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Silicon-On-Insulator (SOI) is a semiconductor fabrication technique developed by IBM that uses pure crystal silicon and silicon oxide for integrated circuits (ICs) and microchips. An SOI microchip processing speed is often 30% faster than today's complementary metal-oxide semiconductor (CMOS)-based chips and power consumption is reduced 80%, which makes them ideal for mobile devices. SOI chips also reduce the soft error rate, which is data corruption caused by cosmic rays and natural radioactive background signals.
Scope of the Report:
SOI, as the name suggests, consists of a top thin layer of silicon and a bottom thick layer of silicon. An insulator material such as silicon dioxide (SiO2) is placed between these two layers. SOI offers high performance, low power consumption, and high speed compared to traditional silicon wafers. All these factors make it an ideal choice for portable applications such as mobile phones, portable digital assistants (PDAs), notebooks, digital cameras, and others. These wafers were developed in the 1960s for defense and military applications, and the commercialization of these wafers took place gradually
The growth of this market is propelled by the growth in the consumer electronics market, low wafer and gate cost, low operating voltage, and miniaturization of semiconductor devices.
Based on diameters, 200 mm SOI wafers held the largest share of the SOI market in 2017. The market for these wafers is expected to grow at a high rate between 2017 and 2025. 200 mm wafers are mainly used for manufacturing RFSOI wafers, which are further used in smartphones for manufacturing antenna switches and other important components. Currently, virtually all the RF chips, including 2G, 3G, and 4G, are manufactured by using 200 mm SOI wafers. The improvement will be primarily driven by the growth in sales volumes for 300 mm wafers and by controlling production costs on the small diameter line that is running at full capacity. The loading rate of the 300 mm production lines improved significantly, but still remains globally low.
BESOI, ELTRAN, SoS, SiMOX and smart cut are the technology segment of the market. Smart cut technology accounted for the largest share of the SOI market in 2017. Soitec (France) developed the smart cut technology in collaboration with CEA-Leti (microelectronics research lab). The licensing of Soitec's Smartcut technology to other companies is anticipated to further increase the SOI wafer supply.
Soitec, the world's leading provider of SOI wafers, has been pioneering the SOI technology. This company accounted for more than 69% of the revenues of the world SOI wafers market in 2017. The other key participants in the SOI wafer market are SunEdison (acquired by Globalwafers Co., Ltd. in 2016), Shin-Etsu Handotai Co. Ltd. and a few others like SUMCO CORPORATION, Ultrasil Corporation and etc. Manufacturer are focusing on strategies such as new product launches, expansions, contracts, and collaborations to enhance their product offerings and expand their business.
The computing and mobile segment accounted for the largest share of the overall SOI market in 2017. Power consumption is one of the burning issues faced by the consumer electronics segment. There are various issues associated with the conventional bulk CMOS technology, such as slow processing speed, high power consumption, low battery life, and soft errors such as data loss caused due to cosmic rays and natural radioactive background signals. The SOI microchip overcomes all these issues and improves the processing speed and performance by up to 30% compared with the CMOS-based chips; it also reduces the power consumption by up to 80%. These features make it ideal for use in computers and cell phones.
Asia-Pacific is predicted to witness the fastest growth over the forecast period owing developing integrated circuit industry. The leading players are emphasizing on modernizing their plants in APAC and fab facilities with advanced technologies. The countries such as China (Taiwan included) and Japan have the largest semiconductor manufacturing base, which is further helping the SOI market grow in this region. The increase in production facilities, rising demand for consumer electronics products, and continuous upgradation and improved efficiency of fab facilities are the key factors driving the growth of the SOI market in APAC.
The key factors restraining the growth of the SOI market are the lack of available IP ecosystem and the floating body effect. The floating body effect is one of the major drawbacks of the SOI devices. It is the dependence of body potential on the history of biasing.
The worldwide market for Silicon-on-Insulator (SOI) is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx million US$ in 2024, from xx million US$ in 2019, according to a new GIR (Global Info Research) study.
This report focuses on the Silicon-on-Insulator (SOI) in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
Market Segment by Manufacturers, this report covers
- Soitec SA
- Shin-Etsu Chemical
- SunEdison
Market Segment by Regions, regional analysis covers
- North America (United States, Canada and Mexico)
- Europe (Germany, France, UK, Russia and Italy)
- Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
- South America (Brazil, Argentina, Colombia etc.)
- Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
- 300 mm SOI
- Small Diameters
Market Segment by Applications, can be divided into
- Automobile and Smart Industry
- Consumer Electronic
- Other
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Silicon-on-Insulator (SOI) product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Silicon-on-Insulator (SOI), with price, sales, revenue and global market share of Silicon-on-Insulator (SOI) in 2017 and 2018.
Chapter 3, the Silicon-on-Insulator (SOI) competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Silicon-on-Insulator (SOI) breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2014 to 2019.
Chapter 5, 6, 7, 8 and 9, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2014 to 2019.
Chapter 10 and 11, to segment the sales by type and application, with sales market share and growth rate by type, application, from 2014 to 2019.
Chapter 12, Silicon-on-Insulator (SOI) market forecast, by regions, type and application, with sales and revenue, from 2019 to 2024.
Chapter 13, 14 and 15, to describe Silicon-on-Insulator (SOI) sales channel, distributors, customers, research findings and conclusion, appendix and data source.