For a long time, the cure for diabetes type 1 and type 2 has relied on agonizing insulin shots for patients or insulin infusion via mechanical pumps. Regarding this, experts have been creating artificial pancreatic beta cells with the he…
A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature at optimal levels. In computers, heat sinks are used to cool central processing units or graphics processors. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature.
Scope of the Report:
In the coming years there is an increasing demand for Heat Sinks in the regions of North America, Europe and Asia.
In the past few years from 2013-2017, the global production and consumption developed stably. The global Heat Sinks market size in terms of production is projected to grow to 2447 M Pcs by 2025. At the same time, China is remarkable in the global Heat Sinks industry because of their market share and technology status of Heat Sinks. Other developing countries/region such as India and Southeast Asia grow at a good pace owing to large population and high economic growth rate, and they will play important role in the future.
In the future, the production and consumption is estimated to continue developing with a stable growth rate. To meet the large and increasing demand, more and more manufacturers will go into this industry.
The worldwide market for Heat Sinks is expected to grow at a CAGR of roughly 4.4% over the next five years, will reach 15400 million US$ in 2024, from 11900 million US$ in 2019, according to a new GIR (Global Info Research) study.
This report focuses on the Heat Sinks in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
Market Segment by Manufacturers, this report covers
- TE Connectivity
- Aavid Thermalloy
- Advanced Thermal Solutions
- Apex Microtechnology
- T-Global Technology
Market Segment by Regions, regional analysis covers
- North America (United States, Canada and Mexico)
- Europe (Germany, France, UK, Russia and Italy)
- Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
- South America (Brazil, Argentina, Colombia etc.)
- Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
- Aluminum Heat Sink
- Copper Heat Sink
- Copper Aluminum Heat Sink
Market Segment by Applications, can be divided into
- Automobile Industry
- Electronic Industry
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Heat Sinks product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Heat Sinks, with price, sales, revenue and global market share of Heat Sinks in 2017 and 2018.
Chapter 3, the Heat Sinks competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Heat Sinks breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2014 to 2019.
Chapter 5, 6, 7, 8 and 9, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2014 to 2019.
Chapter 10 and 11, to segment the sales by type and application, with sales market share and growth rate by type, application, from 2014 to 2019.
Chapter 12, Heat Sinks market forecast, by regions, type and application, with sales and revenue, from 2019 to 2024.
Chapter 13, 14 and 15, to describe Heat Sinks sales channel, distributors, customers, research findings and conclusion, appendix and data source.