COVID-19 Impact on 3D IC and 2.5D IC Packaging Market, Global Research Reports 2020-2021

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Date: 26-May-2020
No. of pages: 99
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This report covers market size and forecasts of 3D IC and 2.5D IC Packaging, including the following market information:

  • Global 3D IC and 2.5D IC Packaging Market Size, 2019-2021, and 2020 (quarterly data), (US$ Million) & (Units)

  • Global 3D IC and 2.5D IC Packaging Market Size by Type and by Application, 2019-2021, and 2020 (quarterly data), (US$ Million) & (Units)

  • Global 3D IC and 2.5D IC Packaging Market Size by Region (and Key Countries), 2019-2021, and 2020 (quarterly data), (US$ Million) & (Units)

  • Global 3D IC and 2.5D IC Packaging Market Size by Company, 2019- 2020 (quarterly data), (US$ Million) & (Units)

Key market players

Major competitors identified in this market include Taiwan Semiconductor, Samsung Electronics, Toshiba Corp, Advanced Semiconductor Engineering, Amkor Technology, etc.

Based on the Region:

  • Asia-Pacific (China, Japan, South Korea, India and ASEAN)

  • North America (US and Canada)

  • Europe (Germany, France, UK and Italy)

  • Rest of World (Latin America, Middle East & Africa)

Based on the Type:

  • 3D wafer-level chip-scale packaging

  • 3D TSV

  • 2.5D

Based on the Application:

  • Logic

  • Imaging & optoelectronics

  • Memory

  • MEMS/sensors

  • LED

  • Power

COVID-19 Impact on 3D IC and 2.5D IC Packaging Market, Global Research Reports 2020-2021

Table of Contents
1.1 Research Scope
1.2 Market Segmentation
1.3 Research Objectives
1.4 Research Methodology
1.4.1 Research Process
1.4.2 Data Triangulation
1.4.3 Research Approach
1.4.4 Base Year
1.5 Coronavirus Disease 2019 (Covid-19) Impact Will Have a Severe Impact on Global Growth
1.5.1 Covid-19 Impact: Global GDP Growth, 2019, 2020 and 2021 Projections
1.5.2 Covid-19 Impact: Commodity Prices Indices
1.5.3 Covid-19 Impact: Global Major Government Policy
1.6 The Covid-19 Impact on 3D IC and 2.5D IC Packaging Industry
1.7 COVID-19 Impact: 3D IC and 2.5D IC Packaging Market Trends
2 Global 3D IC and 2.5D IC Packaging Quarterly Market Size Analysis
2.1 3D IC and 2.5D IC Packaging Business Impact Assessment - COVID-19
2.1.1 Global 3D IC and 2.5D IC Packaging Market Size, Pre-COVID-19 and Post- COVID-19 Comparison, 2015-2026
2.1.2 Global 3D IC and 2.5D IC Packaging Price, Pre-COVID-19 and Post- COVID-19 Comparison, 2015-2026
2.2 Global 3D IC and 2.5D IC Packaging Quarterly Market Size 2020-2021
2.3 COVID-19-Driven Market Dynamics and Factor Analysis
2.3.1 Drivers
2.3.2 Restraints
2.3.3 Opportunities
2.3.4 Challenges
3 Quarterly Competitive Assessment, 2020
3.1 Global 3D IC and 2.5D IC Packaging Quarterly Market Size by Manufacturers, 2019 VS 2020
3.2 Global 3D IC and 2.5D IC Packaging Factory Price by Manufacturers
3.3 Location of Key Manufacturers 3D IC and 2.5D IC Packaging Manufacturing Factories and Area Served
3.4 Date of Key Manufacturers Enter into 3D IC and 2.5D IC Packaging Market
3.5 Key Manufacturers 3D IC and 2.5D IC Packaging Product Offered
3.6 Mergers & Acquisitions, Expansion Plans
4 Impact of Covid-19 on 3D IC and 2.5D IC Packaging Segments, By Type
4.1 Introduction
1.4.1 3D wafer-level chip-scale packaging
1.4.2 3D TSV
1.4.3 2.5D
4.2 By Type, Global 3D IC and 2.5D IC Packaging Market Size, 2019-2021
4.2.1 By Type, Global 3D IC and 2.5D IC Packaging Market Size by Type, 2020-2021
4.2.2 By Type, Global 3D IC and 2.5D IC Packaging Price, 2020-2021
5 Impact of Covid-19 on 3D IC and 2.5D IC Packaging Segments, By Application
5.1 Overview
5.5.1 Logic
5.5.2 Imaging & optoelectronics
5.5.3 Memory
5.5.4 MEMS/sensors
5.5.5 LED
5.5.6 Power
5.2 By Application, Global 3D IC and 2.5D IC Packaging Market Size, 2019-2021
5.2.1 By Application, Global 3D IC and 2.5D IC Packaging Market Size by Application, 2019-2021
5.2.2 By Application, Global 3D IC and 2.5D IC Packaging Price, 2020-2021
6 Geographic Analysis
6.1 Introduction
6.2 North America
6.2.1 Macroeconomic Indicators of US
6.2.2 US
6.2.3 Canada
6.3 Europe
6.3.1 Macroeconomic Indicators of Europe
6.3.2 Germany
6.3.3 France
6.3.4 UK
6.3.5 Italy
6.4 Asia-Pacific
6.4.1 Macroeconomic Indicators of Asia-Pacific
6.4.2 China
6.4.3 Japan
6.4.4 South Korea
6.4.5 India
6.4.6 ASEAN
6.5 Rest of World
6.5.1 Latin America
6.5.2 Middle East and Africa
7 Company Profiles
7.1 Taiwan Semiconductor
7.1.1 Taiwan Semiconductor Business Overview
7.1.2 Taiwan Semiconductor 3D IC and 2.5D IC Packaging Quarterly Production and Revenue, 2020
7.1.3 Taiwan Semiconductor 3D IC and 2.5D IC Packaging Product Introduction
7.1.4 Taiwan Semiconductor Response to COVID-19 and Related Developments
7.2 Samsung Electronics
7.2.1 Samsung Electronics Business Overview
7.2.2 Samsung Electronics 3D IC and 2.5D IC Packaging Quarterly Production and Revenue, 2020
7.2.3 Samsung Electronics 3D IC and 2.5D IC Packaging Product Introduction
7.2.4 Samsung Electronics Response to COVID-19 and Related Developments
7.3 Toshiba Corp
7.3.1 Toshiba Corp Business Overview
7.3.2 Toshiba Corp 3D IC and 2.5D IC Packaging Quarterly Production and Revenue, 2020
7.3.3 Toshiba Corp 3D IC and 2.5D IC Packaging Product Introduction
7.3.4 Toshiba Corp Response to COVID-19 and Related Developments
7.4 Advanced Semiconductor Engineering
7.4.1 Advanced Semiconductor Engineering Business Overview
7.4.2 Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Quarterly Production and Revenue, 2020
7.4.3 Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Product Introduction
7.4.4 Advanced Semiconductor Engineering Response to COVID-19 and Related Developments
7.5 Amkor Technology
7.5.1 Amkor Technology Business Overview
7.5.2 Amkor Technology 3D IC and 2.5D IC Packaging Quarterly Production and Revenue, 2020
7.5.3 Amkor Technology 3D IC and 2.5D IC Packaging Product Introduction
7.5.4 Amkor Technology Response to COVID-19 and Related Developments
8 Supply Chain and Sales Channels Analysis
8.1 3D IC and 2.5D IC Packaging Supply Chain Analysis
8.1.1 3D IC and 2.5D IC Packaging Supply Chain Analysis
8.1.2 Covid-19 Impact on 3D IC and 2.5D IC Packaging Supply Chain
8.2 Distribution Channels Analysis
8.2.1 3D IC and 2.5D IC Packaging Distribution Channels
8.2.2 Covid-19 Impact on 3D IC and 2.5D IC Packaging Distribution Channels
8.2.3 3D IC and 2.5D IC Packaging Distributors
8.3 3D IC and 2.5D IC Packaging Customers
9 Key Findings
10 Appendix
10.1 About Us
10.2 Disclaimer
List of Tables

Table 1. Overview of the World Economic Outlook Projections
Table 2. Summary of World Real per Capita Output (Annual percent change; in international currency at purchasing power parity)
Table 3. European Economies: Real GDP, Consumer Prices, Current Account Balance, and Unemployment (Annual percent change, unless noted otherwise)
Table 4. Asian and Pacific Economies: Real GDP, Consumer Prices, Current Account Balance, and Unemployment (Annual percent change, unless noted otherwise)
Table 5. Western Hemisphere Economies: Real GDP, Consumer Prices, Current Account Balance, and Unemployment (Annual percent change, unless noted otherwise)
Table 6. Middle Eastern and Central Asian Economies: Real GDP, Consumer Prices, Current Account Balance, and Unemployment (Annual percent change, unless noted otherwise)
Table 7. Covid-19 Impact: Global Major Government Policy
Table 8. The Covid-19 Impact on 3D IC and 2.5D IC Packaging Assessment
Table 9. COVID-19 Impact: 3D IC and 2.5D IC Packaging Market Trends
Table 10. COVID-19 Impact Global 3D IC and 2.5D IC Packaging Market Size
Table 11. Global 3D IC and 2.5D IC Packaging Market Size Pre-COVID-19 and Post- COVID-19 Comparison, 2015-2026 (Units)
Table 12. Global 3D IC and 2.5D IC Packaging Price, Pre-COVID-19 and Post- COVID-19 Comparison, 2015-2026, (K USD/Unit)
Table 13. Global 3D IC and 2.5D IC Packaging Quarterly Market Size, 2020 (US$ Million) & (Units)
Table 14. Global 3D IC and 2.5D IC Packaging Market Size, Pre-COVID-19 and Post- COVID-19 Quarterly Comparison, 2020-2021 (US$ Million)
Table 15. Global 3D IC and 2.5D IC Packaging Market Size, Pre-COVID-19 and Post- COVID-19 Quarterly Comparison, 2020-2021 (Units)
Table 16. Global 3D IC and 2.5D IC Packaging Market Growth Drivers
Table 17. Global 3D IC and 2.5D IC Packaging Market Restraints
Table 18. Global 3D IC and 2.5D IC Packaging Market Opportunities
Table 19. Global 3D IC and 2.5D IC Packaging Market Challenges
Table 20. Key Manufacturers 3D IC and 2.5D IC Packaging Quarterly Revenue, 2019 VS 2020 (US$ Million)
Table 21. Top Manufacturers, 3D IC and 2.5D IC Packaging Market Size, 2019 (Units) & (US$ Million)
Table 22. 3D IC and 2.5D IC Packaging Factory Price by Manufacturers 2020 (K USD/Unit)
Table 23. Location of Key Manufacturers 3D IC and 2.5D IC Packaging Manufacturing Plants
Table 24. Key Manufacturers 3D IC and 2.5D IC Packaging Market Served
Table 25. Date of Key Manufacturers Enter into 3D IC and 2.5D IC Packaging Market
Table 26. Key Manufacturers 3D IC and 2.5D IC Packaging Product Type
Table 27. Mergers & Acquisitions, Expansion Plans
Table 28. Global 3D IC and 2.5D IC Packaging Market Size by Type, 2020, (US$ Million)
Table 29. Global 3D IC and 2.5D IC Packaging Market Size by Type, 2020 (Units)
Table 30. Global 3D IC and 2.5D IC Packaging Price: by Type, 2020-2021 (K USD/Unit)
Table 31. Global 3D IC and 2.5D IC Packaging Market Size by Application: 2020-2021 (US$ Million)
Table 32. Global 3D IC and 2.5D IC Packaging Market Size by Application, 2020-2021 (Units)
Table 33. Global 3D IC and 2.5D IC Packaging Price: by Application, 2020-2021 (K USD/Unit)
Table 34. Global 3D IC and 2.5D IC Packaging Market Size by Region, 2019-2021 (US$ Million)
Table 35. Global 3D IC and 2.5D IC Packaging Market Size by Region, 2019-2021 (Units)
Table 36. By Country, North America 3D IC and 2.5D IC Packaging Market Size, 2019-2021 (US$ Million)
Table 37. By Country, North America 3D IC and 2.5D IC Packaging Market Size, 2019-2021 (Units)
Table 38. US 3D IC and 2.5D IC Packaging Market Size, 2019-2021 (US$ Million) & (Units)
Table 39. Canada 3D IC and 2.5D IC Packaging Market Size, 2019-2021 (US$ Million) & (Units)
Table 40. Macroeconomic Indicators of Europe (Germany, France, UK and Italy)
Table 41. By Country, Europe 3D IC and 2.5D IC Packaging Market Size, 2019-2021 (US$ Million)
Table 42. By Country, Europe 3D IC and 2.5D IC Packaging Market Size, 2019-2021 (Units)
Table 43. Germany 3D IC and 2.5D IC Packaging Market Size, 2019-2021 (US$ Million) & (Units)
Table 44. France 3D IC and 2.5D IC Packaging Market Size, 2019-2021 (US$ Million) & (Units)
Table 45. UK 3D IC and 2.5D IC Packaging Market Size, 2019-2021 (US$ Million) & (Units)
Table 46. Italy 3D IC and 2.5D IC Packaging Market Size, 2019-2021 (US$ Million) & (Units)
Table 47. Macroeconomic Indicators of Asia-Pacific (China, Japan, South Korea, India and ASEAN)
Table 48. By Region, Asia-Pacific 3D IC and 2.5D IC Packaging Market Size, 2019-2021 (US$ Million)
Table 49. By Region, Asia-Pacific 3D IC and 2.5D IC Packaging Market Size, 2019-2021 (Units)
Table 50. China 3D IC and 2.5D IC Packaging Market Size, 2019-2021 (US$ Million) & (Units)
Table 51. Japan 3D IC and 2.5D IC Packaging Market Size, 2019-2021 (US$ Million) & (Units)
Table 52. South Korea 3D IC and 2.5D IC Packaging Market Size, 2019-2021 (US$ Million) & (Units)
Table 53. India 3D IC and 2.5D IC Packaging Market Size, 2019-2021 (US$ Million) & (Units)
Table 54. ASEAN 3D IC and 2.5D IC Packaging Market Size, 2019-2021 (US$ Million) & (Units)
Table 55. Latin America 3D IC and 2.5D IC Packaging Market Size, 2019-2021 (US$ Million) & (Units)
Table 56. Middle East and Africa 3D IC and 2.5D IC Packaging Market Size, 2019-2021 (US$ Million) & (Units)
Table 57. Taiwan Semiconductor Business Overview
Table 58. Taiwan Semiconductor 3D IC and 2.5D IC Packaging Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin, (Q1, Q2, Q3, Q4) Quarter 2020
Table 59. Taiwan Semiconductor 3D IC and 2.5D IC Packaging Product
Table 60. Taiwan Semiconductor Response to COVID-19 and Related Developments
Table 61. Samsung Electronics Business Overview
Table 62. Samsung Electronics 3D IC and 2.5D IC Packaging Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin, (Q1, Q2, Q3, Q4) Quarter 2020
Table 63. Samsung Electronics 3D IC and 2.5D IC Packaging Product
Table 64. Samsung Electronics Response to COVID-19 and Related Developments
Table 65. Toshiba Corp Business Overview
Table 66. Toshiba Corp 3D IC and 2.5D IC Packaging Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin, (Q1, Q2, Q3, Q4) Quarter 2020
Table 67. Toshiba Corp 3D IC and 2.5D IC Packaging Product
Table 68. Toshiba Corp Response to COVID-19 and Related Developments
Table 69. Advanced Semiconductor Engineering Business Overview
Table 70. Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin, (Q1, Q2, Q3, Q4) Quarter 2020
Table 71. Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Product
Table 72. Advanced Semiconductor Engineering Response to COVID-19 and Related Developments
Table 73. Amkor Technology Business Overview
Table 74. Amkor Technology 3D IC and 2.5D IC Packaging Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin, (Q1, Q2, Q3, Q4) Quarter 2020
Table 75. Amkor Technology 3D IC and 2.5D IC Packaging Product
Table 76. Amkor Technology Response to COVID-19 and Related Developments
Table 77. 3D IC and 2.5D IC Packaging Distributors List
Table 78. 3D IC and 2.5D IC Packaging Customers List
Table 79. Covid-19 Impact on 3D IC and 2.5D IC Packaging Customers
List of Figures

Figure 1. 3D IC and 2.5D IC Packaging Product Picture
Figure 2. 3D IC and 2.5D IC Packaging Market Segmentation
Figure 3. Research Objectives
Figure 4. Research Process
Figure 5. Data Triangulation
Figure 6. Research Approach
Figure 7. Commodity Prices-Metals Price Indices
Figure 8. Commodity Prices- Precious Metal Price Indices
Figure 9. Commodity Prices- Agricultural Raw Material Price Indices
Figure 10. Commodity Prices- Food and Beverage Price Indices
Figure 11. Commodity Prices- Fertilizer Price Indices
Figure 12. Commodity Prices- Energy Price Indices
Figure 13. G20+: Economic Policy Responses to COVID-19
Figure 14. Global 3D IC and 2.5D IC Packaging Market Size, Pre-COVID-19 and Post- COVID-19 Comparison, 2015-2026 (US$ Million)
Figure 15. Global 3D IC and 2.5D IC Packaging Market Size, Pre-COVID-19 and Post- COVID-19, Year-over-Year Growth Rate, 2015-2026 (%)
Figure 16. Global 3D IC and 2.5D IC Packaging Market Size, Quarterly Growth, 2020-2021 (%)
Figure 17. Global 3D IC and 2.5D IC Packaging Market Size, Market Share by Type, 2019 VS 2020 (%)
Figure 18. Global 3D IC and 2.5D IC Packaging Market Size, Market Share by Application, 2019 VS 2020 (%)
Figure 19. Global 3D IC and 2.5D IC Packaging Market Size Market Share by Region, 2019 VS 2020 (%)
Figure 20. United States Composite PMI and GDP
Figure 21. Eurozone Composite PMI and GDP
Figure 22. Eurozone Core v. Periphery PMI Output Indices
Figure 23. Core v. Periphery PMI Employment Indices
Figure 24. UK Composite PMI and GDP
Figure 25. Caixin China Composite Output Index
Figure 26. Caixin China General Services Business Activity Index
Figure 27. Japan Composite Output Index
Figure 28. South Korea Manufacturing PMI
Figure 29. India Composite Output Index
Figure 30. ASEAN Manufacturing PMI
Figure 31. By Region, Asia-Pacific 3D IC and 2.5D IC Packaging Market Size Market Share, 2019-2021
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