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3D IC is a single chip in which all components onthe layers communicate using on-chip signaling, whethervertically or horizontally.
Scope of the Report:
This report focuses on the 3D Ics in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
There are four ways to built 3D ICs :- 1. Monolithic 2. Wafer on wafer 3. Die on wafer 4. Die on die
3D integration can reduce the wiring, thereby reducing the capacitances, power dissipation and chip area improves performance.
The worldwide market for 3D Ics is expected to grow at a CAGR of roughly 15.9% over the next five years, will reach 7340 million US$ in 2023, from 3030 million US$ in 2017, according to a new GIR (Global Info Research) study.
Market Segment by Manufacturers, this report covers
- Taiwan Semiconductor Manufacturing Company
- The 3M Company
- Tezzaron Semiconductor Corporation
- STATS ChipPAC
- United Microelectronics Corporation
- MonolithIC 3D
- Elpida Memory
Market Segment by Regions, regional analysis covers
- North America (United States, Canada and Mexico)
- Europe (Germany, France, UK, Russia and Italy)
- Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
- South America (Brazil, Argentina, Colombia etc.)
- Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
- Beam re-crystallization
- Wafer bonding
- Silicon epitaxial growth
- Solid phase crystallization
Market Segment by Applications, can be divided into
- Consumer electronics
- Information and communication technology
- Transport (automotive and aerospace)
- Others(Biomedical applications and R&D)
There are 15 Chapters to deeply display the global 3D Ics market.
Chapter 1, to describe 3D Ics Introduction, product scope, market overview, market opportunities, market risk, market driving force;
Chapter 2, to analyze the top manufacturers of 3D Ics, with sales, revenue, and price of 3D Ics, in 2016 and 2017;
Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2016 and 2017;
Chapter 4, to show the global market by regions, with sales, revenue and market share of 3D Ics, for each region, from 2013 to 2018;
Chapter 5, 6, 7, 8 and 9, to analyze the market by countries, by type, by application and by manufacturers, with sales, revenue and market share by key countries in these regions;
Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2013 to 2018;
Chapter 12, 3D Ics market forecast, by regions, type and application, with sales and revenue, from 2018 to 2023;
Chapter 13, 14 and 15, to describe 3D Ics sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source