COVID-19 Impact on 3D IC and 2.5D IC Market, Global Research Reports 2020-2021

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Date: 21-May-2020
No. of pages: 97
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This report covers market size and forecasts of 3D IC and 2.5D IC, including the following market information:

- Global 3D IC and 2.5D IC Market Size, 2019-2021, and 2020 (quarterly data), (US$ Million)

- Global 3D IC and 2.5D IC Market Size by Type and by Application, 2019-2021, and 2020 (quarterly data), (US$ Million)

- Global 3D IC and 2.5D IC Market Size by Region (and Key Countries), 2019-2021, and 2020 (quarterly data), (US$ Million)

- Global 3D IC and 2.5D IC Market Size by Company, 2019- 2020 (quarterly data), (US$ Million)

Key market players

Major competitors identified in this market include TSMC (Taiwan), Samsung (South Korea), Toshiba (Japan), ASE Group (Taiwan), Amkor (U.S.), UMC (Taiwan), Stmicroelectronics (Switzerland), Broadcom (U.S.), Intel (U.S.), Jiangsu Changjiang Electronics (China), etc.

Based on the Region:

- Asia-Pacific (China, Japan, South Korea, India and ASEAN)

- North America (US and Canada)

- Europe (Germany, France, UK and Italy)

- Rest of World (Latin America, Middle East & Africa)

Based on the Type:

- 3D wafer-level chip-scale packaging

- 3D TSV

- 2.5D

Based on the Application:

- Consumer electronics

- Telecommunication

- Industry sector

- Automotive

- Military and Aerospace

- Smart technologies

- Medical devices

COVID-19 Impact on 3D IC and 2.5D IC Market, Global Research Reports 2020-2021

Table of Contents
1.1 Research Scope
1.2 Market Segmentation
1.3 Research Objectives
1.4 Research Methodology
1.4.1 Research Process
1.4.2 Data Triangulation
1.4.3 Research Approach
1.4.4 Base Year
1.5 Coronavirus Disease 2019 (Covid-19) Impact Will Have a Severe Impact on Global Growth
1.5.1 Covid-19 Impact: Global GDP Growth, 2019, 2020 and 2021 Projections
1.5.2 Covid-19 Impact: Commodity Prices Indices
1.5.3 Covid-19 Impact: Global Major Government Policy
1.6 The Covid-19 Impact on 3D IC and 2.5D IC Industry
1.7 COVID-19 Impact: 3D IC and 2.5D IC Market Trends
2 Global 3D IC and 2.5D IC Quarterly Market Size Analysis
2.1 3D IC and 2.5D IC Business Impact Assessment - COVID-19
2.1.1 Global 3D IC and 2.5D IC Market Size, Pre-COVID-19 and Post- COVID-19 Comparison, 2015-2026
2.2 Global 3D IC and 2.5D IC Quarterly Market Size 2020-2021
2.3 COVID-19-Driven Market Dynamics and Factor Analysis
2.3.1 Drivers
2.3.2 Restraints
2.3.3 Opportunities
2.3.4 Challenges
3 Quarterly Competitive Assessment, 2020
3.1 By Players, Global 3D IC and 2.5D IC Quarterly Market Size, 2019 VS 2020
3.2 By Players, 3D IC and 2.5D IC Headquarters and Area Served
3.3 Date of Key Players Enter into 3D IC and 2.5D IC Market
3.4 Key Players 3D IC and 2.5D IC Product Offered
3.5 Mergers & Acquisitions, Expansion Plans
4 Impact of Covid-19 on 3D IC and 2.5D IC Segments, By Type
4.1 Introduction
1.4.1 3D wafer-level chip-scale packaging
1.4.2 3D TSV
1.4.3 2.5D
4.2 By Type, Global 3D IC and 2.5D IC Market Size, 2019-2021
5 Impact of Covid-19 on 3D IC and 2.5D IC Segments, By Application
5.1 Overview
5.5.1 Consumer electronics
5.5.2 Telecommunication
5.5.3 Industry sector
5.5.4 Automotive
5.5.5 Military and Aerospace
5.5.6 Smart technologies
5.5.7 Medical devices
5.2 By Application, Global 3D IC and 2.5D IC Market Size, 2019-2021
5.2.1 By Application, Global 3D IC and 2.5D IC Market Size by Application, 2019-2021
6 Geographic Analysis
6.1 Introduction
6.2 North America
6.2.1 Macroeconomic Indicators of US
6.2.2 US
6.2.3 Canada
6.3 Europe
6.3.1 Macroeconomic Indicators of Europe
6.3.2 Germany
6.3.3 France
6.3.4 UK
6.3.5 Italy
6.4 Asia-Pacific
6.4.1 Macroeconomic Indicators of Asia-Pacific
6.4.2 China
6.4.3 Japan
6.4.4 South Korea
6.4.5 India
6.4.6 ASEAN
6.5 Rest of World
6.5.1 Latin America
6.5.2 Middle East and Africa
7 Company Profiles
7.1 TSMC (Taiwan)
7.1.1 TSMC (Taiwan) Business Overview
7.1.2 TSMC (Taiwan) 3D IC and 2.5D IC Quarterly Revenue, 2020
7.1.3 TSMC (Taiwan) 3D IC and 2.5D IC Product Introduction
7.1.4 TSMC (Taiwan) Response to COVID-19 and Related Developments
7.2 Samsung (South Korea)
7.2.1 Samsung (South Korea) Business Overview
7.2.2 Samsung (South Korea) 3D IC and 2.5D IC Quarterly Revenue, 2020
7.2.3 Samsung (South Korea) 3D IC and 2.5D IC Product Introduction
7.2.4 Samsung (South Korea) Response to COVID-19 and Related Developments
7.3 Toshiba (Japan)
7.3.1 Toshiba (Japan) Business Overview
7.3.2 Toshiba (Japan) 3D IC and 2.5D IC Quarterly Revenue, 2020
7.3.3 Toshiba (Japan) 3D IC and 2.5D IC Product Introduction
7.3.4 Toshiba (Japan) Response to COVID-19 and Related Developments
7.4 ASE Group (Taiwan)
7.4.1 ASE Group (Taiwan) Business Overview
7.4.2 ASE Group (Taiwan) 3D IC and 2.5D IC Quarterly Revenue, 2020
7.4.3 ASE Group (Taiwan) 3D IC and 2.5D IC Product Introduction
7.4.4 ASE Group (Taiwan) Response to COVID-19 and Related Developments
7.5 Amkor (U.S.)
7.5.1 Amkor (U.S.) Business Overview
7.5.2 Amkor (U.S.) 3D IC and 2.5D IC Quarterly Revenue, 2020
7.5.3 Amkor (U.S.) 3D IC and 2.5D IC Product Introduction
7.5.4 Amkor (U.S.) Response to COVID-19 and Related Developments
7.6 UMC (Taiwan)
7.6.1 UMC (Taiwan) Business Overview
7.6.2 UMC (Taiwan) 3D IC and 2.5D IC Quarterly Revenue, 2020
7.6.3 UMC (Taiwan) 3D IC and 2.5D IC Product Introduction
7.6.4 UMC (Taiwan) Response to COVID-19 and Related Developments
7.7 Stmicroelectronics (Switzerland)
7.7.1 Stmicroelectronics (Switzerland) Business Overview
7.7.2 Stmicroelectronics (Switzerland) 3D IC and 2.5D IC Quarterly Revenue, 2020
7.7.3 Stmicroelectronics (Switzerland) 3D IC and 2.5D IC Product Introduction
7.7.4 Stmicroelectronics (Switzerland) Response to COVID-19 and Related Developments
7.8 Broadcom (U.S.)
7.8.1 Broadcom (U.S.) Business Overview
7.8.2 Broadcom (U.S.) 3D IC and 2.5D IC Quarterly Revenue, 2020
7.8.3 Broadcom (U.S.) 3D IC and 2.5D IC Product Introduction
7.8.4 Broadcom (U.S.) Response to COVID-19 and Related Developments
7.9 Intel (U.S.)
7.9.1 Intel (U.S.) Business Overview
7.9.2 Intel (U.S.) 3D IC and 2.5D IC Quarterly Revenue, 2020
7.9.3 Intel (U.S.) 3D IC and 2.5D IC Product Introduction
7.9.4 Intel (U.S.) Response to COVID-19 and Related Developments
7.10 Jiangsu Changjiang Electronics (China)
7.10.1 Jiangsu Changjiang Electronics (China) Business Overview
7.10.2 Jiangsu Changjiang Electronics (China) 3D IC and 2.5D IC Quarterly Revenue, 2020
7.10.3 Jiangsu Changjiang Electronics (China) 3D IC and 2.5D IC Product Introduction
7.10.4 Jiangsu Changjiang Electronics (China) Response to COVID-19 and Related Developments
8 Key Findings
9 Appendix
9.1 About US
9.2 Disclaimer
List of Tables
Table 1. Overview of the World Economic Outlook Projections
Table 2. Summary of World Real per Capita Output (Annual percent change; in international currency at purchasing power parity)
Table 3. European Economies: Real GDP, Consumer Prices, Current Account Balance, and Unemployment (Annual percent change, unless noted otherwise)
Table 4. Asian and Pacific Economies: Real GDP, Consumer Prices, Current Account Balance, and Unemployment (Annual percent change, unless noted otherwise)
Table 5. Western Hemisphere Economies: Real GDP, Consumer Prices, Current Account Balance, and Unemployment (Annual percent change, unless noted otherwise)
Table 6. Middle Eastern and Central Asian Economies: Real GDP, Consumer Prices, Current Account Balance, and Unemployment (Annual percent change, unless noted otherwise)
Table 7. Covid-19 Impact: Global Major Government Policy
Table 8. The Covid-19 Impact on 3D IC and 2.5D IC Assessment
Table 9. COVID-19 Impact: 3D IC and 2.5D IC Market Trends
Table 10. COVID-19 Impact Global 3D IC and 2.5D IC Market Size
Table 11. Global 3D IC and 2.5D IC Quarterly Market Size, 2020 (US$ Million)
Table 12. Global 3D IC and 2.5D IC Market Size, Pre-COVID-19 and Post- COVID-19 Quarterly Comparison, 2020-2021 (US$ Million)
Table 13. Global 3D IC and 2.5D IC Market Growth Drivers
Table 14. Global 3D IC and 2.5D IC Market Restraints
Table 15. Global 3D IC and 2.5D IC Market Opportunities
Table 16. Global 3D IC and 2.5D IC Market Challenges
Table 17. By Players, 3D IC and 2.5D IC Quarterly Revenue, 2019 VS 2020 (US$ Million)
Table 18. Key Players, 3D IC and 2.5D IC Revenue Market Share, 2019 VS 2020 (%)
Table 19. Key 3D IC and 2.5D IC Players Headquarters and Area Served
Table 20. Date of Key Players Enter into 3D IC and 2.5D IC Market
Table 21. Key Players 3D IC and 2.5D IC Product Type
Table 22. Mergers & Acquisitions, Expansion Plans
Table 23. By Players, Global 3D IC and 2.5D IC Market Size 2019-2021, (US$ Million)
Table 24. Global 3D IC and 2.5D IC Market Size by Application: 2019-2021 (US$ Million)
Table 25. Global 3D IC and 2.5D IC Market Size by Region, 2019-2021 (US$ Million)
Table 26. By Country, North America 3D IC and 2.5D IC Market Size, 2019-2021 (US$ Million)
Table 27. By Type, US 3D IC and 2.5D IC Market Size, 2019-2021 (US$ Million)
Table 28. By Application, US 3D IC and 2.5D IC Market Size, 2019-2021 (US$ Million)
Table 29. By Type, Canada 3D IC and 2.5D IC Market Size, 2019-2021 (US$ Million)
Table 30. By Application, Canada 3D IC and 2.5D IC Market Size, 2019-2021 (US$ Million)
Table 31. Macroeconomic Indicators of Europe (Germany, France, UK and Italy)
Table 32. By Country, Europe 3D IC and 2.5D IC Market Size, 2019-2021 (US$ Million)
Table 33. By Type, Germany 3D IC and 2.5D IC Market Size, 2019-2021 (US$ Million)
Table 34. By Application, Germany 3D IC and 2.5D IC Market Size, 2019-2021 (US$ Million)
Table 35. By Type, France 3D IC and 2.5D IC Market Size, 2019-2021 (US$ Million)
Table 36. By Application, France 3D IC and 2.5D IC Market Size, 2019-2021 (US$ Million)
Table 37. By Type, UK 3D IC and 2.5D IC Market Size, 2019-2021 (US$ Million)
Table 38. By Application, UK 3D IC and 2.5D IC Market Size, 2019-2021 (US$ Million)
Table 39. By Type, Italy 3D IC and 2.5D IC Market Size, 2019-2021 (US$ Million)
Table 40. By Application, Italy 3D IC and 2.5D IC Market Size, 2019-2021 (US$ Million)
Table 41. Macroeconomic Indicators of Asia-Pacific (China, Japan, South Korea, India and ASEAN)
Table 42. By Region, Asia-Pacific 3D IC and 2.5D IC Market Size, 2019-2021 (US$ Million)
Table 43. By Type, China 3D IC and 2.5D IC Market Size, 2019-2021 (US$ Million)
Table 44. By Application, China 3D IC and 2.5D IC Market Size, 2019-2021 (US$ Million)
Table 45. By Type, Japan 3D IC and 2.5D IC Market Size, 2019-2021 (US$ Million)
Table 46. By Application, Japan 3D IC and 2.5D IC Market Size, 2019-2021 (US$ Million)
Table 47. By Type, South Korea 3D IC and 2.5D IC Market Size, 2019-2021 (US$ Million)
Table 48. By Application, South Korea 3D IC and 2.5D IC Market Size, 2019-2021 (US$ Million)
Table 49. By Type, India 3D IC and 2.5D IC Market Size, 2019-2021 (US$ Million)
Table 50. By Application, India 3D IC and 2.5D IC Market Size, 2019-2021 (US$ Million)
Table 51. By Type, ASEAN 3D IC and 2.5D IC Market Size, 2019-2021 (US$ Million)
Table 52. By Application, ASEAN 3D IC and 2.5D IC Market Size, 2019-2021 (US$ Million)
Table 53. By Type, Latin America 3D IC and 2.5D IC Market Size, 2019-2021 (US$ Million)
Table 54. By Application, Latin America 3D IC and 2.5D IC Market Size, 2019-2021 (US$ Million)
Table 55. By Type, Middle East and Africa 3D IC and 2.5D IC Market Size, 2019-2021 (US$ Million)
Table 56. By Application, Middle East and Africa 3D IC and 2.5D IC Market Size, 2019-2021 (US$ Million)
Table 57. TSMC (Taiwan) Business Overview
Table 58. TSMC (Taiwan) 3D IC and 2.5D IC Revenue (US$ Million), (Q1, Q2, Q3, Q4) Quarter 2020
Table 59. TSMC (Taiwan) 3D IC and 2.5D IC Product
Table 60. TSMC (Taiwan) Response to COVID-19 and Related Developments
Table 61. Samsung (South Korea) Business Overview
Table 62. Samsung (South Korea) 3D IC and 2.5D IC Revenue (US$ Million), (Q1, Q2, Q3, Q4) Quarter 2020
Table 63. Samsung (South Korea) 3D IC and 2.5D IC Product
Table 64. Samsung (South Korea) Response to COVID-19 and Related Developments
Table 65. Toshiba (Japan) Business Overview
Table 66. Toshiba (Japan) 3D IC and 2.5D IC Revenue (US$ Million), (Q1, Q2, Q3, Q4) Quarter 2020
Table 67. Toshiba (Japan) 3D IC and 2.5D IC Product
Table 68. Toshiba (Japan) Response to COVID-19 and Related Developments
Table 69. ASE Group (Taiwan) Business Overview
Table 70. ASE Group (Taiwan) 3D IC and 2.5D IC Revenue (US$ Million), (Q1, Q2, Q3, Q4) Quarter 2020
Table 71. ASE Group (Taiwan) 3D IC and 2.5D IC Product
Table 72. ASE Group (Taiwan) Response to COVID-19 and Related Developments
Table 73. Amkor (U.S.) Business Overview
Table 74. Amkor (U.S.) 3D IC and 2.5D IC Revenue (US$ Million), (Q1, Q2, Q3, Q4) Quarter 2020
Table 75. Amkor (U.S.) 3D IC and 2.5D IC Product
Table 76. Amkor (U.S.) Response to COVID-19 and Related Developments
Table 77. UMC (Taiwan) Business Overview
Table 78. UMC (Taiwan) 3D IC and 2.5D IC Revenue (US$ Million), (Q1, Q2, Q3, Q4) Quarter 2020
Table 79. UMC (Taiwan) 3D IC and 2.5D IC Product
Table 80. UMC (Taiwan) Response to COVID-19 and Related Developments
Table 81. Stmicroelectronics (Switzerland) Business Overview
Table 82. Stmicroelectronics (Switzerland) 3D IC and 2.5D IC Revenue (US$ Million), (Q1, Q2, Q3, Q4) Quarter 2020
Table 83. Stmicroelectronics (Switzerland) 3D IC and 2.5D IC Product
Table 84. Stmicroelectronics (Switzerland) Response to COVID-19 and Related Developments
Table 85. Broadcom (U.S.) Business Overview
Table 86. Broadcom (U.S.) 3D IC and 2.5D IC Revenue (US$ Million), (Q1, Q2, Q3, Q4) Quarter 2020
Table 87. Broadcom (U.S.) 3D IC and 2.5D IC Product
Table 88. Broadcom (U.S.) Response to COVID-19 and Related Developments
Table 89. Intel (U.S.) Business Overview
Table 90. Intel (U.S.) 3D IC and 2.5D IC Revenue (US$ Million), (Q1, Q2, Q3, Q4) Quarter 2020
Table 91. Intel (U.S.) 3D IC and 2.5D IC Product
Table 92. Intel (U.S.) Response to COVID-19 and Related Developments
Table 93. Jiangsu Changjiang Electronics (China) Business Overview
Table 94. Jiangsu Changjiang Electronics (China) 3D IC and 2.5D IC Revenue (US$ Million), (Q1, Q2, Q3, Q4) Quarter 2020
Table 95. Jiangsu Changjiang Electronics (China) 3D IC and 2.5D IC Product
Table 96. Jiangsu Changjiang Electronics (China) Response to COVID-19 and Related Developments
List of Figures
Figure 1. 3D IC and 2.5D IC Product Picture
Figure 2. 3D IC and 2.5D IC Market Segmentation
Figure 3. Research Objectives
Figure 4. Research Process
Figure 5. Data Triangulation
Figure 6. Research Approach
Figure 7. Commodity Prices-Metals Price Indices
Figure 8. Commodity Prices- Precious Metal Price Indices
Figure 9. Commodity Prices- Agricultural Raw Material Price Indices
Figure 10. Commodity Prices- Food and Beverage Price Indices
Figure 11. Commodity Prices- Fertilizer Price Indices
Figure 12. Commodity Prices- Energy Price Indices
Figure 13. G20+: Economic Policy Responses to COVID-19
Figure 14. Global 3D IC and 2.5D IC Market Size, Pre-COVID-19 and Post- COVID-19 Comparison, 2015-2026 (US$ Million)
Figure 15. Global 3D IC and 2.5D IC Market Size, Pre-COVID-19 and Post- COVID-19, Year-over-Year Growth Rate, 2015-2026 (%)
Figure 16. Global 3D IC and 2.5D IC Market Size, Quarterly Growth, 2020-2021 (%)
Figure 17. Global 3D IC and 2.5D IC Market Size, Market Share by Type, 2019 VS 2020 (%)
Figure 18. Global 3D IC and 2.5D IC Market Size, Market Share by Application, 2019 VS 2020 (%)
Figure 19. Global 3D IC and 2.5D IC Market Size Market Share by Region, 2019 VS 2020 (%)
Figure 20. United States Composite PMI and GDP
Figure 21. Eurozone Composite PMI and GDP
Figure 22. Eurozone Core v. Periphery PMI Output Indices
Figure 23. Core v. Periphery PMI Employment Indices
Figure 24. UK Composite PMI and GDP
Figure 25. Caixin China Composite Output Index
Figure 26. Caixin China General Services Business Activity Index
Figure 27. Japan Composite Output Index
Figure 28. South Korea Manufacturing PMI
Figure 29. India Composite Output Index
Figure 30. ASEAN Manufacturing PMI
Figure 31. By Region, Asia-Pacific 3D IC and 2.5D IC Market Size Market Share, 2019-2021
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