For a long time, the cure for diabetes type 1 and type 2 has relied on agonizing insulin shots for patients or insulin infusion via mechanical pumps. Regarding this, experts have been creating artificial pancreatic beta cells with the he…
ICs manufactured in the global semiconductor industry are delicate, and thus vulnerable to contamination causing malfunction. To prevent from such malfunctions, silicon chips or ICs are protected using packaging materials.
Scope of the Report:
This report focuses on the Die-level Packaging Equipment in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
Wafer-level packaging and die-level packaging are the most predominant packaging types. Wafer-level packaging involves the packaging of individual ICs through the best-fit packaging processes conducted in wafer-level manufacturing during the semiconductor production process, while die-level packaging involves packaging of each dice and not the wafer as a whole.
The worldwide market for Die-level Packaging Equipment is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx million US$ in 2023, from xx million US$ in 2017, according to a new GIR (Global Info Research) study.
Market Segment by Manufacturers, this report covers
- ASM International
- BE Semiconductor Industries
- Kulicke & Soffa Industries
- Hitachi High-Technologies
Market Segment by Regions, regional analysis covers
- North America (United States, Canada and Mexico)
- Europe (Germany, France, UK, Russia and Italy)
- Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
- South America (Brazil, Argentina, Colombia etc.)
- Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
- Wafer-level packaging
- Die-level packaging
Market Segment by Applications, can be divided into
- Solder Paste
- Automated Component Pick and Place
- Flux Cleaning
There are 15 Chapters to deeply display the global Die-level Packaging Equipment market.
Chapter 1, to describe Die-level Packaging Equipment Introduction, product scope, market overview, market opportunities, market risk, market driving force;
Chapter 2, to analyze the top manufacturers of Die-level Packaging Equipment, with sales, revenue, and price of Die-level Packaging Equipment, in 2016 and 2017;
Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2016 and 2017;
Chapter 4, to show the global market by regions, with sales, revenue and market share of Die-level Packaging Equipment, for each region, from 2013 to 2018;
Chapter 5, 6, 7, 8 and 9, to analyze the market by countries, by type, by application and by manufacturers, with sales, revenue and market share by key countries in these regions;
Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2013 to 2018;
Chapter 12, Die-level Packaging Equipment market forecast, by regions, type and application, with sales and revenue, from 2018 to 2023;
Chapter 13, 14 and 15, to describe Die-level Packaging Equipment sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source