressure Molding with Polyamides market prospects to 2025 are included (in sales, consumption and price).
Market Segment as follows:
By Region / Countries
- North America (U.S., Canada, Mexico)
- Europe (Germany, U.K., France, Italy, Russia, Spain etc)
- Asia-Pacific (China, India, Japan, Southeast Asia etc)
- South America (Brazil, Argentina etc)
- Middle East & Africa (Saudi Arabia, South Africa etc)
By Type
- Black Type
- Amber Type
- Others
By End-User / Application
- Electronics
- Automotive
- Textile industry
- Others
By Company
- Henkel
- Bostik
- MoldMan
- SUNTIP
- Austromelt
- Rixin Fine Synthetic Material
- Taiyu Alwayseal Technology
- KY Chemical