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Wafer Grinder is used to process silicon and compound semiconductor wafers to ultra-thin levels and polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength.The main application of wafer Edge Grinder and Wafer Surface Grinder are Semiconductor and Photovoltaic field.
Scope of the Report:
This report focuses on the Wafer Grinder in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
One of the major challenges faced by the global semiconductor wafer grinding equipment market is the high development costs associated with the manufacturing of semiconductor equipment. Semiconductor wafer polishing and grinding equipment requires polishers, grinders, and rotating platens, which are expensive to procure. Also, since there are only a few suppliers of those components, vendors need to invest heavily in acquiring these products. The increasing costs of polishing and grinding consumables, such as slurries and pads, add to the overall cost. Each equipment costs around a million dollars, making the initial investment for various foundries considerably high. Such equipment will also have a high repair and maintenance cost, which further adds to the overall cost.
The worldwide market for Wafer Grinder is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx million US$ in 2023, from xx million US$ in 2017, according to a new GIR (Global Info Research) study.
Market Segment by Manufacturers, this report covers
- G&N Genauigkeits Maschinenbau Nürnberg GmbH
- Arnold Gruppe
- Hunan Yujing Machine Industrial
- WAIDA MFG
- Koyo Machinery
- MAT Inc
- Dikema Presicion Machinery
- Komatsu NTC
Market Segment by Regions, regional analysis covers
- North America (United States, Canada and Mexico)
- Europe (Germany, France, UK, Russia and Italy)
- Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
- South America (Brazil, Argentina, Colombia etc.)
- Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
- Wafer Edge Grinder
- Wafer Surface Grinder
Market Segment by Applications, can be divided into
There are 15 Chapters to deeply display the global Wafer Grinder market.
Chapter 1, to describe Wafer Grinder Introduction, product scope, market overview, market opportunities, market risk, market driving force;
Chapter 2, to analyze the top manufacturers of Wafer Grinder, with sales, revenue, and price of Wafer Grinder, in 2016 and 2017;
Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2016 and 2017;
Chapter 4, to show the global market by regions, with sales, revenue and market share of Wafer Grinder, for each region, from 2013 to 2018;
Chapter 5, 6, 7, 8 and 9, to analyze the market by countries, by type, by application and by manufacturers, with sales, revenue and market share by key countries in these regions;
Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2013 to 2018;
Chapter 12, Wafer Grinder market forecast, by regions, type and application, with sales and revenue, from 2018 to 2023;
Chapter 13, 14 and 15, to describe Wafer Grinder sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source