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3D semiconductor packaging refers to an advanced packaging technology of semiconductor chips in which two or more layers of active electronic components are stacked together and interconnected vertically as well as horizontally to perform as a single device. This technology possesses various advantages over other advanced packaging technologies such as reduced space consumption, decreased power loss, better overall performance, and enhanced efficiency which makes 3D semiconductor packaging industry the leading amongst all advanced packaging technologies.
Scope of the Report:
This report focuses on the 3D Semiconductor Packaging in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
Global 3D semiconductor packaging market size is estimated to reach $8.9 billion by 2022, growing at a CAGR of 15.7 % from 2016 to 2022.
The worldwide market for 3D Semiconductor Packaging is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx million US$ in 2023, from xx million US$ in 2017, according to a new GIR (Global Info Research) study.
Market Segment by Manufacturers, this report covers
- Amkor Technology
- ASE Group
- Siliconware Precision Industries
- Jiangsu Changjiang Electronics Technology
- SÜSS MicroTec
- International Business Machines Corporation (IBM)
- Intel Corporation
- Qualcomm Technologies
- Taiwan Semiconductor Manufacturing Company
- SAMSUNG Electronics
- Advanced Micro Devices
Market Segment by Regions, regional analysis covers
- North America (United States, Canada and Mexico)
- Europe (Germany, France, UK, Russia and Italy)
- Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
- South America (Brazil, Argentina, Colombia etc.)
- Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
- 3D Wire Bonded
- 3D Through Silicon Via
- 3D Package on Package
- 3D Fan Out Based
Market Segment by Applications, can be divided into
- Consumer Electronics
There are 15 Chapters to deeply display the global 3D Semiconductor Packaging market.
Chapter 1, to describe 3D Semiconductor Packaging Introduction, product scope, market overview, market opportunities, market risk, market driving force;
Chapter 2, to analyze the top manufacturers of 3D Semiconductor Packaging, with sales, revenue, and price of 3D Semiconductor Packaging, in 2016 and 2017;
Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2016 and 2017;
Chapter 4, to show the global market by regions, with sales, revenue and market share of 3D Semiconductor Packaging, for each region, from 2013 to 2018;
Chapter 5, 6, 7, 8 and 9, to analyze the market by countries, by type, by application and by manufacturers, with sales, revenue and market share by key countries in these regions;
Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2013 to 2018;
Chapter 12, 3D Semiconductor Packaging market forecast, by regions, type and application, with sales and revenue, from 2018 to 2023;
Chapter 13, 14 and 15, to describe 3D Semiconductor Packaging sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source