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This report studies the Solder Paste Inspection (SPI) System market, Solder Paste Inspection is mainly done to check the solder paste deposits in the Printed Circuit Board (PCB) manufacturing process. It is observed that most of the solder joint defects in a PCB assembly are because of improper solder paste printing. With the help of solder paste inspection (SPI), you can reduce the defects related to soldering by a considerable amount.
Importance of Solder Paste Inspection Process
Here are some of the key points of information, which prove the importance of SPI process:
Improves PCB Quality & Performance: This process makes use of advanced equipment for precise inspection. Angle cameras are used to take 3D pictures, which are very helpful in measuring the alignment and volume of the solder paste. This helps improve the yield, as well as the print quality. Furthermore, it helps improve the performance of the PCBs.
Advanced Equipment for Better Control & Monitoring: As said earlier, angle cameras are used, which produce clear 3D pictures. Unlike the traditional cameras, 3D cameras are capable of capturing the height of the solder paste printed. This facilitates precise measurement of the solder paste volume. Thus, with the help of SPI coupled with automated optical inspection, manufacturers can easily monitor and control the component placement and solder paste printing processes.
Helps Reduce Solder Errors: Important information about the printing process can be obtained by doing the solder paste inspection. It gives a clear idea about the causes of defects, thus allowing you to make the necessary changes and reduce the errors to a minimum.
Numerous studies have been performed over the last few years proving that up to 70% of all SMD solder joint issues, can be traced back to the solder paste printing process. These printing errors may be caused by incorrect printer setup, stencil damage, stencil design or type, solder paste type, solder paste conditions or a collection of several issues.
Scope of the Report:
The global Solder Paste Inspection (SPI) System market concentration rate is high and dominated by several players from Korea, Taiwan, Japan, United States and Germany; Koh Young, MirTec Ltd, PARMI Corp and Pemtron are from Korea; Test Research, Inc (TRI) and Jet Technology from Taiwan; CyberOptics Corporation, Machine Vision Products (MVP), Caltex Scientific and ASC International from United States; and Viscom AG and Vi TECHNOLOGY from Europe. In 2017, Koh Young and Test Research, Inc (TRI) occupied more than 60 percent of global market.
Currently, In-line SPI systems are dominating the market, due to the superior performance and the market demand. The SPI system market is mainly driven by the demand from Automotive and Consumer Electronics; other end market like communications, aerospace and medical fields will play more and more role in future.
The worldwide market for Solder Paste Inspection (SPI) System is expected to grow at a CAGR of roughly 2.6% over the next five years, will reach 270 million US$ in 2024, from 240 million US$ in 2019, according to a new GIR (Global Info Research) study.
This report focuses on the Solder Paste Inspection (SPI) System in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
Market Segment by Manufacturers, this report covers
- Koh Young (Korea)
- CyberOptics Corporation
- Test Research, Inc (TRI) (Taiwan)
- MirTec Ltd (Korea)
- PARMI Corp (Korea)
- Viscom AG (Germany)
- ViTrox (Malaysia)
- Vi TECHNOLOGY (France)
- Mek (Marantz Electronics) (Japan)
- CKD Corporation (Japan)
- Pemtron (Korea)
- SAKI Corporation (Japan)
- Machine Vision Products (MVP) (US)
- Caltex Scientific (US)
- ASC International (US)
- Sinic-Tek Vision Technology (China)
- Shenzhen JT Automation Equipment (China)
- Jet Technology (Taiwan)
Market Segment by Regions, regional analysis covers
- North America (United States, Canada and Mexico)
- Europe (Germany, France, UK, Russia and Italy)
- Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
- South America (Brazil, Argentina, Colombia etc.)
- Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
- In-line SPI System
- Off-line SPI System
Market Segment by Applications, can be divided into
- Automotive Electronics
- Consumer Electronics
- Industrials
- Others
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Solder Paste Inspection (SPI) System product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Solder Paste Inspection (SPI) System, with price, sales, revenue and global market share of Solder Paste Inspection (SPI) System in 2017 and 2018.
Chapter 3, the Solder Paste Inspection (SPI) System competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Solder Paste Inspection (SPI) System breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2014 to 2019.
Chapter 5, 6, 7, 8 and 9, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2014 to 2019.
Chapter 10 and 11, to segment the sales by type and application, with sales market share and growth rate by type, application, from 2014 to 2019.
Chapter 12, Solder Paste Inspection (SPI) System market forecast, by regions, type and application, with sales and revenue, from 2019 to 2024.
Chapter 13, 14 and 15, to describe Solder Paste Inspection (SPI) System sales channel, distributors, customers, research findings and conclusion, appendix and data source.