For a long time, the cure for diabetes type 1 and type 2 has relied on agonizing insulin shots for patients or insulin infusion via mechanical pumps. Regarding this, experts have been creating artificial pancreatic beta cells with the he…
IC packaging (a.k.a. IC assembly) is one of the essential processes and technologies in IC manufacture, connecting the bare die to the PCB. In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encased in a supporting case that prevents physical damage and corrosion.
Scope of the Report:
This report focuses on the IC Packaging in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
This industry is affected by the economy and policy, so it's important to put an eye to economic indexes and leaders' prefer. With the global economic recovery, more and more people pay attention to rising environment standards, especially in underdevelopment regions that have a large population and fast economic growth, the need will increase.
The industry is a high-technology and high-profit industry, the research team maintain a very optimistic attitude. It is suggested that the new enterprises to enter the field.
We tend to believe this industry now is close to mature, and the consumption increasing degree will show a smooth curve. On product prices, the slow downward trend in recent years will maintain in the future, as competition intensifies, prices gap between different brands will go narrowing. Similarly, there will be fluctuation in gross margin.
The worldwide market for IC Packaging is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx million US$ in 2023, from xx million US$ in 2017, according to a new GIR (Global Info Research) study.
Market Segment by Manufacturers, this report covers
- STATS ChipPac
- Powertech Technology
Market Segment by Regions, regional analysis covers
- North America (United States, Canada and Mexico)
- Europe (Germany, France, UK, Russia and Italy)
- Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
- South America (Brazil, Argentina, Colombia etc.)
- Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
Market Segment by Applications, can be divided into
There are 15 Chapters to deeply display the global IC Packaging market.
Chapter 1, to describe IC Packaging Introduction, product scope, market overview, market opportunities, market risk, market driving force;
Chapter 2, to analyze the top manufacturers of IC Packaging, with sales, revenue, and price of IC Packaging, in 2016 and 2017;
Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2016 and 2017;
Chapter 4, to show the global market by regions, with sales, revenue and market share of IC Packaging, for each region, from 2013 to 2018;
Chapter 5, 6, 7, 8 and 9, to analyze the market by countries, by type, by application and by manufacturers, with sales, revenue and market share by key countries in these regions;
Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2013 to 2018;
Chapter 12, IC Packaging market forecast, by regions, type and application, with sales and revenue, from 2018 to 2023;
Chapter 13, 14 and 15, to describe IC Packaging sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source