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Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the die in a process called "Thermo Compression Bonding". The bumps are forced against their opposing pads and a second metallic bond is formed where the bond comes into contact with the package metallization. This technique typically requires the use of heat as high as 350° to 400°C, and forces of as much as 100 g/bump.
Scope of the Report:
This report focuses on the Thermo Compression Bonder in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
Thermo Compression Bonding (TCB) is a chip attach technology under investigation and implementation in multiple platforms. The global Thermo Compression Bonder market is driven by increased Thermo Compression Bonder usage: memory applications currently, logic devices next. Meanwhile, Thermo Compression Bonder is gaining market share from wire bond assembly processes. Also, lower throughput coupled with higher processing costs was example of challenges in the TCB technology.
China Thermo Compression Bonder market is valued at $6.39 million in 2017 and is expected to reach $19.53 million by the end of 2023, growing at a CAGR of 20.47% between 2018 and 2023.
The worldwide market for Thermo Compression Bonder is expected to grow at a CAGR of roughly 24.8% over the next five years, will reach 120 million US$ in 2023, from 33 million US$ in 2017, according to a new GIR (Global Info Research) study.
Market Segment by Manufacturers, this report covers
- ASMPT (AMICRA)
Market Segment by Regions, regional analysis covers
- North America (United States, Canada and Mexico)
- Europe (Germany, France, UK, Russia and Italy)
- Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
- South America (Brazil, Argentina, Colombia etc.)
- Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
- Automatic Thermo Compression Bonder
- Manual Thermo Compression Bonder
Market Segment by Applications, can be divided into
There are 15 Chapters to deeply display the global Thermo Compression Bonder market.
Chapter 1, to describe Thermo Compression Bonder Introduction, product scope, market overview, market opportunities, market risk, market driving force;
Chapter 2, to analyze the top manufacturers of Thermo Compression Bonder, with sales, revenue, and price of Thermo Compression Bonder, in 2016 and 2017;
Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2016 and 2017;
Chapter 4, to show the global market by regions, with sales, revenue and market share of Thermo Compression Bonder, for each region, from 2013 to 2018;
Chapter 5, 6, 7, 8 and 9, to analyze the market by countries, by type, by application and by manufacturers, with sales, revenue and market share by key countries in these regions;
Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2013 to 2018;
Chapter 12, Thermo Compression Bonder market forecast, by regions, type and application, with sales and revenue, from 2018 to 2023;
Chapter 13, 14 and 15, to describe Thermo Compression Bonder sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source