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Back End of Line Semi-Conductor Equipment is the second part of semiconductor devices where single devices such as capacitors, transistors and resistors, among others are interconnected by wires on wafer which are made by pure silicon and metal layers to form required electrical circuits. Common metal that forms layers are aluminum interconnect and copper interconnect. Back end of the line in semiconductor equipments is started when the wafer gets deposited by the first layer of metal. Back end of line consists of metal levels, insulating layers (dielectrics), and bonding sites for chip to package connections. In back end of the line the formation of interconnect wires, contacts (pads), and dielectric structures takes place. Ten metal layers or more are added in back end of the line stage in semiconductor electronics. Steps of back end of line includes silicidation of the polysilicon region, drain regions and source, addition of dielectric and its processing, making holes in PMD in order to make contacts in them, adding the first metal layer, addition of second dielectric, connection of lower metal with higher metal by making vias through dielectric and passivation layer addition in order to protect the micro chip.
Scope of the Report:
This report focuses on the Back End of the Line Semiconductor Equipment in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
This market research analysis identifies the miniaturization of electronic devices as one of the primary growth factors for this market. The recent years have seen an increasing demand for compact electronic devices from several sectors such as communication, automotive, industrial manufacturing, and healthcare. This has induced the semiconductor manufacturers to invest in their R&D to reduce the size and increase the performance of ICs, which, in turn, has led to the emergence of micro-electro-mechanical systems (MEMS) and 3D chip packaging. Also, the increasing number of interconnects and transistors in the existing space on the ICs requires finer deposition, which in turn, will create the demand for BEOL semiconductor equipment. In addition, increasing technological functionalities in mobile devices is a major driver driving the global back end of the line semiconductor equipments market. Asia Pacific is expected to dominate the market share of the back end of the line semiconductor equipment global market.
The worldwide market for Back End of the Line Semiconductor Equipment is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx million US$ in 2023, from xx million US$ in 2017, according to a new GIR (Global Info Research) study.
Market Segment by Manufacturers, this report covers
- Applied Materials
- ASML
- KLA-Tencor
- Tokyo Electron Limited (TEL)
Market Segment by Regions, regional analysis covers
- North America (United States, Canada and Mexico)
- Europe (Germany, France, UK, Russia and Italy)
- Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
- South America (Brazil, Argentina, Colombia etc.)
- Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
- CVD
- CMP
- Coater Developer
- PVD
- Metal Etching
- Stepper
- Wet Station
Market Segment by Applications, can be divided into
- Foundry
- Memory
- IDM
There are 15 Chapters to deeply display the global Back End of the Line Semiconductor Equipment market.
Chapter 1, to describe Back End of the Line Semiconductor Equipment Introduction, product scope, market overview, market opportunities, market risk, market driving force;
Chapter 2, to analyze the top manufacturers of Back End of the Line Semiconductor Equipment, with sales, revenue, and price of Back End of the Line Semiconductor Equipment, in 2016 and 2017;
Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2016 and 2017;
Chapter 4, to show the global market by regions, with sales, revenue and market share of Back End of the Line Semiconductor Equipment, for each region, from 2013 to 2018;
Chapter 5, 6, 7, 8 and 9, to analyze the market by countries, by type, by application and by manufacturers, with sales, revenue and market share by key countries in these regions;
Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2013 to 2018;
Chapter 12, Back End of the Line Semiconductor Equipment market forecast, by regions, type and application, with sales and revenue, from 2018 to 2023;
Chapter 13, 14 and 15, to describe Back End of the Line Semiconductor Equipment sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source