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Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the die in a process called "Thermo Compression Bonding". The bumps are forced against their opposing pads and a second metallic bond is formed where the bond comes into contact with the package metallization. This technique typically requires the use of heat as high as 350° to 400°C, and forces of as much as 100 g/bump.
Scope of the Report:
Thermo Compression Bonding (TCB) is a chip attach technology under investigation and implementation in multiple platforms. The global TCB Bonder market is driven by increased TCB Bonder usage: memory applications currently, logic devices next. Meanwhile, TCB Bonder is gaining market share from wire bond assembly processes. Also, lower throughput coupled with higher processing costs was example of challenges in the TCB technology.
The leading enterprises in the TCB Bonder market are ASMPT (AMICRA) (HK) and K&S (US), which followed by Besi (NL), Shibaura (JP), SET (FR), and Hanmi (KR). These Top companies currently account for more than 91.03% of the total market share and are expected to retain their dominating hold over the market during the forecast period.
North America TCB Bonder market would keep being the largest market, followed by Europe in 2018. Japan market and China market would rank forth (12 units) and fifth (11 units).
The worldwide market for TCB Bonder is expected to grow at a CAGR of roughly 21.0% over the next five years, will reach 100 million US$ in 2024, from 33 million US$ in 2019, according to a new GIR (Global Info Research) study.
This report focuses on the TCB Bonder in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
Market Segment by Manufacturers, this report covers
- ASMPT (Amicra)
- K&S
- BESI
- Shibaura
- SET
- Hamni
Market Segment by Regions, regional analysis covers
- North America (United States, Canada and Mexico)
- Europe (Germany, France, UK, Russia and Italy)
- Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
- South America (Brazil, Argentina, Colombia etc.)
- Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
- Automatic TCB Bonder
- Manual TCB Bonder
Market Segment by Applications, can be divided into
- IDMs
- OSAT
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe TCB Bonder product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of TCB Bonder, with price, sales, revenue and global market share of TCB Bonder in 2017 and 2018.
Chapter 3, the TCB Bonder competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the TCB Bonder breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2014 to 2019.
Chapter 5, 6, 7, 8 and 9, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2014 to 2019.
Chapter 10 and 11, to segment the sales by type and application, with sales market share and growth rate by type, application, from 2014 to 2019.
Chapter 12, TCB Bonder market forecast, by regions, type and application, with sales and revenue, from 2019 to 2024.
Chapter 13, 14 and 15, to describe TCB Bonder sales channel, distributors, customers, research findings and conclusion, appendix and data source.