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Lamination is a technique wherein the material is permanently assembled by heating, pressuring, welding, or by use of adhesives. This technique improves the properties of a material such as strength, durability, appearance, stability, and others. Printed circuit board (PCB) laminate involves lamination of a circuit with a non-conductive material. PCB laminates connect and support the electronic components using pads, conductive tracks, and other features etched from copper sheets laminated onto a non-conductive substrate. PCB laminations are widely used in one copper layer PCB, two copper layer PCB, or outer & inner layer PCB.
Scope of the Report:
This report focuses on the Printed Circuit Board Laminate in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
The worldwide market for Printed Circuit Board Laminate is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx million US$ in 2023, from xx million US$ in 2017, according to a new GIR (Global Info Research) study.
Market Segment by Manufacturers, this report covers
- Unimicron Technology Corp.
- Nippon Mektron
- Samsung Electro-Mechanics
- Zhen Ding Technology Holding Limited
- Young Poong Electronics Co., Ltd.
- Daeduck Electronics Co., Ltd.
- Ibiden Co., Ltd.
- Tripod Technology Corporation
- TTM Technologies, Inc.
- Austria Technologie & Systemtechnik AG
Market Segment by Regions, regional analysis covers
- North America (United States, Canada and Mexico)
- Europe (Germany, France, UK, Russia and Italy)
- Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
- South America (Brazil, Argentina, Colombia etc.)
- Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
Market Segment by Applications, can be divided into
- Industrial Electronics
- Consumer Electronics
- Aerospace & Defense
There are 15 Chapters to deeply display the global Printed Circuit Board Laminate market.
Chapter 1, to describe Printed Circuit Board Laminate Introduction, product scope, market overview, market opportunities, market risk, market driving force;
Chapter 2, to analyze the top manufacturers of Printed Circuit Board Laminate, with sales, revenue, and price of Printed Circuit Board Laminate, in 2016 and 2017;
Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2016 and 2017;
Chapter 4, to show the global market by regions, with sales, revenue and market share of Printed Circuit Board Laminate, for each region, from 2013 to 2018;
Chapter 5, 6, 7, 8 and 9, to analyze the market by countries, by type, by application and by manufacturers, with sales, revenue and market share by key countries in these regions;
Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2013 to 2018;
Chapter 12, Printed Circuit Board Laminate market forecast, by regions, type and application, with sales and revenue, from 2018 to 2023;
Chapter 13, 14 and 15, to describe Printed Circuit Board Laminate sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source