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The global Semiconductor Temporary Bonding Equipment market size is estimated to be $165 million in 2023, and MAResearch analysts predict it will reach $303 million by 2031, growing at a CAGR of 7.9% during the forecast period from 2023 to 2031.
This report studies the Semiconductor Temporary Bonding Equipment market, covering market size for segment by type (Semi-Automatic Bonding Equipment, Fully Automatic Bonding Equipment, etc.), by application (Advanced Packaging, MEMS, etc.), by sales channel (Direct Channel, Distribution Channel), by player (Tokyo Ohka Kogyo (TOK), SUSS MicroTec, EV Group, AML, TAZMO, etc.) and by region (North America, Europe, Asia-Pacific, South America and Middle East & Africa).
This report provides detailed historical analysis of global market for Semiconductor Temporary Bonding Equipment from 2017-2022, and provides extensive market forecasts from 2023-2031 by region/country and subsectors. It covers the sales/revenue/value, gross margin, historical growth and future perspectives in the Semiconductor Temporary Bonding Equipment market.
Leading Players of Semiconductor Temporary Bonding Equipment including:
- Tokyo Ohka Kogyo (TOK)
- SUSS MicroTec
- EV Group
- AML
- TAZMO
- Ayumi Industry
- Shanghai Micro Electronics Equipment (SMEE)
- ...
Market split by Type:
- Semi-Automatic Bonding Equipment
- Fully Automatic Bonding Equipment
Market split by Application:
- Advanced Packaging
- MEMS
- CMOS
- Others
Market split by Sales Channel:
- Direct Channel
- Distribution Channel
Market split by Region/Country:
- North America (United States and Canada)
- Europe (Germany, UK, France, Italy, Spain, and Russia, etc.)
- Asia-Pacific (China, Japan, Korea, India, Australia, and Southeast Asia, etc.)
- South America (Brazil, Mexico, and Argentina, etc.)
- Middle East & Africa (Turkey, UAE, Saudi Arabia, and South Africa, etc.)
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